• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.181-184
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• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STI) structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters, we studied the correlation between CMP thickness of STI using high selectivity slurry, DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased, the N-poly foot is deteriorated, and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by 100 ${\AA}$, 3.2 u${\AA}$ of IDSN is getting better in base 1 condition. In POE 50% condition, 1.7 u${\AA}$ is improved, and 0.7 u${\AA}$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.181-184
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• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STD structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters. we studied the correlation between CMP thickness of STI using high selectivity slurry. DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased. the N-poly foot is deteriorated. and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point,, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by $100\AA$. 3.2 $u\AA$ of IDSN is getting better in base 1 condition. In POE 50% condition. 1.7 $u\AA$ is improved. and 0.7 $u\AA$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• 한국전자통신학회논문지
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• 제17권6호
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• pp.1175-1180
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• 2022

STI는 반도체 소자의 소형화 및 고집적화에 따른 광역 평탄화를 위한 공정 기술로써 많은 연구가 이루어져 왔다. 본 연구에서는 STI의 profile 개선을 위한 방법으로 STI 건식각 후 HF 용액에 의한 pad oxide 습식각과 O₂+CF₄ 건식각을 제안하였다. 이 공정 기술은 기존의 방법보다 소자의 밀집도에 따른 패턴간의 프로파일 불균형과 누설전류의 개선을 나타내었다. 또한 동일한 STI 깊이와 HLD 증착를 갖는 디바이스에 대하여 CMP 후 HLD 두께를 측정한 결과 디바이스 밀도에 따라 측정값이 다르게 나타났고 이는 CMP 후 디바이스 밀도에 따른 질화막의 두께 차이 및 슬러리의 선택비에 기인됨을 확인하였다.

• 기술혁신학회지
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• 제22권2호
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• pp.186-206
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• 2019

한국의 공적개발원조(ODA) 규모는 매년 꾸준히 증가하고 있지만 ODA 사업의 수행 방법과 효과성에 대한 비판은 계속 제기되고 있다. 과학기술 분야도 ODA 규모는 늘어나는 추세이지만 여러 문제점이 있는 것으로 보인다. 첫째, 국내외적으로 과학기술 ODA에 대한 정의가 명확하게 확립되어 있지 않고 학문적 논의도 미흡한 편이다. 둘째, 과학기술 ODA 사업의 성과에 대한 분석도 미흡한 것으로 보인다. 셋째, 과학기술 ODA 사업을 체계적으로 수행할 수 있는 기획 관리 역량이 전반적으로 부족하다. 본 논문에서는 과학기술 정책 자문 사업을 대상으로 하여 과학기술 ODA 사업의 성과에 영향을 미치는 요인들을 분석하였다. 그 결과, 과학기술 지식을 이전하는 이전역량뿐만 아니라 이를 흡수 활용하는 흡수역량이 중요함을 발견하였다. 이런 점에서 보면, 과학기술정책 자문 사업이 성공하기 위해서는 우리의 이전역량과 상대 개도국의 흡수역량을 동시에 고려하여 사업을 기획, 관리하는 체제가 요구된다.

• Journal of Mechanical Science and Technology
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• 제14권7호
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• pp.730-736
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• 2000

In this paper, several tire models (Magic formula, Carpet plot, VA tire, DADS tire and STI tire) are implemented and compared. Since the STI (System Technology Inc.) tire model in the AutoDyn7 program is in a good agreement to NADSdyna STI tire model and experiment, it is selected as a reference tire model for the comparison. To compare tire models, input parameters of each tire model are extracted from the STI tire model to preserve the same tire properties. Several simulations are carried out to compare performances of tire models, i. e., bump simulation, lane change simulation, and pulse steering simulation. The performances in vehicle maneuverability are also compared with the four parameter evaluation method.

• 동력기계공학회지
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• 제7권3호
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• pp.61-68
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• 2003

Steering characteristics is an important factor in the evaluation of vehicle quality. To estimate steering characteristics in the vehicle conceptual design stage, vehicle dynamics simulation methods are very efficient. However, it is often difficult to simulate vehicle dynamics for the specific driving scenarios in open-loop driving environment. An efficient driver-in-the-loop vehicle model will be efficient for this job. A good tire model is also very important for the accurate vehicle dynamics simulation. In this research, a driver model is used to simulate vehicle steering dynamics for a 8-dof vehicle model with STI(Systems Technology, Inc.) tire model. For the demonstration of this model, a SUV(sports utility vehicle) and a sedan were simulated.

• 한국융합학회논문지
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• 제8권5호
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• pp.53-60
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• 2017

본 연구는 청소년에게 적용 가능한 성매개 감염병 지식 측정도구를 개발하기 위해 시행되었다. 문헌고찰을 바탕으로 40문항의 예비문항을 작성하고, 내용타당도 검증 및 예비조사과정을 거쳐 29문항의 예비도구를 개발하였다. 2016년 2월 13일부터 26일까지 청소년 141명을 대상으로 자료를 수집하여 예비도구의 타당도와 신뢰도 검증을 실시하였다. 타당도검증을 위한 요인분석결과 요인의 적재값은 .52이상의 값을 보였으며, 수렴타당도 평가결과 성매개 감염병 교육경험이 있는 집단의 지식정도가 유의하게 높았다(p=.009). 최종 확정된 16문항의 신뢰도는 Chronbach's ${\alpha}=.85$ 였으며 평균 정답률은 39.3%로 나타났다. 본 연구에서 개발된 도구는 향후 청소년의 성매개 감염병 교육효과를 평가하는데 유용하게 사용될 수 있을 것이다.

• 산업공학
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• 제17권4호
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• pp.440-449
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• 2004

The OERA(Offensive Earned-Run Average) is a methodology for the performance evaluation of baseball players, which is based on a well- known Markov chain model. The DEA(Data Envelopment Analysis) is an LP-based evaluation technique for performance analysis of DMUs (Decision Making Units), whose production activities are characterized by multiple inputs and outputs. In this paper, the performances of Korean professional baseball players are analytically evaluated using both OERA and DEA methods. We discuss methodological strengths and drawbacks of two kinds of baseball evaluation techniques, by comparing both results. Finally to overcome the shortcomings of both methods, we develop a new analytical approach for baseball evaluation by combining OERA with DEA.

• 정보와 통신
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• 제12권8호
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• pp.53-64
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• 1995

이 글에서는 국내의 PCS 표준 방식을 결정하기 위한 판단 기준과 여러 가지 고려 사항을 제시하고 이러한 기준에 의한 평가 결과 upbanded IS-95가 가장 적절한 방식임을 설명하였다. 그리고 CDMA 방식의 신규 셀룰라 사업자인 신세기 통신이 upbanded IS-95 방식의 PCS사업을 하기에 가장 적합한 사업자임을 논하였다. 그 다음 신세기 통신의 PCS 연구개발 추진 방안과 전략을 설명하였다. PCS 시스템 개발을 위해 국내제조업체와 추진하고 있는 공동개발에 관련한 사항을 기술하였다. 그리고 향후의 연구개발 추진 계획을 주요 항목별로 설명하였다. 지금까지 신세기통신이 추진해왔던 연구개발의 내용과 성과를 설명하고 그 중에서 PCS 망구성과 향후 제공하게 될 음성서비스, 부가서비스 및 무선 데이터서비스에 대한 사항을 설명하였다.

• STI Policy Review
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• 제4권2호
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• pp.55-73
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• 2013

Since the 1990s, the Japanese government has made considerable attempts at stimulating innovation with an aim to pull the country out of a possibly permanent economic decline. Several laws and policy initiatives were introduced to encourage better interaction between universities (and research institutions) and industry. The results of these efforts have been mixed. While the number of university-industry joint and commissioned research has increased, revenues from the licensing of university-owned patents have fluctuated year by year. Although the number of startups and spin-offs from universities rose, their long-term survival and contribution to the economy remain uncertain. The Japanese experience features both strengths and weaknesses. Strengths include the long-term commitment of policy makers, the ability to set specific targets, and the active engagement of several key economic ministries. Nevertheless, the effectiveness of these policy initiatives was hampered by limitations within the policies concerning the roles of universities and their mode of interaction with industry based on intellectual property rights, the inadequacy of demand-side innovation policies, the fragmentation of bureaucracy, and a lack of a credible evaluation system.