• Journal of the Korea Society of Computer and Information
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• v.16 no.8
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• pp.77-84
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• 2011

In this paper we implement a 6LoWPAN protocol on the MICAz sensor platform, which could minimize packet re-transmission, and support security primitives for packet integrity and confidentiality. And we also present a performance evaluation of the implemented protocol calculated according to the cryptographic algorithms. In the re-transmission method, time stamp, nonce, and checksum are considered to protect replay attacks. As cryptographic algorithms, AES, 3DES, SHA2, and SHA1 are implemented. If transmission errors (thus, packet losses) and the number of hops are increase then, packet re-transmissions are increase exponentially from the experimental results. Also, the result shows that cryptographic operations take more time than packet re-transmission time.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.473-473
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• 2011

In recent years, organic thin film transistors OTFTs based on conductive-conjugated molecules have received significant attention. We report a fabrication of organic single crystal nanowires that made on Si substrates by liquid bridge-mediated nanotransfer molding (LB-nTM) with polyurethane acrylate (PUA) mold. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid bridge between them. In liquid bridge-transfer process, the liquid layer serves as an adhesion layer to provide good conformal contact and form covalent bonding between the organic single crystal nanowire and the Si substrate. Pentacene is the most promising organic semiconductors. However pentacene has insolubility in organic solvents so pentacene OTFTs can be achieved with vacuum evaporation system. However 6, 13-bis (triisopropylsilylethynyl) (TIPS) pentacene has high solubility in organic solvent that reported by Anthony et al. Furthermore, the substituted rings in TIPS-pentacene interrupt the herringbone packing, which leads to cofacial ${\pi}-{\pi}$ stacking. The patterned TIPS-Pentacene single crystal nanowires have been investigated by Atomic force microscopy (AFM), Transmission Electron Microscopy (TEM), X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM) and electrical properties.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1994.06a
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• pp.147-162
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• 1994

Generally, the forming process of sheet metal is very complex and difficult process because of many variables such as tool geometry, material properties and lubrication. In this view point, the numerical analysis of sheet metal forming process is very difficult. High speed computer is used to model complex sheet metal forming process on a reasonable time scale. The design and development of sheet metal parts in the automotive industry and the need for improved sheet forming process and reduced part development cost have led to the use of computer simulation in tool/die design of sheet metal pressing. HMC(Hyundai Mator Company) has invested to develop programs for analysis of sheet metal forming process with connection of Universities. As a result, several programs were developed. Recently, the commercial software, PAM-STAMP of ESI was installed and is being tried to application of it to the real automotive panels. This article reviews the ongoing activities on development and application of analytical modeling of sheet metal forming at HMC.

• Transactions of Materials Processing
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• v.20 no.5
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• pp.377-386
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• 2011

During stamping processes, the air trapped between sheet metal and the die cavity can be highly compressed and ultimately reduce the shape accuracy of formed panels. To prevent this problem, vent holes and passages are sometimes drilled into the based on expert experience and know-how. CAE can be also used for analyzing the air behavior in die cavity during stamping process, incorporating both elasto-plastic behavior of sheet metal and the fluid dynamic behavior of air. This study presents sheet metal forming simulation combined simultaneously with simulation of air behavior in the die cavity. There are three approaches in modeling of air behavior. One is a simple assumption of the bulk modulus having a constant pressure depending on volume change. The next is the use of the ideal gas law having uniform pressure and temperature in air domain. The third is FPM (Finite point method) having non-uniform pressure in air domain. This approach enables direct coupling of mechanical behavior of solid sheet metal and the fluid behavior of air in sheet metal forming simulation, and its result provides the first-hand idea for the location, size and number of the vent holes. In this study, commercial software, PAM-$STAMP^{TM}$ and PAM-$SAFE^{TM}$, were used.

• Journal of the Ergonomics Society of Korea
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• v.35 no.3
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• pp.143-153
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• 2016

Objective: The purposes of this study are to survey needs for changing accident investigation from blaming to systems approach and to briefly summarize systems-based accident analysis techniques. Background: In modern complex socio-technical systems, accidents are caused by a variety of contributing factors including human, technical, organizational, social factors, not by just a single violation or error of a specific actor, but accidents investigation used to be focused on the incorrect action of individuals. A new approach investigating causes of accidents as a symptom of a deficient system is required. Method: This study was mainly based on survey of literatures related to accidents, accidents investigation, which included academic journals, newspapers, etc. Results: This study showed that accidents investigation of Korea focusing on blaming is problematic. This was confirmed by two concepts of migration and hindsight bias frequently found in accident causation studies, and an attribute of accidents having varying causes. This was illustrated with an example of Sewol ferry capsizing accident. Representative systems-based accident analysis models including Swiss cheese model, AcciMap, HFACS, FRAM and STAMP were briefly introduced, which can be used in systematic accidents investigations. Finally, this study proposed a procedure for establishing preventive measures of accidents, which was composed of two steps: public inquiry and devising preventive measures. Conclusion: A new approach considering how safety-critical components such as technical and social elements, and their interactions lead to accidents is needed for preventing reoccurrence of similar accidents in complex socio-technical systems. Application: The results would be used as a reference or guideline when the safety relevant governmental organizations investigate accidents.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.19-24
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• 2001

The lead frame, which is principal material used in semiconductor packaging, is required to be microscopic in leads and pitches to cope with miniaturization, thin film, large scale integrated. In addition, it is indispensable to eliminate residual stress and burrs occurring at manufacturing lead frames This thesis applied electrolytic abrasion in order to remove burrs and residual stress created during the stamp process. Electrolytic abrasion removed the burrs on the surface of lead frame. Removal of residual stress highly depends on the types of electrolyte solution. In case of perchloric system, electrolytic abrasion removed 23% of residual stress. Through removal of burrs and reducing residual stress, the reliability of lead frame was substantially improved.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.189-192
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• 2016

Gift card certificate law was abolished in February 1999. If the stamp duty is paid gift certificate can be issued without registration or authorization by everyone. Recently, the use of mobile devices and mobile apps became widespread as explosive increase in mobile card market. Due to the advantage of being easily available this gift, Including foods such as cakes and coffee are released in various fields, such as mobile vouchers surrogate operation, matchmaking services. The future of the voucher market is considered to be reorganized into mobile gift certificate from vouchers of paper.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.910-913
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• 2009

This paper examines attaching speed, detaching speed and contact time which affected in the ink transfer ratio and presents the best conditions for fabrication process of electrodes with Ag-ink using microcontact printing method. In conclusion, it shows the best printing characteristic by two conditions. One of condition is the attaching speed have to within less than 1mm/s and the detaching speed is high velocity as 1000mm/s and the contact time is taken about the minimum time when inking process. Another condition is the attaching speed have to within more than 100mm/s and the detaching speed have to within less than 1mm/s and the contact time is longer than 30second when the printing process. As using these condition and the stamp sized 5cm${\times}$5cm, it was possible for printing equally until $30{\mu}m$ of width. The printed thickness of a electrode was about 300 to 500 nm, the surface roughness was about dozens nm under 50 nm.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1600-1603
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• 2009

In this work, we have fabricated inverted staggered ZnO TFTs with 1-${\mu}m$ resolution channel length by micro contact printing (${\mu}$-CP) method. Patterning of micro scale source/drain electrodes without etching is successfully achieved by micro contact printing method by using silver ink and polydimethylsiloxane (PDMS) stamp. And the time dependent characteristics of the sheet resistance show that Ag inklayer could be used as source and drain electrodes for ZnO TFTs.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.5
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• pp.223-230
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• 2006

The reliability of imprint patterns molded by stamps for industrial application of nanoimprint lithography (NIL), is an important issue. Usually, defects can be produced by incomplete filling of negative patterns and the shrinkage phenomenon of polymers in conventional NIL. In this paper, the patterns that undergo a varied temperature or varied pressure period during the thermal NIL process have been investigated, with the goal of resolving the shrinkage and defective filling problems of polymers. The effects on the formation of polymer patterns in several profiles of imprint processes are also studied. Consequently, it is observed that more precise patterns are formed by the varied temperature (VT-NIL) or varied pressure (VP-NIL). The NIL (VT-NIL or VP-NIL) process has a free space compensation effect on the polymers in stamp cavities. From the results of the experiments, the polymer's filling capability can be improved. The VT-NIL is merged with the VP-NIL for the better filling property. The patterns that have been imprinted in the merged NIL are compared with the results of conventional NIL. In this study, the improvement in the reliability for results of thermal NIL has been achieved.