• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1081-1084
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• 2007

System on Panel (SOP) can integrate many functions by Thin Film Transistor (TFT) circuits on an insulator substrate without using external driver LSIs. However, to make practical SOP has become more and more difficult because of rapid cost reduction of the driver LSIs. This paper will review the circuit design technology trend for SOP and introduce an example of a practical SOP, 2.0inch QVGA full color active matrix OLED with 8bit source driver.

• Proceedings of the Korea Information Processing Society Conference
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• 2009.04a
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• pp.466-468
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• 2009

국가과학기술종합정보서비스(NTIS: National Science & Technology Information Service)는 국가R&D 사업정보를 한 곳에서 서비스하는 국가R&D 지식포털이다. NTIS의 효율적 기획 및 업무운영 총괄을 위하여 NTIS 표준운영절차(SOP: Standard Operating Procedures) 수립의 필요성이 증대되었다. 본 연구에서는 본 연구에서는 선진이론 모델 및 국내사례를 분석하고, NTIS 구축에 참여한 내부의 환경적 요건과 운용체계 요구사항을 고려하여, NTIS 운용체계에 가장 실무적으로 적합한 NTIS SOP를 수립하였다. 이와 더불어 NTIS 운영주체간 NTIS SOP 정보의 효율적 공유를 위하여 NTIS SOP 공유시스템을 구축함으로써, 업무별 권한별로 NTIS SOP를 공유하고 활용할 수 있도록 하였다.

• Journal of Digital Contents Society
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• v.8 no.1
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• pp.41-50
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• 2007

People access web contain via PC and many other devices. In other words, not only they access information by a PC connected internet, but also they get information through a mobile phone, a PDA even D-TV. In this article, to resolve the problem, we suppose new web caching mechanism called 'SOP(Shared Object Page)'based on applying of meta data of web page information and storing adapted objects.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.7A
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• pp.563-568
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106${\mu}{\textrm}{m}$ thick LTCC layers and its size is 5.24mm x 4.3mm x 0.53 mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200MHz, insertion loss of 2.326dB and return loss of 13.679dB. In addition, the attenuation is 28.052dB at 4.7GHz.

• Composites Research
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• v.14 no.5
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• pp.46-53
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• 2001

In this research, damage behavior of singly oriented ply (SOP) fiber metal laminate (FML) subjected to concentrated load was studied. The static indentation tests were conducted to study fiber orientation effect on damage behavior of FML. During the static indentation tests, acoustic emission technique (AE) was adopted to study damage characteristics of FML. AE signals were obtained by using AE sensor with 150kHz resonance frequency and the signals were compared with indentation curves of FML. The damage process of SOP FML was divided by three parts, i.e., crack initiation, crack propagation, and penetration. The AE characteristics during crack initiation show that the micro crack is initiated at lower ply of the plate, then propagate along the thickness of the plate with creating tiber debonding. The crack grow along the fiber direction with occurring 60∼80dB AE signal. During the penetration, the fiber breakage was observed. As fiber orientation increases, talc fiber breakage occurs more frequently. The AE signal behaviors support these results. Cumulative AE counts could well predict crack initiation and crack propagation and AE amplitude were useful for the prediction of damage failure mode.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1587-1588
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• 2006

Tn this paper, PCB (Printed Circuit Board) embedded $BaTiO_3$ MIM capacitors were designed, fabricated, and characterized for low cost organic SOP applications by using 3-D EM simulator and low temperature processes. Size of electrodes and thickness of high dielectric films are optimized for improving the performance characteristics of the proposed embedded MIM capacitors at high frequency regime. The selected thicknesses of the $BaTiO_3$ film are $12{\mu}m$, $16{\mu}m$, and $20{\mu}m$. The fabricated MIM capacitor with dielectric constant of 30 and thickness of $12{\mu}m$ has capacitance density of $21.5p\;F/mm^2$ at 100MHz, maximum quality factor of 37.4 at 300 MHz, a quality factor of 30.9 at 1GHz, self resonant frequency of 5.4 GHz, respectively. The measured capacitances and quality factors are well matched with 3-D EM simulated ones. These embedded capacitors are promising for SOP based advanced electronic systems with various functionality, low cost, small size and volume.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.9 s.351
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• pp.64-68
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• 2006

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.407-412
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• 2001

In this research, damage behavior of singly oriented ply (SOP) fiber metal laminate (FML) subject to concentrated load was studied. The static indentation tests were conducted to study fiber orientation effect on damage behavior of FML. During the static indentation tests, Acoustic Emission technique (AE) was adopted to study damage characteristics of FML. AE signals were obtained by using AE sensor with 150kHz resonance frequency and the signals were compared with indentation curves of FML. As fiber orientation angle increases, the crack initiation load of SOP FML increases because the stiffness induced by fiber orientation is increased. The penetration load of SOP FML is influenced by the deformation tendency and boundary conditions. Cumulative AE counts were well predicted crack initiation and crack propagation and AE amplitude were useful for prediction of damage failure mode. During the matrix cracking, fiber debonding and fiber breakage, AE amplitude has $45{\sim}60dB,\;60{\sim}80dB\;and\;90{\sim}100dB$, respectively.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.256-259
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• 2003

In this paper, a design of multi-layered BPF(bandpass filter) using LTCC(Low Temperature Co-fired Ceramic) process by a lumped-elements is proposed for SOP(system-on-a-chip) of wireless communication systems. The proposed BPF improved a characteristic of rejection band to build an attenuation pole caused by structurally adjacent co-inductance and coupling. The simulation data shows a bandwidth of 90MHz from a center frequency of 2.4GHz, a return loss of 27dB, an insertion loss of 3.2dB, and an attenuation of at least 20dBc at $f_0{\pm}250MHz$. Simulations have used serenade circuit simulation and HFSS EM simulation.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1301-1302
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• 2006

In this paper, embedded spiral inductors are investigated into the PCB substrate for low cost RF SOP applications. The spiral inductors designed with geometrical variations were simulated, fabricated, measured, and characterized by using 3D EM simulator, 8 layered PCB standard process and HP 8510B network analyzer (or verifying their applicability. The fabricated embedded spiral inductor has inductance of 9.4 nH at 800MHz, maximum quality factor of 64.8 at 1.09GHz and self resonant frequency of 3.93GHz, respectively. As the measured inductances and quality factors are well matched with simulated ones. PCB embedded spiral inductors are promising for advanced electronic systems with various functionality, low cost, small size and volume.