• Title/Summary/Keyword: SMT inspection machines

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A Unified Approach to Path Planning of SMT Inspection Machines (SMT 검사기의 경로 계획을 위한 통합적 접근 방법)

  • 김화중;정진회;박태형
    • Journal of Institute of Control, Robotics and Systems
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    • v.10 no.8
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    • pp.711-717
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    • 2004
  • We propose a path planning method to improve the productivity of SMT (surface mount technology) inspection machines with an area camera. A unified method is newly proposed to determine the FOV clusters and camera sequence simultaneously. The proposed method is implemented by a hybrid genetic algorithm to increase the convergence speed. Comparative simulation results are then presented to verify the usefulness of the proposed algorithm.

A Clustering Algorithm for Path Planning of SMT Inspection Machines (SMT 검사기의 경로계획을 위한 클러스터링 알고리즘)

  • Kim, Hwa-Jung;Park, Tae-Hyoung
    • Journal of the Korean Institute of Intelligent Systems
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    • v.13 no.4
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    • pp.480-485
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    • 2003
  • We Propose a Path planning method to reduce the Inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

The Reduction Methods of Inspection Time for SMT Inspection Machines Using Clustering Algorithms (클러스터링 알고리즘을 이용한 SMT 검사기의 검사시간 단축 방법)

  • Kim, Hwa-Jung;Park, Tae-Hyoung
    • Proceedings of the KIEE Conference
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    • 2003.07d
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    • pp.2453-2455
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    • 2003
  • We propose a path planning method to reduce the inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

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Unified Approach to Path Planning Algorithm for SMT Inspection Machines Considering Inspection Delay Time (검사지연시간을 고려한 SMT 검사기의 통합적 경로 계획 알고리즘)

  • Lee, Chul-Hee;Park, Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.21 no.8
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    • pp.788-793
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    • 2015
  • This paper proposes a path planning algorithm to reduce the inspection time of AOI (Automatic Optical Inspection) machines for SMT (Surface Mount Technology) in-line system. Since the field-of-view of the camera attached at the machine is much less than the entire inspection region of board, the inspection region should be clustered to many groups. The image acquisition time depends on the number of groups, and camera moving time depends on the sequence of visiting the groups. The acquired image is processed while the camera moves to the next position, but it may be delayed if the group includes many components to be inspected. The inspection delay has influence on the overall job time of the machine. In this paper, we newly considers the inspection delay time for path planning of the inspection machine. The unified approach using genetic algorithm is applied to generates the groups and visiting sequence simultaneously. The chromosome, crossover operator, and mutation operator is proposed to develop the genetic algorithm. The experimental results are presented to verify the usefulness of the proposed method.

Defect Classification of Components for SMT Inspection Machines (SMT 검사기를 위한 불량유형의 자동 분류 방법)

  • Lee, Jae-Seol;Park, Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.21 no.10
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    • pp.982-987
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    • 2015
  • The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

Component Inspection Algorithm for Automatic Optical Inspection Machines in SMT Line (SMT라인의 자동광학검사기를 위한 부품검사 알고리즘)

  • Cho, Han-Jin;Park, Tae-Hyoung
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1758-1759
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    • 2007
  • 본 논문에서는 표면실장기판을 위한 자동 광학 검사 시스템에서 사용되는 데이터 산출방법에 대한 알고리즘을 제안 한다. 제안된 새로운 부품검사 알고리즘은 검사영역을 분할해 템플릿에서의 매칭률이 가장 높은 부분만을 세밀하게 재검사하는 방법을 사용하여 기존의 방법들보다 시간이 단축 될 뿐만 아니라 많은 양의 메모리를 필요로 하는 템플릿의 패턴들의 메모리 용량상의 문제점을 해결할 수 있다. 실험 결과를 제시하여 제안된 검사 알고리즘을 검증한다.

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A Path Planning Method for Automatic Optical Inspection Machines with Line Scan Camera (라인스캔 카메라 형 광학검사기틀 위한 경로계획 방법)

  • Chae, Ho-Byeong;Kim, Hwan-Yong;Park, Tae-Hyoung
    • Proceedings of the KIEE Conference
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    • 2007.10a
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    • pp.333-334
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    • 2007
  • We propose a path planning method to decrease a inspection lead time of line scan camera in SMT(surface mount technology) in-line system. The inspection window area of printed circuit board should be minimized to consider the FOV(field of view) of line scan camera so that line scan inspector is going to find a optimal solution of path planning. We propose one of the hierarchical clustrering algorithm for a given board. Comparative simulation results are presented to verify the usefulness of proposed method.

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