• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.32-39
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• 1998

Remez exchange algorithm was applied to realize an IF SAW filter for CDMA cellular phone systems. A SAW filter with withdrawal weighted transducers was simulated and then fabricated on 42.75.deg. ST-cut Quaritz wafer. Excellent agreement wasobtained between calculated andmeasured responses. Fabricated SAWfilterswere mounted on ceramic SMD package for reducing their size and volume. SAW filters were measured under matched circuit. As a result, 5 dB bandwidth of 1.32 MHz, 33dB bandwidth of 1.76 MHz, insertion loss of 13.8 dB and peak to peak ripple at passband of 0.26 dB were obtained. Linear group delay responses at passband were also obtained. These characteristics were good for practical use of IF SAW filter for CDMA system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.12
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• pp.8306-8313
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• 2015

Open-type current sensors have been commonly used for DC motor controller, AC variable controller and Uninterruptible Power Supply. Recently they have begun to be used more widely, as the growth of renewable energy and smart-grid in power system. Considering most of the open-type current sensors are imported, developing the core technology needed to produce open-type current sensors is required. This paper describes the development and test results of open-type current sensors. Design of C type magnetic core, selection and test of a Hall sensor, design of current source circuit and signal conditioning circuit are described. 100A class DIP(Dual In-line Package) type and SMD(Surface Mount Devide) type open-type current sensors was made and tested. Test results show that the developed open-type current sensor satisfies the accuracy requirement of 2% and linearity requirement of 2% at 100 A of DC and AC current of 60Hz. Temperature compensation was carried out by using a temperature compensation circuit with NTC(Negative Temperature Coefficient) thermistor and the effect of the temperature compensation are described.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.18-23
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• 2016

QFN (Quad Flat No-leads Package) is one of the SMD (Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network (CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image (Red, Green, Blue) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. In this paper, it is shown that the CNN is superior to the conventional multi-layer neural networks in detecting QFN solder defects. Later, further research is needed to detect other QFN.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.17 no.4
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• pp.8-12
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• 2003

Characteristics of optical transceiver module in radio frequency(RF) band were investigated with TO-can packaged Fabry-Perot laser diode(FP-LD). R-L-C parameters for equivalent circuit model of the LD were extracted with an impedance analyzer. With this model, impedance matching to the packaged LD could be performed by eliminating inductive components of the leads in the package by using lumped chip capacitors that have opposite reactance, while it shows resonance dip in low frequency band. The resonance dip could be removed using lumped elements for impedance matching by shifting the resonance frequency to the region out of interest.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.3
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• pp.1-9
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• 2003

In this paper, we designed a highly suppressed sidelobe ladder type RF SAW bandpass filter based on 1-port resonator, for 800 MHz mobile communication system. In order to get the highest device characteristics, we optimized some important parameters such as the electrode thickness, electrode lambda weghting of the reflectors, and static capacitance ratio. Furthermore, we fabricated the Tx and Rx. filter using optimized parameters. Implemented filters can be used in 800 MHz mobile communication system and external impedance matching circuits are not needed. RF filter was fabricated on 36$^{\circ}$LiTaO$_3$ substrates with Al-Cu (W 3 %)and mounted 3.8mm$\times$3.8mm$\times$1.5mm SMD package. Developed filters has 2.3 dB insertion loss in the 25 MHz pass-band, 33MHz with 3-dB insertion loss, stop-band rejection of 30 dB, passband ripple is less than 0.5 The power durability of the filters measured about 3.5W and the maximum temperature variation within -2$0^{\circ}C$~8$0^{\circ}C$ was 0.09 dB/$^{\circ}C$ of 3-dB insertion loss.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.