• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2002년도 춘계학술대회논문집
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• pp.1039-1042
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• 2002

SMD(Surface Mounting Device) which mounts electronic components as IC-Chips on PCB automatically, produces a large dynamic force and vibration. The unwanted vibrations in SMD degrade the performance of the precision device and it is the major obstacle to limit its speed for mounting. This study investigated the vibration analysis of a typical SMD to predict the natural frequencies and mode shapes. To validate the finite element analysis of SMD, the FE result was compared with that of ODS measurements. It was shown that the predicted results were well correlated with the experimental modal parameters.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.628-634
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• 1995

In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformer which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backash and friction. Therefore a dynamic modeling and stste sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensitivity snalysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensitivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design based on the results on the results of dynamic and state sensitivity.

• 한국정밀공학회지
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• 제13권7호
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• pp.90-99
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• 1996

In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformed which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backlash and friction. Therefore a dynamic modeling and state sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensit- ivity analysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensit- ivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design and faster operating based on the results of dynamic and state sensitivity.

• 산업공학
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• 제10권1호
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• pp.155-167
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• 1997

The purpose of this study is to develop the program for efficient operation of a multi-functional surface mounting device(SMD) which mount various components on a printed circuit board(PCB). These components are provided by diverse types of feeders such as cassette, stick and tray feeders. The SMD has one or two heads. In the SMD, the positions of PCB and feeders and fixed, and the head moves to pick up a component from a feeder and to mount it on the PCB. The number of lanes occupied by each feeder and the nozzle used for each component can be different. We develop an off-line program to minimize the cycle-time of the SMD by studying the optimal assignment of feeders and the optimal mounting sequence of components. Graphical User Interface(GUI) is also developed. Additionally, we consider the line balancing problem which appears when two SMDs are used sequentially.

• 산업경영시스템학회지
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• 제43권4호
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• pp.67-75
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• 2020

This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

• 제어로봇시스템학회논문지
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• 제4권3호
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.568-573
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• 1996

In this paper, A design strategy of the Surface Mounting Device for accurate and better performance is studied. Analytical Modeling. Sensitivity analysis and optimization are being conducted. The ANSYS software and experimental method are used for verification of the analytical equations withboundary conditons. Through the sensitivity analysis, the most dominant design parameters can be detected. The optimum design parameters for performing given performing given perfomances are selected by using the optimization algorithm. The design tool based on the design strategy for the analysis, modeling and optimization will be useful for a re-design and better perofrmance of the SMD.

• 한국정밀공학회지
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• 제14권2호
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• pp.120-128
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• 1997

In this paper, A design strategy of the Surface Mounting Device for accurate and better performance is studied. Analytical modeling, sensitivity analysis, and optimization are being conducted. The ANSYS software and experimental method are used for the verification of the analytical equations with boundary conditions. Through the sensitivity analysis, the most dominant design parameter can be detected. The optimum design parameters for improving the given performances are selected by using the optimiza- tion algorithm. The design tool based on the design strategy for the analysis, modeling, and optimization will be useful for are-design and better improving of the SMD.

• 제어로봇시스템학회논문지
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• 제21권3호
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• pp.276-282
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• 2015

This paper proposes a SMD (surface mounting device) classification method for the PCB assembly inspection machines. The package types of SMD components should be classified to create the job program of the inspection machine. In order to reduce the creation time of job program, we developed the automatic classification algorithm for the SMD packages. We identified the chip-type packages by color and edge distribution of the images. The input images are transformed into the HSI color model, and the binarized histroms are extracted for H and S spaces. Also the edges are extracted from the binarized image, and quantized histograms are obtained for horizontal and vertical direction. The neural network is then applied to classify the package types from the histogram inputs. The experimental results are presented to verify the usefulness of the proposed method.

• 한국산학기술학회논문지
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• 제12권9호
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• pp.4138-4146
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• 2011

표면실장기술(SMT: Surface Mount Technology)에 있어서 휴대폰 및 평판 디스플레이가 점점 가볍고 얇아지면서 이 제품에 사용되는 전자부품이 작아지고 있어, 0402, 0603 Chip등과 같은 SMD(Surface Mount Device) 부품을 실장하는 기술이 대두되고 있다. 따라서 Chip Mounter 제조회사들은 미삽이나 오삽을 방지하기 위한 실장기술에 대해 지속적인 연구를 해오고 있다. 본 연구는 이러한 미삽 오삽 방지를 실현하기 위하여 Fiber sensor를 이용하여 기계적 구조를 마련하고, 이를 활용한 시스템 알고리즘을 개선하는 기술을 제시한다.