• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.443-447
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• 1994

Compacts of mixed SiO2-Si powder were liquid phase sintered at 145$0^{\circ}C$ for up to 60 min in a hydrogen atmosphere. In contrast to the conventional microstructures of liquid phase sintered materials, the specimens showed that the solid phase of SiO2 formed a matrix while the liquid phase of Si was the dispersed in the solid matrix. The dispersion of liquid Si pockets was attributed to the high wetting angle of liquid Si on solid SiO2. Because of relatively high solubility of SiO2 in liquid Si at 145$0^{\circ}C$, SiO2 particles accommodated their shape via a solution-reprecipitation process. The liquid Si pockets grew by coalescing with their neighbour pockets. In the latter stage of the sintering, plate-shape grains appeared in the liquid Si pockets. The grains were SiO2 phase precipitated from the liquid Si which was oversaturated with oxygen during cooling to room temperature. By the formation and subsequent removal of the gaseous SiO phase due to the reaction between SiO2 and Si, the specimens became porous.

• Korean Journal of Materials Research
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• v.6 no.4
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• pp.428-435
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• 1996

초미립 SiC분말과 SiC platelet을 2차성으로 Si3N4에 첨가하여 SiC/Si3N4 하이브리드 복합체를 가압소결로 제조한 후 2차상의 영향을 조사한 결과핫프레스법을 이용한 경우 SiC platelet은 Si3N4 기지 복합채의 치밀화를 저해하지 않고 초미립의 SiC 첨가는 Si3N4의 입성장을 효과적으로 억제하여 미세한 $\beta$-Si3N4의 grain을 형성함을 관찰하였다. 초미립 SiC첨가를 통한 복합체의 강도 증진은 상대적으로 $\beta$-Si3N4입자의 미세화에 의한 인성의 저하를 유도하나 SiC platelet을 첨가하여 급격한 강도 저하 없이 높은 인성을 갖는 하이브리드 복합체를 제조할 수 있었으며 SiC/Si3N4 하이브리드 복합체의 인성증진은 elongated $\beta$-Si3N4와 platelet SiC의 debonding에 의한 grain pull-out 영향임을 알 수 있었다.

• Journal of the Korean Ceramic Society
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• v.37 no.2
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• pp.152-157
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• 2000

Si3N4/SiC nanocomposite ceramics containing 5 wt%dispersed SiC particles were prepared by gas-pressure-sintering at 200$0^{\circ}C$ under nitrogen atmosphere. SiC particles with average sizes of 0.2 and 0.5${\mu}{\textrm}{m}$ were used, and the effect of the SiC particle size on the microstructure was investigated. The addition of SiC particles effectively suppressed the growth of the Si3N4 matrix grains. The effect of grain growth inhibition was higher in the nanocomposites dispersed with fine SiC. SiC particles were dispersed uniformly inside Si3N4 matrix grains and on grain boundaries. When the fine SiC particles were added, large fraction of the SiC particles was trapped inside the grains. On the other hand, when the large SiC particles were added, most of the SiC particles were located on grain boundaries. Typically, the fraction of SiC particles located at grain boundaries was higher in the specimen prepared from $\beta$-Si3N4 than in the specimen prepared from $\alpha$-Si3N4.

• Bulletin of the Korean Chemical Society
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• v.24 no.3
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• pp.325-333
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• 2003

An analysis of the electronic structure and bonding in the ternary silicide YNiSi₃is made, using extended Huckel tight-binding calculations. The YNiSi₃structure consists of Ni-capped Si₂dimer layers and Si zigzag chains. Significant bonding interactions are present between the silicon atoms in the structure. The oxidation state formalism of $(Y^{3+})(Ni^0)(Si^3)^{3-}$ for YNiSi₃constitutes a good starting point to describe its electronic structure. Si atoms receive electrons from the most electropositive Y in YNiSi₃, and Ni 3d and Si 3p states dominate below the Fermi level. There is an interesting electron balance between the two Si and Ni sublattices. Since the ${\pi}^*$ orbitals in the Si chain and the Ni d and s block levels are almost completely occupied, the charge balance for YNiSi₃can be rewritten as $(Y^{3+})(Ni^{2-})(Si^{2-})(Si-Si)^+$, making the Si₂layers oxidized. These results suggest that the Si zigzag chain contains single bonds and the Si₂double layer possesses single bonds within a dimer with a partial double bond character. Strong Si-Si and Ni-Si bonding interactions are important for giving stability to the structure, while essentially no metal-metal bonding exists at all. The 2D metallic behavior of this compound is due to the Si-Si interaction leading to dispersion of the several Si₂π bands crossing the Fermi level in the plane perpendicular to the crystallographic b axis.

• The Korean Journal of Ceramics
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• v.3 no.1
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• pp.47-51
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• 1997

The dense sintered bodies of Si/SiC composite with various Si contents could be fabricated by changing the green density in the forming process. The Si/SiC/graphite composites with various graphite contents could be also fabricated by changing a graphite content in the starting composition. Their mechanical and tribological properties were characterized and wear mechanism was also studided. The hardness and strength of the Si/SiC and the Si/SiC/graphite were decreased with increasing the contents of free Si and graphite, respectively. However, the friction coefficient and specific wear rate had no specific relations to their hardness and strength. Adhesion of free Si was a main factor to determine a wear resistance of the Si/SiC composite. In the case of the Si/SiC/graphite, solid lubricationl and liquid reservoir of the graphite particles played the main role of the reduction of the friction force. In the torque test to estimate the possibility of practical of practical applications, the value of torque between the Al2O3 disk and Si/SiC/graphite disk was 1/6 lower compared with two $Al_2O_3$ disks on the basis of 100,000 cycles.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.2 s.257
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• pp.205-210
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• 2007

SiC/SiC composites and monolithic SiC materials have been fabricated by the melt infiltration process, through the creation of crystallized SiC phase by the chemical reaction of C and Si. The reinforcing material used in this system was a braided Hi-Nicalon SiC fiber with double interphases of BN and SiC. The microstructures and the mechanical properties of RS-SiC based materials were investigated through means of SEM, TEM, EDS and three point bending test. The matrix morphology of RS-SiS/SiC composites was greatly composed of the SiC phases that the chemical composition of Si and C is different. The TEM analysis showed that the crystallized SiC phases were finely distributed in the matrix region of RS-SiC/SiC composites. RS-SiC/SiC composites also represented a good flexural strength and a high density, accompanying a pseudo failure behavior.

• Korean Journal of Materials Research
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• v.8 no.7
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• pp.579-583
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• 1998

Silicide layer structures, agglomeration of silicide layers, and dopant redistributions for the Co/Ti bilayer sputter-deposited on the P-doped polycrystalline Si substrate and subjected to rapid thermal annealing were investigated and compared with those on the single Si substrate. The $CoSi_2$ phase transition temperature is higher and agglomeration of the silicide layer occurs more severely for the Co/Ti bilayer on the doped polycrystalline Si substrate than on the single Si substrate. Also, dopant loss by outdiffusion is much more significant on the doped polycrystalline Si substrate than on the single Si substrate. All of these differences are attributed to the grain boundary diffusion and heavier doping concentration in the polycrystalline Si. The layer structure after silicidation annealing of Co/ Tildoped - polycrystalline Si is polycrystalline CoSi,/polycrystalline Si, while that of Co/TiI( 100) Si is Co- Ti- Si/epi- CoSi,/(lOO) Si.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.166-171
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• 2007

The characterization of monolithic SiC and SiCf/SiC composite materials fabricated by NITE and RS processes was investigated in conjunction with the detailed analysis of their microstructure and density. The NITE-SiC based materials were fabricated, using a SiC powder with average size of 30 nm. RS- SiCf/SiC composites were fabricated with a complex slurry of C and SiC powder. In the RS process, the average size of starting SiC particle and the blending ratio of C/SiC powder were $0.4\;{\mu}m$ and 0.4, respectively. The reinforcing materials for /SiC composites were BN-SiC coated Hi-Nicalon SiC fiber, unidirectional or plain woven Tyranno SA SiC fiber. The characterization of all materials was examined by the means of SEM, EDS and three point bending test. The density of NITE-SiCf/SiC composite increased with increasing the pressure holding time. RS-SiCf/SiC composites represented a great decrease of flexural strength at the temperature of $1000\;^{\circ}C.$

• Journal of the Korean Ceramic Society
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• v.29 no.9
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• pp.750-756
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• 1992

Reaction bonded si-SiC composites were prepared by silicon infiltration technique at temperature of 1$600^{\circ}C$ for 30 minutes in vaccum atmosphere. The microstructure and mechanical properties of Si-SiC composites were investigated and characterized. UF-15 and SE-10 as SiC powders, phenolic resin and carbon black as carbon source, and metallic silicon powder as molten Si source were used as starting materials. New SiC crystallines nucleatd and grown by reaction of Si and C were detected by TEM and SEM-EDS. The bonding between new and original SiC was found to be strong. But the wetting of SiC by unreacted metallic Si and the rapid grain growth of new SiC decreased density and fracture toughness. Fracture toughness and modulus of rupture of Si-SiC composite were about 3.2 MPa.m1/2 and 480 MPa, respectively.

• Journal of Welding and Joining
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• v.15 no.5
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• pp.104-114
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• 1997

The microstructure and bond strength were investigated on the SiC/SiC and SiC/mild steel joints brazed by Ag-5at%Ti alloy. Ag-5at%Ti-2at%Fe and -5at%Fe brazing alloys were also used to see the effects of Fe addition on the bond strength of SiC/SiC brazed joints. Brazing temperature and brazing gap were selected and examined as brazing variables. The microstructure of SiC/SiC brazed joints was affected by Fe addition to the Ag-5at%Ti alloy, but the bond strength was not. Increasing brazing temperature also changed the microstructure of $Ti_5Si_3$ reaction layer and brazing alloy matrix of the SiC/SiC and SiC/mild steel joints, but not the bond strength. Brazing gap had a great effects on the bond strength. Decreasing brazing gap from 0.2 mm to 0.1 mm in SiC/SiC brazing increased the bond strength from 187 MPa to 263 MPa and, in SiC/mild steel brazing, from 189 MPa to 212 MPa. It was concluded that the most important parameter on the bond strength in SiC/SiC and SiC/mild steel brazing was the relative ratio between brazing gap and specimen size.