• Proceedings of the KSR Conference
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• 2001.05a
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• pp.347-358
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• 2001

In this paper, we apply NHPP model example to s/w process in order to get to know s/w reliability. The test is constructed by a test zig of commercial product loaded real embedded system s/w. It is established to s/w reliability prediction and estimation of real-time embedded system s/w. It is computed the prediction value of cumulative failures, the failure intensity, the reliability and the estimation value of MTTF, Failure Rate. To the more realization of high reliability in the real-time embedded system s/w, if the embedded system s/w is ensured to the test coverage and constructed to stable s/w process ＆ operating system, we can improve the performance and the reliability characteristic of the real-time embedded system s/w.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.6-10
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• 2003

Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.175-176
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• 2008

향후 개발되어질 Digital Power IED (Protection & Measuring, Control, Supervision etc.) 에서 제작된 H/W 및 Simulation용 Target Board 의 Firmware Process Flow 지침으로서 개발 경험을 바탕으로 보다 안정적이고 효율적인 Programming 을 가능하게 하고, 실시간 연산 Process 의 기준 확립 및 이해를 통한, 개선 아이디어 도출 및 수정 필요시 빠른 Trouble-Shooting 능력을 배양할 수 있다. 새로운 Process 아이디어의 Simulation 적용 및 확인으로 호환성과 안정성에 기반하는 F/W Optimization을 항상 유지 관리할 수 있으며, Measuring Element (전압, 전류, 전력, 주파수 등), Protection Element (OC, OCG, OV, OVG, UV, UC, DOC 등) 의 기준을 정함으로서 새로운 개발자에게는 개발 실무를 위한 교육 자료로 이용하고, 기존 개발자들에게는 안정된 F/W 모듈을 제공한다. 본 논문에서는 개발 시간을 단축하고, 다양한 진보 Process 접근을 원활히 할 수 있는 F/W 및 S/W 시뮬레이터를 제시한다.

• 한국IT서비스학회:학술대회논문집
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• 2005.05a
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• pp.365-371
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• 2005

S/W 제품계열(S/W Product Line)은 공통의 유사한 기능을 지닌 S/W 제품 또는 S/W 시스템의 집합을 의미한다. S/W 제품 계열을 통해 특정 영역의 시장과 용도의 요구사항을 만족하여 특정 S/W 제품 개발시 미리 구축된 S/W 아키텍처 등의 S/W 핵심 자산을 재사용하여 개발한다. S/W 제품계열 기반의 S/W 개발방식은 미리 구축된 S/W 핵심자산을 재사용함으로 처음부터 전체 시스템을 개발하는 방식보다 쉽고, 빠르게 S/W를 생산할 수 있다. S/W 기술 선진국들은 S/W 제품계열을 S/W 생산기술의 핵심 분야로 선장하고 중점적으로 기술 개발을 지원하고 있다. 미국의 CMU/SEI는 산업체 및 국방성과 함께 제품계열 프레임워크 4.0 (Product-Line Framework 4.0)을 개발하였고 유럽은 ITEA(IT for European Advancement) 프로그램에서 제품계열 기술 개발을 지원하고 있다. 그러나 국내의 경우 S/W 개발의 생산성 향상 방안으로 제품계열 기반 S/W 생산기술의 필요성을 인식하고 있으나, 기술 개발 투자는 미흡한 상황이다. 본 논문에서는 이러한 S/W 제품계열 생산을 위한 S/W 제품계열의 공통 아키텍처를 정립하는 것을 목표로 하고 있다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.769-770
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• 2009

• Journal of Information Technology Services
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• v.4 no.2
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• pp.47-59
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• 2005

S/W product line is a S/W product or a set of S/W system, which has common functions. We can develop a specific S/W product, which satisfiesrequirements of a particular market segment and a mission in a specific domain by reusing the core asset such as the developed S/W architecture through the S/W product line. S/W development methodology based on the S/W product line can develop a S/W more easily and fast by reusing the developed S/W core asset. An advanced country of S/W technology selects S/W product line as a core field of S/W production technology, and support technology development. In case of USA, CMU/SEI (Carnegie Mellon University / Software Engineering Institute) developed product-line framework 4.0 together with the industry and the Ministry of National Defense. Europe is supporting the development of product line technology through ITEA(IT for European Advancement) program. In this paper, we aim to construct reference architecture of S/W product line for production of the S/W product line.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1181-1186
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• 2003

Chemical Mechanical Polishing (CMP) is an essential dielectric planarization in multilayer microelectronic device fabrication. In the CMP process, it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on W passivation layer, in order to obtain higher removal rate (RR) and very low non-uniformity (NU %) during W-CMP process. In this paper, we compared the effects of oxidizer or W-CMP process with three different kind of oxidizers with 5 wt% hydrogen peroxide such as Fe(NO$_3$)$_3$, H$_2$O$_2$, and KIO$_3$. The difference in removal rate and roughness of W in stable and unstable slurries are believed to caused by modification in the mechanical behavior of Al$_2$O$_3$ particles in presence of surfactant stabilizing the slurry.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.5
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• pp.1125-1131
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• 2012

According to abrupt decrese in number of farmer and ageing society, there has been a need for development of low cost agricultural robot. In this paper, a H/W and S/W platform of caterpillar type agricultural chemical dusting robot based on XP embedded system were described. The developed agricultural robot has 2 d.o.f caterpillar type driving wheel and 2 d.o.f chemical dusting spray mechanical system. The H/W platform of the agricultural robot consists of robot controller, remote controller and sensor controller. In S/W platform, 5 processes work concurrently, which are task manager, TCP-IP communication process, localization process, wheel control, and sensor control process. This robot platform has been developed for chemical dusting robot. We proved this system's validity through field test.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.459-460
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.637-638
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• 2006