Effects of Chemical and Abrasive Particles for the Removal Rate and Surface Microroughness in Ruthenium CMP (Ru CMP 공정에서의 화학액과 연마 입자 농도에 따른 연마율과 표면 특성)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2004.07b
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- pp.1296-1299
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- 2004