• The Journal of Korean Academy of Prosthodontics
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• v.38 no.1
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• pp.108-115
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• 2000

This study was designed to compare the effect of polishing on surface roughness of composite resin. We used Z100(3M) composite resin and placed the composite resin in the hole (4mm thick and 4mm in diameter) of vinyl plate and polymerized it under manufacturer's instructions. Samples were divided into 5 groups by polishing methods. Group 1 was control: resin was polymerized under glass plate, Group 2: resin was polymerized without any polishing procedure, Group 3: resin was polymerized with a polishing procedure of abrasive disc, Group 4: bonding agent was applyed in thin layer and polymerized on the polished polymerized resin surface. Group 5: resin was polymerized under transparent celluloid strip. The surface roughness of each specimen was measured with Sufacoder SEF-30D (Kosaka lab. Ltd) under 0.08mm cut off, 0.05mm/s stylus speed, ${\times}40$ horizontal magnification, ${\times}5000$ vertical magnification. The results were as follows : 1. Group 1 showed the most smooth surface in this study. 2. Group 3 showed more rough surface than Group 2. Considering the surface roughness, it would be better to make the shape completely before polymerize the resin. To finish and polish after the polymerization of resin makes less smooth surface. 3. When we use the transparent celluloid strip, minimum finishing procedures are recommended. Any polishing procedure could not recover the smooth resin surface of celluloid strip. 4. Application and polymerization of the thin layer of bonding agent on the polished surface showed the minimum surface smoothing effect.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.1-6
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• 2013

This study has focused on transparency recovering of the polycarbonate by polishing its surface for recycling. The polycarbonate has many properties such as excellent mechanical strength, electrical insulating, superior heat resistance to other plastic material and especially good transparency. It has been used as barrier for the traffic noise at the roadside and the greenhouse for the palm house. But the polycarbonate has changed slightly as time goes by 10 years because of exposure to the strong sunlight and oxidization in the atmosphere, as result has lost its transparency. Magnetic assisted polishing has been utilized as an effective polishing method to recover the transparency of polycarbonate. The polycarbonate which has been used for 10 years was adopted as the sample. The first surface roughness of the sample was 1$1.23{\mu}mRa$, $7.5{\mu}mRz(DIN)$ respectively. In the experimental results, it showed that the surface roughness of the polished sample improved $0.013{\mu}mRa$, $0.08{\mu}mRz(DIN)$ from the first surface roughness respectively. The surface roughness get almost back again by magnetic assisted polishing. These results also showed that the magnetic assisted polishing was efficient machining method to reuse the polycarbonate material.

• Tribology and Lubricants
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• v.35 no.6
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.779-784
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• 2011

This study was carried out on the crack healing of three types of SiC ceramics based on a $SiO_2$ additive, taking into account the roughness of the polishing plate used for polishing the specimens. The mixtures were subsequently hot-pressed in $N_2$ gas for one hour under 35 MPa at 2053 K. In these specimens, the optimized crack-healing condition was 1373 K for one hour in air. The crack-healing material of the cracked part was the glassy phase of $SiO_2$ that was formed by the oxidation of SiC. In the optimum healing condition, the bending strength of non-polished SiC ceramics was not completely recovered. However, the bending strength of the SAY specimen was excellent, considering the economic aspects of SAY, SAYS-1, and SAYS-2. The SAY specimen is definitely superior to the others after an hour of heat treatment. There was a decrease in the number and size of defects in the specimen polished by using a $125-{\mu}m$ polishing plate; however, the micro-surface defects were not completely repaired. The specimen polished by using a 40-${\mu}m$ polishing plate showed little voids or surface defects after an hour of heat treatment. The bending strength of the specimen mirror-polished by using a 6-${\mu}m$ polishing plate was completely recovered.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.4
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• pp.719-741
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• 1997

This study was undertaken to compare by Atomic Force Microscope the effects of various finishing and polishing instruments on surface roughness of filling and veneering composite resins. Seven composite resins were studied : Silux Plus (3M Dental Products, U.S.A.), Charisma (Heraeus Kulzer, Germany), Prisma THP (L.D.Caulk, Dentsply, U.S.A.), Photoclearfil (Kuraray, Japan), Cesead (Kuraray, Japan), Thermoresin LC (GC, Japan), Artglass (Heraeus Kulzer, Germany). Samples were placed and polymerized in holes (2mm thick and 8.5mm in diameter) machined in Teflon mold under glass plate, ensuring excess of material and moulded to shape with polyester matrix strip. Except control group (Polyester matrix strip), all experimental groups were finished and polishied under manufacturer's instructions. The finishing and polishing procedure were : carbide bur (E.T carbide set 4159, Komet, Germany), diamond bur (composite resin polishing bur set, GC, Japan), aluminum-oxide disc (Sof-Lex Pop-On, 3M Dental Products, U.S.A.), diamond-particle disc (Dia-Finish, Renfert Germany), white stone bur & rubber point( composite finishing kit, EDENTA, Swiss), respectively. Each specimens were evaluated for the surface roughness with Atomic Force Microscope (AutoProbe CP, Park Scientific Instruments, U.S.A.) under contact mode and constant height mode. The results as follows : 1. Except Thermoresin LC, all experimental composite resin groups showed more rougher than control group after finishing and polishing(p<0.1). 2. A surface as smooth as control group was obtained by $Al_{2}O_{3}$ disc all filling composite resin groups except Charisma and all veneering composite resin groups except Thermoresin LC(p<0.05). 3. In case of Thermoresin LC, there were no statistically significant differences before and after finishing and polishing(p>0.1). 4. Carbide bur, diamond bur showed rough surfaces in all composite resin groups, so these were inappropriate for the final polishing instruments.

• Design & Manufacturing
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• v.11 no.3
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• pp.51-55
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• 2017

Micro fuel cells have high reliability and long usage time. Among them, PEMFC (polymer Electrolyte Membrane Fuel Cell) is suitable as a portable power source because it is easy to fix electrolyte and simple structure. The bipolar plate, a key component of the fuel cell, is produced by cutting. In the case of micro fuel cell separator, burr is very small and the flow channel size in the separator is very small. Therefore, it is difficult to remove burrs in the usual way such as a brushing or ultra-sonic method. Therefore, this study proposed electrolytic polishing process and analyzed the characteristics of each condition by introducing the concept of roughness reduction rate. In addition, the ultrasonic process was added to analyze the effect of ultrasonic addition.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.149-154
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• 2015

This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

• The Journal of Korean Academy of Prosthodontics
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• v.50 no.2
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• pp.106-111
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• 2012

Purpose: The purpose of this study was to compare the effect of 3 chairside polishing methods and laboratory polishing methods on surface roughness and $C.$ $albicans$ adhesion of polyamide denture base. Materials and methods: Using contact profilometer, the surface of polyamide specimens ($25{\times}15{\times}2mm$) was studied after conventional polishing without finishing and after chiarside polishing with 2 chiarside polishing kits and chairside-pumice polishing following finishing with tungsten carbide bur. To evaluate the adhesion of $C.$ $albicans$, $C.$ $albicans$ suspension was overlayed on the test specimen. And the specimens were incubated for 2 hours. Imprint culture method was achieved and counted the colony on the agar plate. Polished polyamide were evaluated using a scanning electron microscope. The statistics were conducted using one-way ANOVA and in case of difference, Scheffe test and Tamhane's T2 test were used. Results: Surface roughness (Ra) of surfaces polished with 2 chairside polishing kits had higher than conventional polishing and pumice polishing. The highest roughness value was $0.32{\pm}0.10{\mu}m$, and the lowest was $0.02{\pm}0.00{\mu}m$. The adhesion of $C.$ $albicans$ on the specimens polished with chairside polishing group and pumice polishing group were increased than conventional polishing group ($P$<.01). Conclusion: Conventional laboratory polishing was found to produce the smoothest surface and the lowest adhesion of $C.$ $albicans$. Two groups polished with Chairside polishing kits were similar with respect to surface roughness. Surface of the specimen polished with pumice is significantly smoother than 2 chairside polishing groups, but the result of $C.$ $albicans$ adhesion is that group polished with pumice was similar with 2 chairside polishing groups ($P$>.01).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.12
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• pp.983-988
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• 2000

The leadframe of thin plate fabricated by stamping method generates a lot of burr and stress in the processing surface because of the mold. The electropolishing equipment was produced in order to increase accuracy and surface roughness for 42%Ni-Fe leadframe. An electrolyte consisted of phosphoric acid, ethylene glycol and deionized water. Experiments were accomplished as polishing conditions were changed such as current density, polishing time, electrode gap and sample shape. The burr from the cutting was eliminated and surface characteristics of high flatness and high luster wre obtained after electropolishing. In addition, the electroplishing had good characteristic in 1.0 A current density and 4㎜ of electrode spaces, and it was affected by the composition of electrolyte and the sample shape.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.310-317
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• 2013

In this paper, the contact pressure of the wafer and polishing pad for final polishing process for 300 mm-wafer were investigated through numerical analysis using FEM tool, ANSYS. The distribution of the contact pressure is one of main parameters which affects on the flatness and surface roughness of polished wafers. Two types of polishing head, a hard type head with ceramic disk and a soft type head with air bag were considered. The effects of the deformation and initial shape of table on the contact pressure were also examined. Both heads and tables were modeled as 3D finite element model from solid model, and the material properties of polishing pads and rubber plate for the air-bag head were obtained from tensile tests. The contact pressure deviation on wafer surface was smaller with air bag head than hard type head even when the table had form errors such as convex or concave. From this 3D analysis, it could be concluded that the air-bag head has better uniformity of the contact pressure on wafer. Also, the effects of inner diameter of air bag and radial clearance between wafer and retainer were investigated as view point of contact pressure concentration on the edge of wafer.