• 대한치과보철학회지
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• 제38권1호
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• pp.108-115
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• 2000

This study was designed to compare the effect of polishing on surface roughness of composite resin. We used Z100(3M) composite resin and placed the composite resin in the hole (4mm thick and 4mm in diameter) of vinyl plate and polymerized it under manufacturer's instructions. Samples were divided into 5 groups by polishing methods. Group 1 was control: resin was polymerized under glass plate, Group 2: resin was polymerized without any polishing procedure, Group 3: resin was polymerized with a polishing procedure of abrasive disc, Group 4: bonding agent was applyed in thin layer and polymerized on the polished polymerized resin surface. Group 5: resin was polymerized under transparent celluloid strip. The surface roughness of each specimen was measured with Sufacoder SEF-30D (Kosaka lab. Ltd) under 0.08mm cut off, 0.05mm/s stylus speed, ${\times}40$ horizontal magnification, ${\times}5000$ vertical magnification. The results were as follows : 1. Group 1 showed the most smooth surface in this study. 2. Group 3 showed more rough surface than Group 2. Considering the surface roughness, it would be better to make the shape completely before polymerize the resin. To finish and polish after the polymerization of resin makes less smooth surface. 3. When we use the transparent celluloid strip, minimum finishing procedures are recommended. Any polishing procedure could not recover the smooth resin surface of celluloid strip. 4. Application and polymerization of the thin layer of bonding agent on the polished surface showed the minimum surface smoothing effect.

• 한국기계가공학회지
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• 제12권3호
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• pp.1-6
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• 2013

This study has focused on transparency recovering of the polycarbonate by polishing its surface for recycling. The polycarbonate has many properties such as excellent mechanical strength, electrical insulating, superior heat resistance to other plastic material and especially good transparency. It has been used as barrier for the traffic noise at the roadside and the greenhouse for the palm house. But the polycarbonate has changed slightly as time goes by 10 years because of exposure to the strong sunlight and oxidization in the atmosphere, as result has lost its transparency. Magnetic assisted polishing has been utilized as an effective polishing method to recover the transparency of polycarbonate. The polycarbonate which has been used for 10 years was adopted as the sample. The first surface roughness of the sample was 1$1.23{\mu}mRa$, $7.5{\mu}mRz(DIN)$ respectively. In the experimental results, it showed that the surface roughness of the polished sample improved $0.013{\mu}mRa$, $0.08{\mu}mRz(DIN)$ from the first surface roughness respectively. The surface roughness get almost back again by magnetic assisted polishing. These results also showed that the magnetic assisted polishing was efficient machining method to reuse the polycarbonate material.

• Tribology and Lubricants
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• 제35권6호
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• 대한기계학회논문집A
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• 제35권7호
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• pp.779-784
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• 2011

본 논문은 첨가제 $SiO_2$를 가지는 3종류의 SiC 세라믹스의 연마판 거칠기에 따르는 균열 치유 연구를 실시하였다. 혼합물은 질소가스 분위기에서 2053 K, 35 MPa, 1시간 동안 소결하였다. SiC 세라믹스 시험편의 최적 균열 치유 조건은 1373 K에서 1시간이다. 균열부의 치유 물질은 SiC와 $O_2$의 산화반응에 의한 유리상 $SiO_2$이다. 최적 치유 조건에서 미연마 SiC 세라믹스의 굽힘 강도는 완전하게 회복되지 않았다. 그러나 SAY, SAYS-1 및 SAYS-2 시험편에서 경제적인 면을 고려하면 1시간 열처리에서 상온 굽힘 강도가 가장 높게 나타난 SAY 시험편이 우수하다. $125\;{\mu}m$ 연마판의 연마 시험편은 결함의 수나 크기가 줄어들었으나, 열처리 후에도 표면 미세 결함이 완전하게 치유되지 못하였다. $40\;{\mu}m$ 연마판의 연마 시험편은 1시간 열처리 후 표면 결함이나 기공은 거의 없었으며, 굽힘 강도는 $6\;{\mu}m$ 연마판 경면 시험편의 강도만큼 회복하였다.

• 대한치과보철학회지
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• 제35권4호
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• pp.719-741
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• 1997

This study was undertaken to compare by Atomic Force Microscope the effects of various finishing and polishing instruments on surface roughness of filling and veneering composite resins. Seven composite resins were studied : Silux Plus (3M Dental Products, U.S.A.), Charisma (Heraeus Kulzer, Germany), Prisma THP (L.D.Caulk, Dentsply, U.S.A.), Photoclearfil (Kuraray, Japan), Cesead (Kuraray, Japan), Thermoresin LC (GC, Japan), Artglass (Heraeus Kulzer, Germany). Samples were placed and polymerized in holes (2mm thick and 8.5mm in diameter) machined in Teflon mold under glass plate, ensuring excess of material and moulded to shape with polyester matrix strip. Except control group (Polyester matrix strip), all experimental groups were finished and polishied under manufacturer's instructions. The finishing and polishing procedure were : carbide bur (E.T carbide set 4159, Komet, Germany), diamond bur (composite resin polishing bur set, GC, Japan), aluminum-oxide disc (Sof-Lex Pop-On, 3M Dental Products, U.S.A.), diamond-particle disc (Dia-Finish, Renfert Germany), white stone bur & rubber point( composite finishing kit, EDENTA, Swiss), respectively. Each specimens were evaluated for the surface roughness with Atomic Force Microscope (AutoProbe CP, Park Scientific Instruments, U.S.A.) under contact mode and constant height mode. The results as follows : 1. Except Thermoresin LC, all experimental composite resin groups showed more rougher than control group after finishing and polishing(p<0.1). 2. A surface as smooth as control group was obtained by $Al_{2}O_{3}$ disc all filling composite resin groups except Charisma and all veneering composite resin groups except Thermoresin LC(p<0.05). 3. In case of Thermoresin LC, there were no statistically significant differences before and after finishing and polishing(p>0.1). 4. Carbide bur, diamond bur showed rough surfaces in all composite resin groups, so these were inappropriate for the final polishing instruments.

• Design & Manufacturing
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• 제11권3호
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• pp.51-55
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• 2017

Micro fuel cells have high reliability and long usage time. Among them, PEMFC (polymer Electrolyte Membrane Fuel Cell) is suitable as a portable power source because it is easy to fix electrolyte and simple structure. The bipolar plate, a key component of the fuel cell, is produced by cutting. In the case of micro fuel cell separator, burr is very small and the flow channel size in the separator is very small. Therefore, it is difficult to remove burrs in the usual way such as a brushing or ultra-sonic method. Therefore, this study proposed electrolytic polishing process and analyzed the characteristics of each condition by introducing the concept of roughness reduction rate. In addition, the ultrasonic process was added to analyze the effect of ultrasonic addition.

• 한국기계가공학회지
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• 제14권3호
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• pp.149-154
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• 2015

This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

• 대한치과보철학회지
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• 제50권2호
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• pp.106-111
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• 2012

연구 목적: 본 연구는 탄성의치 제작 시 주로 사용되는 polyamide를 수종의 연마방법을 사용하여 처리 후 $Candida$ $albicans$의 부착정도와 표면거칠기를 비교하고자 하였다. 연구 재료 및 방법: $25{\times}15{\times}2mm$ 크기의 polyamide 시편을 4군으로 나누어 연마재를 사용하여 기공용 lathe 연마하는 방법(기공실내 연마방법)과 각기 다른 2종의 실리콘 포인트로 진료실내 연마하는 방법, 그리고 실리콘포인트 연마 후 pumice로 연마하는 방법으로 처리하였다. $C.$ $albicans$의 부착성을 평가하기 위해 $5{\times}10^6CFU/ml$의 $C.$ $albicans$ 현탁액에 시편을 2시간 동안 침적하였고 5회 수세처리 후 한천배지에서 배양하였다. 그리고 주사전자 현미경(JSM-5900, JEOL LTd., Tokyo, Japan) 촬영을 시행하였다. Profilometer (Surf-pak; Kawasaki, Japan)를 이용하여 표면거칠기를 측정하였고 통계처리를 위하여 SPSS 18.0 프로그램을 사용하였다. 일원변량분석으로 비교 분석하였고 사후 검증은 $C.$ $albicans$의 부착성 검증을 위해 Scheffe test를 시행하였으며 표면조도검증을 위해 Tamhane's T2 test를 시행하였다(${\alpha}$=.01). 결과: 최대 거칠기 값을 보인 군은 2단계의 연마용 버를 사용한 것으로 $0.32{\mu}m{\pm}0.10$ 값을 나타냈으며, 가장 낮은 거칠기 값을 보인 것은 tungsten carbide를 사용하지 않고 기공용 lathe로만 연마를 한 군으로 $0.02{\mu}m{\pm}0.00$의 거칠기 값을 나타냈다. $C.$ $albicans$ 부착 실험에서는 기공용 lathe만을 이용한 연마방법이 가장 적은 부착수를 보였으며 다른 세 군과 유의한 차이가 발견되었다($P$<.01). 결론: 표면거칠기 및 미생물 부착능 실험 결과 기공실 연마만을 시행한 경우 유의하게 낮은 거칠기 값과 부착율을 보였다. Pumice로 추가 연마한 군은 진료실연마를 시행한 군에 비해 낮은 거칠기 값을 보였으나 $C.$ $albicans$ 부착에 있어서는 유의한 차이를 보이지 않았다($P$>.01).

• 한국전기전자재료학회논문지
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• 제13권12호
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• pp.983-988
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• 2000

The leadframe of thin plate fabricated by stamping method generates a lot of burr and stress in the processing surface because of the mold. The electropolishing equipment was produced in order to increase accuracy and surface roughness for 42%Ni-Fe leadframe. An electrolyte consisted of phosphoric acid, ethylene glycol and deionized water. Experiments were accomplished as polishing conditions were changed such as current density, polishing time, electrode gap and sample shape. The burr from the cutting was eliminated and surface characteristics of high flatness and high luster wre obtained after electropolishing. In addition, the electroplishing had good characteristic in 1.0 A current density and 4㎜ of electrode spaces, and it was affected by the composition of electrolyte and the sample shape.

• 한국생산제조학회지
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• 제22권2호
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• pp.310-317
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• 2013

In this paper, the contact pressure of the wafer and polishing pad for final polishing process for 300 mm-wafer were investigated through numerical analysis using FEM tool, ANSYS. The distribution of the contact pressure is one of main parameters which affects on the flatness and surface roughness of polished wafers. Two types of polishing head, a hard type head with ceramic disk and a soft type head with air bag were considered. The effects of the deformation and initial shape of table on the contact pressure were also examined. Both heads and tables were modeled as 3D finite element model from solid model, and the material properties of polishing pads and rubber plate for the air-bag head were obtained from tensile tests. The contact pressure deviation on wafer surface was smaller with air bag head than hard type head even when the table had form errors such as convex or concave. From this 3D analysis, it could be concluded that the air-bag head has better uniformity of the contact pressure on wafer. Also, the effects of inner diameter of air bag and radial clearance between wafer and retainer were investigated as view point of contact pressure concentration on the edge of wafer.