• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.398-401
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• 2001

This paper presents rough cutting pat고 drilling. This method has differences from conventional method which uses boundary curve by intersecting object to machine and each cutting plane. Die-cavity shape is drilled in z-map, we select various tool and remove much material in the short time. as a result, this method raise productivity. The major challenges in die-cavity pocketing include : 1)finding an inscribed circle for removing material of unmachined regions, 2) selecting optimal tool and efficiently arranging tool, 3) generating offset surface of shape, 4) determining machined width according to the selected tool, 5) detecting and removing unmachined regions, and 6) linking PJE(path-joining element). Conventional machining method calling contour-map is compared with drilling method using Z-map, for finding efficiency in the view of productivity.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.782-787
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• 1997

This paper proposes methods for pencil machining and uncut area machining. Based on Z-map represented by triangular facets, self-intersection-free offset surface is generated with K-offset method in case of ball mill and flat mill Pencil machining can elliminate overload area before main machining rough, semi-finish and finish cutting,preventing fluctuations of cutting forces in concave regions form causing bad machining condition. Low productivity is caused by uncut area which has excessive or irreguar finishing allowance. Uncut area machining has the finishing allowance keep uniformly on part surface. This paper deals with two types of uncaut area, machining detection of excessive area and user-defined area.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.6
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• pp.58-63
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• 1998

There are lots of factors that are related to the geometric characteristics of machined surface. Among them, the tool path and milling mode (up cut milling or down cut milling) are the easiest controllable machining conditions. Thus, the first objective of this research is to study the effects of them on the milled surface that is generated by an end milling tool. To get precision parts, not only the machining process but also the measurement of geometric tolerance is important. But, this measurement requires a lot of time, because the infinite surface points must be measured in the ideal case. So, the second objective is to propose a simple flatness measurement method that can be available instead of the 3-D geometric tolerance measurement method, using a scale factor and characterized points. Finally, it is also shown that the possibility of flatness improvement by shifting the consecutive fine cutting tool path as compared with the last rough cutting tool path.

• Transactions of Materials Processing
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• v.17 no.2
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• pp.107-112
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• 2008

In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the size of residual stress region was expanded. The gradient of residual stress within the plate was reduced during the leveling process. But the residual stress itself was not removed completely within the ranges of tested conditions. The exact camber of cut plate was able to be predicted by the measurement of residual stress distribution after leveling of the plate.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.112-115
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• 2007

In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the region with residual stress was expanded. The gradient of residual stress within plate was reduced during the leveling process. But the residual stress itself was not removed at the ranges of tested conditions. From the measured residual stress distribution within the plate, camber of plate cut to small width was predicted exactly within error range of experiment.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.15-21
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• 2004

Composite materials are widely used to make all kinds of machine parts, internal and structural materials of cars, aerospace industries, building structures, ship materials, sporting goods and others. It is worth the while to use composite materials as various substitutions when compared with others. But the use is limited in the field of the mechanical processing because of its difficulties in processing. Thus, it is proved that the surface is rough in and out of the hole processing the GFRP with HSS drill in the vertical machining center.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.1050-1053
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• 1995

A stock removal cycle is developed as a programming tool of the CNC lathe. This cycle support the easiness and swifness of a part program generation in the shopfloor. The cycle contains the function of tool path generation of rough/finish cutting, of avoidance air-cut for non-cylindrical (die-casted, forged) workpiece, and of the tool collisopn detection/aviodance. Consequently the intelligent stock removal cycle results in improving the productivity and safety of CNC lathe.

• International journal of advanced smart convergence
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• v.12 no.1
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• pp.101-107
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• 2023

Machine tools are widely used in mechanical manufacturing corporations, as well as in engineering courses at universities in Vietnam. The PINACHO S-90/200 lathe is particularly popular. This paper aims to research and select an optimal cutting depth to minimize power costs and ensure surface roughness quality when machining upper plain cylindrical turning products with the PINACHO S-90/200 lathe on C45 steel material.

• Korea-Australia Rheology Journal
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• v.19 no.3
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• pp.171-176
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• 2007

LCD-BLU (Liquid Crystal Display-Back Light Unit) of medium size is usually manufactured by forming numerous dots with $50{\sim}300\;{\mu}m$ in diameter by etching process and V-grove shape with $50\;{\mu}m$ in height by mechanical cutting process. However, the surface of the etched dots is very rough due to the characteristics of the etching process and V-cutting needs rather high cost. Instead of existing optical pattern made by etching and mechanical cutting, 3-dimensional continuous micro-lens of $200\;{\mu}m$ in diameter was applied in the present study. The continuous micro-lens pattern fabricated by modified LIGA with thermal reflow process was tested to this new optical design of LGP. The manufacturing process using LIGA-reflow is made up of three stages as follows: (i) the stage of lithography, (ii) the stage of thermal reflow process and (iii) the stage of electroplating. The continuous micro-lens patterned LGP was fabricated with injection molding and its test results showed the possibility of commercial use in the future.

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.