• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.15.2-15.2
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• 2009

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.

• 소성∙가공
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• 제20권1호
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• pp.42-47
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• 2011

Recently, with the merits of simplicity, ease of mass production and cost effectiveness, a roll-to-roll (R2R) forming process is tried to be employed in the manufacturing of the circuit board, barrier ribs and other electronic device. In this study, the roll-to-roll process for the forming of micro-pattern in electronic device panel is designed and analyzed. In the preliminary experiments, two major defects, i.e., crack near the dimple wall and wrinkling on outside region of dimple, are found. The study on the crack prevention is carried out in previous works by authors. In this study, the cause of wrinkling and modification of tooling to prevent the wrinkling is studied. The main cause of wrinkling is considered to be the uneven material flow along the rolling direction. To reduce or to retard the wrinkling initiation, a dummy shape on outside the pattern is introduced. From the finite element analysis results, it is shown that the dummy shape can reduce the uneven material flow significantly. Finally the effect of dimensions of the dummy shape on material flow is investigated and the optimum dimensions are found.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.623-624
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• 2009

Here we report a photo polymerization-induced hybrid alignment of a nematic liquid crystal cell which can be applied for a roll to roll fabrication process. Predominant polymerization in the vicinity of UV incident front induced a diffusion of monomers toward front slide and anisotropic polymer network was formed parallel to the polarization direction of the UV light. This induced planar alignment of liquid crystals at the front slide. Simultaneously, homeotropic alignment was induced at the bottom slide as the polymers are phase-separated from a bottom slide.

• 한국공작기계학회논문집
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• 제17권3호
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• pp.78-85
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• 2008

Roll forming process is one of the most widely used processes in the world for forming metals. It can manufacture goods of the uniform cross section throughout the continuous processing. However, process analysis is very difficult because of the inherent complexity. Therefore, time is consuming and much money are needed for manufacturing goods. In order to overcome this difficulty, a new computational method based on the rigid-plastic finite element method is developed for the analysis of roll forming process. In this paper, the design of roll forming process and the simulation are performed to manufacture the upper member at under rail composed of three members. The cold rolled carbon steel sheet(SCP-1) is used in this simulation, and a flow stress equation is set up by conducting the tensile test. The upper member is designed using two types of design for a excellent design. Each types are simulated and compared with the strain distribution using SHAPE-RF software. In addition, the numerical magnitude of bow and camber which are the buckling phenomenon is estimated.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.261-262
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.393-394
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• 2010

• 소성∙가공
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• 제4권4호
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• pp.375-389
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• 1995

In H shape rolling, accurate predictions of deformation and temperature distribution in a billet are quite important because they are the main factors in determining roll calibers and roll pass schedules. Many researches have been performed to achieve the predictions, but most of them are limited to single pass or isothermal assumptions. In the present investigation, it is attempted to develop a method to predict the deformation and temperature distributions which is applicable to a complete rolling process that usually consists of several rollings under different rolls for a period of time. The method works by coupling two analyses : one is an approximate analysis for temperature distribution prediction and the other is the slab-FEM hybrid analysis for deformation prediction. The method is applied to analyze a "H" shape rolling process consisting of nine passes under four different rolls. In the present paper, basic ideas of the method are presented. Also, shapes of cross sections, strain and temperature distributions, roll separating force and roll torque predicted by the method are discussed.

• 반도체디스플레이기술학회지
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• 제9권2호
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• pp.73-78
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• 2010

This research is about the drying and curing characteristic of conductivity metallic ink on-line curing device in order to improve the curing time for productivity in RFID Gravure printing. The curing process is carried out to increase the electric conductivity after the metallic ink is printed on the substrate. The metal ink is composed of nano-sized silver or copper particles. In this research, the combined IR and Hot air curing system is used and its results is compared with those of oven, IR and Hot Air type respectively. Generally the curing time in the past is about 3 minutes. But the combined system (IR+Hot Air) in this research shows that curing time is less than 30 seconds. These results is much faster than those of other system. This study can be help to make Roll-to-Roll drying and curing process for mass and continuous production on-line.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1548-1552
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• 2007

The roll forming machines currently used in industries require manual change of individual rolls taking 30 to 60 minutes of operation shutdown, This in turn reduces the operational efficiency by considerable margin and has one of the major negative effect on the overall productivity. To improve the operational efficiency of the existing roll forming machine, current manual roll changing process needs automatation to save considerable amount of time. In this study, TRIZ is adopted in the development of new roll forming machine. The Ideal Final Result (IFR) was set up initially and the fundamental causes were examined by Root Cause Analysis. The final proposed concept was drawn from the application of 40 invention principles of TRIZ.

• 한국인쇄학회:학술대회논문집
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• 한국인쇄학회 2007년도 추계 학술논문 발표회
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• pp.59-64
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• 2007

We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.