• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.17-25
• /
• 2017

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

• Journal of Welding and Joining
• /
• v.32 no.3
• /
• pp.74-80
• /
• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.206-207
• /
• 2005

Display 소재로서 유전체나 격벽재 실링재로 사용되고 있는 frit는 PbO를 주성분으로 갖는 유리가 사용되고 있다. PbO 성분이 함유된(50$\sim$85%) 구성소재는 최근 RoHS 나 WEEE 등의 환경규제 실행에 직면해 있으며, 대체재료의 개발을 위한 많은 연구가 진행되고 있다 PbO 성분을 대체할 성분으로는 $Bi_2O_3$ 계, BaO-ZnO 계, $P_2O_5$ 계 등의 성분이 주요성분으로 이루어져 있으며, PbO 성분을 함유한 유리의 저융점, 저유전율, 고 투과율, 내산성, 내전압, 팽창계수 matching 등의 특성들에 부합되는 재료를 개발하기 위해 많은 노력을 기울이고 있다. 본 연구에서는 SnO-$P_2O_5$ 계 유리 조성을 선택하여 $R_2O_3$의 치환 및 용융분위기의 조절에 따른 저융점 유리로서의 특성과 효과에 대하여 고찰하였다.

• Proceedings of the KSR Conference
• /
• 2009.05a
• /
• pp.365-370
• /
• 2009

LCA is a tool to support for making decisions by offering information of environmental aspects of products or services. It can be used to make decisions to consumers and NGOs as well as government and enterprises. LCA evaluates the environmental aspects throughout the entire life cycle of a product. Therefore it can quantify and assess environmental impacts from raw material acquisition, manufacturing, distribution, use and disposal to end of life and recycling. The demands of the recycling rate increase and the use of suitable materials for RoHS, REACH, WEEE, ELV which are linked trade with environmental regulation have increased the worldwide. Global warming is the critical challenge of the world facing. And under post-Kyoto protocol each country has to prepare for target reduction, so it became essential to save energy and resources. In addition that, the carbon mark has been run as the way of showing example of CO2 reduction in domestic and it will be extended gradually. And also through the introduction of Eco-label, environmentally-friendly product will be promoted. When those systems are operated, global warming gases (i.e. CO2) can be calculated throughout the entire life of the products by LCA. And the environmental impacts such as harmful material emission in the process of manufacturing, energy consumption, distribution and so on, can also be assessed. Therefore, The basic concepts of LCA technique and various cases and the practical application in the future will be review in this study.

• Management & Information Systems Review
• /
• v.24
• /
• pp.45-71
• /
• 2008

These days the international environmental regulations of the developed countries, especially from the EU, are rapidly changed to the regulations of product-based environment from a conventional end-of-pipe environmental technology. Especially the motive in this paper come from the EU's electrical and electronic equipment environment regulation. It may affect much to whole export of Korea Firms Integrated product policy has the potential to increase not only competitive power in today's global market, but also trade compatibility between countries. Furthermore it is important to make a contribution to sustainable development. CEOs must change their notions about firms' environmental policy from the end-of-pipe approach to the sustainable approach to improve company's competitive power. As emphasized a paradigm of naw environmental management by EU' environmental directives, the company must establish clean production system to save resources and reduces pollutant. Also Korean Company constructs a systematical network to collect EU' environmental regulation information which are changing rapidly. Large company will cooperate with small and medium-sized firm for their win-win strategy in the field of environmental management. Also it is necessary to make the domestic regulations of product-based environment to meet the international environmental regulations.

• Bulletin of the Korean Chemical Society
• /
• v.33 no.6
• /
• pp.1967-1971
• /
• 2012

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.05a
• /
• pp.139-140
• /
• 2015

주석(Sn)은 뛰어난 유연성을 나타내기 때문에 접촉저항을 감소시킬 목적으로 전자부품과 전자기기의 도선과 단자를 피복하는데 사용된다. 하지만 특정한 조건에서 시간경과와 함께 위스커라는 침상결정이 발생하여 회로 단락을 초래하는 것이 문제이다. 위스커는 직선형, 굴곡형, 곡선형의 형태로 성장하며 직경은 $1{\mu}m$, 길이는 수백 ${\mu}m$에서부터 수 mm에 이른다. 발생 초기단계에서 성장이 정지된 작은 덩어리도 위스커와 함께 관찰된다. 주석도금 피막에서 발생하는 위스커는 1940년대 미국의 전화교환기 단락원인으로 널리 알려지게 되었다. 이러한 위스커를 억제하는 방법으로 주석-납 도금이 개발되었다. 주석-납 도금피막에서는 작은 덩어리가 다수 발생하는 반면에 위스커는 발생하지 않는다. 하지만 2006년 7월에 시행된 RoHS(Restriction of the use of certain Hazardous Substances) 지령에서 수은, 카드뮴, 6가 크롬 및 납은 유해물질로 지정되어 사용이 엄격히 규제되고 있다. 주석 도금피막의 위스커가 발생하고, 성장하는 원인으로 도금피막 내부의 압축응력과 전위, 산화피막, 도금피막-기판계면에서 발생하는 금속간화합물 주변의 변형을 들 수 있다. 본고에서는 도금하여 얻은 주석피막 표면에 형성된 위스커를 중심으로 증착피막과 주석도금 피막을 용융 응고하여 형성된 합금의 경시변화를 비교하고, 작은 덩어리와 위스커의 발생 및 성장 기구에 관하여 기술하였다.

• Proceedings of the Korean Society for Quality Management Conference
• /
• 2006.04a
• /
• pp.375-380
• /
• 2006

Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. So many kinds of projects is proceeding to ensure the reliability of Pb-free electronics in the worlds. Especially it is necessary to evaluate of Pb-free solder joints in electronics. Therefore, on this paper, we compared with solder joint strength of chip components, respectively SnPb, Pb-free solder as follows reliability test methods. We also measured the shear strength of solder joint and also compared the effects of environmental test methods. In this results, we analyzed and compared the shear strength variation as follows solder materials and reliability test conditions.

• Korean Journal of Materials Research
• /
• v.19 no.6
• /
• pp.337-343
• /
• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

• Restorative Dentistry and Endodontics
• /
• v.33 no.5
• /
• pp.435-442
• /
• 2008

Type II root canal was defined that two canals leave the chamber and merge to form a single canal at short of the apex. The aim of this study was to analyse the master apical file (MAF) size according to various instrumentation techniques in the type II root canal when each canal was enlarged to working length. Eighty mesial roots of molar with ISO #15 initial apical file (IAF) size in type II root canals were randomly divided into four experimental groups with 20 teeth each. According to enlarging instruments, four groups are: K-$FLEXOFILE^{(R)}$ (KF), engine-driven Ni-Ti $P_{RO}T_{APER}{^{(R)}}$ (PT), HERO $Shaper^{(R)}$ (HS), $K^{3\;TM}$ (K3). All canals were enlarged to each working length with ISO #30 size: #30 in KF, F3 in PT, .04/30 in HS, and .06/30 in K3. The master apical file (MAF) size was confirmed by tactile sensation and universal test- ing machine (EZ test, Shimadzu Co., Kyoto, Japan). The mean MAF size was statistically compared using one-way ANOVA and Tukey HSD test at the 0.05 probability level. These results show that the MAF size was appeared one or two sizes larger than the final enlarging instrument when all canal in type II configuration were enlarged to each working length. Therefore, the clinician have to confirm the apical stop once more after instrumentation of type II root canal.