• 한국정밀공학회지
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• 제12권4호
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• pp.78-87
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• 1995

Specular reflection appears with metals, plastics, glasses and many other solid objects which are required to be inspected, assembled, moved, or processed automatically. Recongnizing such shiny objects with specular reflections is a hard problem for computer vision, since specular reflections appear, disappear, or change their shapes abruptly, due to tiny movements of the view. Traditionally, such specular reflections are discarded as annoying noise for recongnition purposes. In this paper a technique is represented for obtaining shapes of specular objects. The ring illumin- ation system employes a ring source which is positioned on the axis of the camera. The concept of the proposed method is that if specular objects are illuminated by the ring they show their own dis- tinctive specularity features in surface from which we can infer the shape of the object. A series of experiments are performed to evaluate the performance of this system.

• 제어로봇시스템학회논문지
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• 제21권12호
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• pp.1115-1121
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• 2015

Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as "iso-slope contours". Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.

• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.

• 한국전기전자재료학회논문지
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• 제23권9호
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• pp.708-713
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• 2010

In this research a ring light was developed so that a partial shadowless shooting for the patient's affected area at the medical treatment room and surgical operation room using high luminance light emitting diode (LED) for which attention is being paid as new lighting parts for medical purpose. LED which was applied to the development used high luminance three color LED for full color for which various color materialization and the adjustment of radiation intensity are possible and we can get white light in order to emphasize the delicate expression for generic tone of shooting object, strong highlight, simple shadow and three dimensional effect at the time of close-up shadowless shooting of the affected area. And at the time of design of ring light, the characteristics of LED and the loss of light at the time of penetrating light diffusion PC were considered so that intensity of illumination for over 150 lx can be obtained. The result of measurement of the intensity of illumination of the ring light that was developed revealed that maximum intensity of illumination of 225.7 lx was obtained, while smoke index was measured to be maximum 78 Ra in the case of Red(50%) Green(100%) and Blue LED(60%). We could confirm that response speed was also very fast as 1.72 ms.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.36-39
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• 1997

In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

• 한국정밀공학회지
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• 제24권3호
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• pp.16-22
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• 2007

• 태양에너지
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• 제11권1호
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• pp.3-15
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• 1991

본 연구에서는 자연채광 설계용 천공의 조건을 (1) clear sky (2) partly cloudy sky (3) cloudy sky로 나누어서 서울지역의 수평면에 대해서 전천공조도와 함께 반원형의 띠를 이용하여 확산조도를 측정한다. 천공 상태의 분류는 프랑스의 낭뜨 측정에서의 방법을 이용하였다. 본 연구에서 제시된 자연채광 설계용 기상자료는 (1) 태양고도에 따른 수평면 조도 (2) 조도의 월변화 (3) 조도의 누적표현율 (4) 하루중의 주광 강도의 변화 (5) 특정 조도 이상을 기록한 시간수이다.

• 조명전기설비학회논문지
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• 제22권12호
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• pp.56-63
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• 2008

8각 미러를 이용한 원형 오링, 볼트, 플라스틱 가스켓의 측면 검사시스템을 개발하였다. 검사시스템은 1대의 CCD 카메라와 조명, 1, 2차 8각 미러로 이루어졌으며, 3종류 샘플의 영상 획득을 위해 조명과 미러를 조정하여 시스템을 구성하고 이에 대한 영상처리 알고리즘을 제안하였다. 제안된 알고리즘의 효율성은 각각의 제품에 대하여 실험을 통하여 입증하였고 검사속도는 독립형 카메라로 최대 0.2초 이내이었다. 이러한 검사 시스템은 다양한 원형제품의 측면검사에서 응용될 수 있다.

• 전자공학회논문지B
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• 제33B권11호
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• pp.53-61
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• 1996

In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring shaped LED's with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights - refereed to as 2D features - are extracted. Based on the backpropagation algorithm of neural networks, each solder joint is classified intor one of the pre-defined types. If the output value is not in the confidence interval, the distribution of tilt angles-referred to as 3D features - is claculated, and the solder joint is classified based on the bayes classfier. The second classifier requires more computation while providing more information and better performance. The proposed inspection system has been implemented and tested with various types of solder joints in SMDs. The experimental results have verified the validity of this scheme in terms of speed and recognition rate.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집B
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• pp.70-75
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• 2001

In this study, we developed a measuring system utilizing machine vision for measuring the precision of positioning of micro stepping motor. The measuring system equipped with CCD Camera, ring illumination and diffuser measures the repeatability and the hysterisis of a micro stepping motor by means of the pointer attached to the motor directly. With the measuring system, it was possible to measure the precision of the micro stepping motor in the resolution of $50{\mu}m$.