• Title/Summary/Keyword: Rheology slurry

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Cast cake rheology of ash-clay

  • Lee, K.G.;Kim, Y.T.;Kim, J.H.
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1997.06a
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    • pp.41-44
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    • 1997
  • Dispersion and flocculation behaviors of clay-ash powders in a slurry state were examined, and we have systematically investigated the effects of colloid/interfaces variables on slip properties and the rheological behavior of ash-clay slurry. Ash-clay slurries have been characterized on the basis of the time dependent rheology which was done out by the gel-curve test. Gel-curve for the coagulated slip shows interesting rheological behavior which was caused by the formation of the new network structure and the readsoption of the polysilicon hydroxo species on the particle surfaces.

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A Study of Rheology Properties of AM50A Magnesium Alloy (AM50A 마그네슘합금의 레오로지 특성에 관한 연구)

  • Han S.H.;Lee J.H.;Kang C.G.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.431-432
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    • 2006
  • In this study, the effect of the temperature of magnesium slurry was investigated by mechanical stirring method. The evaluations of rheological behavior of AM50A magnesium alloy were measuring of viscosity and microstructures in the semisolid state. The apparent viscosity was investigated at continuous cooling rate using a concentric cylinder viscometer. Measurement of viscosity measures torque that act to stirrer rotating in slurry doing continuous cooling using torque-meter and expressed by POWER-LAW. Microstructures were observed after mechanical stirring that enforce time at steady state temperature of solid fraction.

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Slurry Rheology in LTCC Tape Casting (LTCC Tape casting에서 슬러리의 Rheology)

  • Park, Zee-Hoon;Shin, Hyo-Soon;Yeo, Dong-Hun;Park, Byung-Ok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.43-43
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    • 2007
  • LTCC는 최근의 이동 통신 환경의 급격한 발전 속에 그 응용 및 특성 요구가 증폭되고 있다. 이러한 LTCC 소재는 주로 테이프 캐스팅에 의한 후막 공정으로 제품이 만들어지게 되는데, 캐스팅을 위해 제조되는 슬러리는 일반적으로 유변학적 의사가소성 거동을 하는 것으로 알려져 있다. 그러나, 슬러리 제조 조건에 따라 유변학적 거동이 다르게 나타나는 것이 관찰되었다. 이에, 슬러리 제조 조건을 다양하게 변화시키며, 유변학적 거동을 살며 보고 이렇게 변화된 유변학적 거동과 캐스팅된 시트 특성과의 관계를 검토해 보려 한다. LTCC 재료의 주 구성 요소인 glass와 세라믹 분말의 초기 조건 및 각각의 rheology 특성과 혼합 슬러리에서의 관계성 등을 고찰하려 한다.

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Studies on Multi-step Addition of NMP in (LiNi0.80Co0.15Al0.05) (NCA) Cathode Slurry Preparation and its Rheological, Mechanical Strength and Electrochemical Properties for Li-ion Cells

  • Vasudevarao Pasala;Satyanarayana Maddukuri;V. Sethuraman;Rekha Lankipalli;Devi Gajula;Venkateswarlu Manne
    • Journal of Electrochemical Science and Technology
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    • v.14 no.3
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    • pp.262-271
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    • 2023
  • For electrode stability and the electrochemical performance of the Li-ion cell, it is essential that the active ingredients and unique additives in the polymer binder be well dispersed with the solvent-based slurry. The efficient procedure used to create the slurry affects the rheological characteristics of the electrode slurry. When successively adding different steps of Nmethyl-2-pyrrolidone (NMP) solvent to the cathode composition, it is evenly disseminated. The electrochemical performance of the Li-ion cells and the electrodes made with slurry formed by single step and multiple steps of addition of NMP solvent are examined. To preform rheological properties of cathode electrode slurry on Ni-rich Lithium Nickel-Cobalt-Aluminum Oxide (LiNi0.80Co0.15Al0.05) (NCA). Also, we investigate different step addition of electrode formation and mechanical strength characterization like peel strength. According to the EIS study, a multi-step electrode slurry has lower internal resistance than a single-step electrode slurry, which results in better electrical characteristics and efficiency. Further, microstructure of electrodes is obtained electrochemical performance in the 18650 cylindrical cells with targeted capacity of 1.5 Ah. The slurry of electrodes prepared by single step and multiple steps of addition of NMP solvent and its effect on the fabrication of 1.5 Ah cells. A three-step solvent addition on slurry has been found to be a lower internal resistance than a single-step electrode slurry as confirmed by the EIS analysis, yielding improved electrical properties and efficiency.

Effects of Monosaccharides and Disaccharides on the Rheological Behavior of Dense Alumina Slurries I. Creep Testing Method

  • Kim, Jong-Cheol;Auh, Keun-Ho;Chr
    • The Korean Journal of Ceramics
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    • v.5 no.2
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    • pp.104-109
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    • 1999
  • Rheological properties of dense slurries over 45 volume % with different monosaccharides and disaccharides were checked in order to increase the solid content of dense slurries without sacrificing plasticity using creep testing method. Strain in creep test showed good correlations with Burger model which is expressed as an exponential function of time. Among several monosaccharides and disaccharides studied here, fructose and sucrose were most effective in making dense alumina slurry plastic than other monosaccharides and disaccharides like glucose, galactose, xyloss and maltose. In the case of dense alumina slurry with sucrose, sucrose content or additional water content enhanced to the plasticity of the slurries.

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Comparison of the rheologies of laterite and goethite suspensions

  • James, David F.;Blakey, Brian C.
    • Korea-Australia Rheology Journal
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    • v.16 no.3
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    • pp.109-115
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    • 2004
  • Comparisons in shear behaviour are made between aqueous suspensions of a laterite ore and aqueous suspensions of pure goethite ($\alpha$-FeOOH), following prior papers in which the rheologies of the two mineral suspensions were characterized individually. Drawing comparisons is appropriate because the ore sample was about 65% goethite and it was originally thought that the pure goethite might serve as a model of the more complex laterite. Viscosity measurements of the two suspensions show that, at the same solids fraction, the goethite suspensions were more viscous by an order of magnitude, even though the goethite particles had much smaller aspect ratios. Similarly, yield stresses for the goethite suspensions were at least an order of magnitude higher. The most significant difference was in transient behaviour. Time-dependent effects were investigated by subjecting a fluid to a step change or a ramp sequence in shear rate, and measuring the resulting shear stress over time. In most cases, transient behaviour could not be detected in the goethite suspensions, whereas stresses in the laterite suspensions relaxed over periods of order 10 seconds. The disparate results indicate that a goethite suspension is a poor model of a laterite slurry.

The Fabrication and Electrical Properties of PMS-PZT Ceramics using a Tape Casting Method (Tape Casting법에 의한 PMS-PZT계 세라믹스 제조 및 전기적 특성)

  • Jung, Hyun-Jae;Na, Eun-Sang;Choi, Sung-Churl
    • Journal of the Korean Ceramic Society
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    • v.38 no.9
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    • pp.860-865
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    • 2001
  • After manufacturing 2mol% CdO substitute $0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.95Pb(Zr_{0.52}Ti_{0.48})O_3$ piezoelectric ceramics powder as starting material, to manufacture green sheets using Doctor Blade method. The optimum composition of slurry was studied. Moreover, the sintering properties and the dielectric and piezoelectric properties with variation a thickness of the manufactured sheets were investigated. The optimum of slurry was investigated by the rheology with addition of additives, the sintering condition was decided by TGA. And the properties of sheet were investigated through SEM. XRD. The optimum of slurry was the stablest at dispersant 3.0 wt% to solid loading 30vol%. After, at addition of binder/plasticizer(0.75/0.25) 3.0wt%, viscosity was 7.55Pa${\cdot}$s. The dielectric and piezoelectric properties of the sheet were increased a little with the increasing of sintering temperature but were not variable with variation of sheet thickness.

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The Effects of Surfactants on the Rheological Properties of Concentrated Coal-Water Slurry (고농도 석탄-물 슬러리계의 유변적 성질에 미치는 계면 활성제의 영향)

  • 서호준
    • The Korean Journal of Rheology
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    • v.9 no.1
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    • pp.1-5
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    • 1997
  • 새로이 합성한 계면확성제와 대표적 분산용 계면활성제의 분산효과를 상호 비교해 보기 위하여 고농도 석탄-물 슬러리계에 대한 유변학ㅈ거 성질을 측정하였다. 0~$25^{\circ}C$ 온도 범위에서 얻어진 유동곡선으로부터 여러 가지 유동 파라미터를 구한 결과, PS가 상대적으로 structure factor, C2와 shear modulus, $\chi$2/$\alpha$2 값에 있어서 큰 감소를 보여 주엇으며 특히 shear modulus는 계면활성제의 종류에 따라 큰차이를 보여주었다. 이러한 현상을 PS가 다 가음이곤 고분자 전해질과 유사한 구조를 갖고있어서 석탄 입자에 흡착시 입자간 정전기적 반발과 입체장애를 초래하여 슬러리의 유동성을 향상시킨데 따른 결과로 해석된다.

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Computer Simulation for Die Filling Behavior of Semi-Solid Slurry of Mg Alloy

  • Lee, Dock-Young;Moon, Jung-Hwa;Seok, Hyun-Kwang;Kim, Sung-Bin;Kim, Ki-Bae
    • Journal of Korea Foundry Society
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    • v.27 no.1
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    • pp.31-35
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    • 2007
  • In order to develop the semi-solid forming technology for magnesium alloy the rheological and thixotropic behavior of Mg alloy slurry with varying shear rates and cooling rates was investigated and simulated with considering the viscosity based on microstructures and processing variables. The viscosity of slurry of Mg alloy (AZ91D) in semi-solid region was exponentially increased with a solid fraction, and was decreased with increasing a shear rate. In order to analyze precisely the rheological behavior, the ANYCAST program modified with the Carreau model and the different heat transfer coefficient between the cast and mold was used to simulate the flow behavior of Mg semi-solid slurry during the injection into a casting mold in a high pressure diecasting machine. The simulated rheological behavior of Mg alloy slurry was matched well with the experimental results.

Effects of chemical reaction on the polishing rate and surface planarity in the copper CMP

  • Kim, Do-Hyun;Bae, Sun-Hyuk;Yang, Seung-Man
    • Korea-Australia Rheology Journal
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    • v.14 no.2
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    • pp.63-70
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    • 2002
  • Chemical mechanical planarization (CMP) is the polishing process enabled by both chemical and mechanical actions. CMP is used in the fabrication process of the integrated circuits to achieve adequate planarity necessary for stringent photolithography depth of focus requirements. And recently copper is preferred in the metallization process because of its low resistivity. We have studied the effects of chemical reaction on the polishing rate and surface planarity in copper CMP by means of numerical simulation solving Navier-Stokes equation and copper diffusion equation. We have performed pore-scale simulation and integrated the results over all the pores underneath the wafer surface to calculate the macroscopic material removal rate. The mechanical abrasion effect was not included in our study and we concentrated our focus on the transport phenomena occurring in a single pore. We have observed the effects of several parameters such as concentration of chemical additives, relative velocity of the wafer, slurry film thickness or ash)tract ratio of the pore on the copper removal rate and the surface planarity. We observed that when the chemical reaction was rate-limiting step, the results of simulation matched well with the experimental data.