• Journal of Korean Society for Quality Management
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• v.21 no.2
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• pp.35-47
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• 1993

This study was performed to obtain the internal failure cost in the failure and rework using cost table. The manufacturing cost is different according to each production process. Thierefore, it is difficult to calculate of the manufacturing cost. Using the cost table internal failure cost can be calculated easily in each process.

• Journal of Korean Institute of Industrial Engineers
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• v.20 no.1
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• pp.3-13
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• 1994

The problem of selecting the optimal target values in a canning process is considered for situations where there is a linear shift in the mean of the content of a can which is assumed to be normally distributed with known variance. The target values are initial process mean, length of resetting cycle and controllable upper limit. Profit models are constructed which involve give-away, rework, and resetting costs. Methods of finding the optimal target values are presented and a nemerical example is given.

• Journal of Korean Society for Quality Management
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• v.26 no.3
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• pp.46-59
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• 1998

The problem of selecting optimal target values for the mean of the quality characteristic of interest for a production process in which an item is sold in one of two market with different profit / cost structures or reworked. Two profit models are constructed which involve four profit / cost components: profit, production, inspection, and rework costs. Assumed that the quality characteristic of interest is normally distributed, methods of finding the most profitable process mean are presented and a numerical example is given.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 1996.10a
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• pp.166-169
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• 1996

Well-evaluated quality of software can provide business proper decisions, increase productivity, and prevent financial loss or unnecessary burden of rework. Evaluation is important to ensure the chosen software conforming to organizational requirements, customer demands, and product integrity level. In this paper, we present a theoretical model with the structure of evaluation requirements to select the prioritized evaluation target input of software quality. Within limited time and budget, the prioritized target inputs of evaluation can be used to determine the appropriate evaluating step for each different category of requirements.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.16 no.28
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• pp.203-209
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• 1993

In Factory Automation environments such as FMS, the formation of machine-part based on GT should be considered. The purpose of this study is to develop a economic heuristic algorithm which considers various elements such as unit processing time, subcontract cost, and functional operation cost, machine processing capacity etc. When this proposed approach is applied to the real situation expected benefits are as follows: the reduction of production lead time work in process, labor force, tooling, rework and scrap, setup time, order time delivery, and paper work, etc.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.11 no.17
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• pp.81-85
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• 1988

This paper presents a model that considers combinations of rework, repair, replacement and scrapping. Policy-Iteration method of inspection is proposed for a serial manufacturing system whose repair cost, scrap cost and inspection cost. when it fails, can be formulated by Markovian approach. Policy-Iteration stops when new inspection policy is the same as previous inspection policy. A numerial example is presented.

• Journal of Korean Society for Quality Management
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• v.26 no.1
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• pp.172-191
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• 1998

In this paper, dimension tolerance design for components is studied. Three cost factors are considered: machining cost, rework cost, and loss related to product quality which is affected by the tolerances of components. We propose a procedure to determine the optimal tolerances of components and a, pp.y the procedure to design the tolerances of fine motion stage in semicoduct machine. We compare the proposed procedure with the existing model for determining tolerance economically.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korea Institute of Building Construction
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• v.17 no.6
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• pp.535-544
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• 2017

This paper analyzes the relations between design errors, prevented by building information modeling (BIM)-based design validation, and their impacts in order to identify critical consideration factors for implementing BIM-based design validation in architecture, engineering, and construction (AEC) projects. More than 800 design errors detected by BIM-based design validation in two BIM-based projects in South Korea are categorized according to their causes (illogical error, discrepancy, and missing item) and work types (structure, architecture, and mechanical, electrical, and plumbing (MEP)). The probabilistic relations among the independent variables, including the causes and work types of design errors, and the dependent variables, including the project delays, cost overruns, low quality, and rework generation that can be caused by these errors, are analyzed using logistic regression. The characteristics of each design error are analyzed by means of face-to-face interviews with practitioners. According to the results, the impacts of design error causes in predicting the probability values of project delays, cost overruns, low quality, and rework generation were statistically meaningful.