• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.407-410
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• 2000

(M $n_{l-x}$M $g_{l-x}$)F $e_{2+x}$ $O_4$(x=0.0, 0.025, 0.1, 0.2) for NTC(negative temperature coefficient) thermistor was prepared by calcining at 80$0^{\circ}C$ and sintering at from 1100 to 130$0^{\circ}C$ with 5$0^{\circ}C$ intervals while x was varied from 0.0 to 0.025, 0.1 and 0.2. The best linear property was obtained in the based specimen sintered at 120$0^{\circ}C$ with x=0.1 composition. Thermistor parameter, $B_{25~85^{\circ}C}$, was in the range of 5000~ 7300 [K]. Temperature coefficient of resistance, $\alpha$$_{25^{\circ}C}$, was -5.2 %/$^{\circ}C$. The results showed the possibility that Mn-Ni-Co based thermistor could be substituted by the composition used in this study was confirmed.med.d.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.3
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• pp.323-327
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• 2024

The low-temperature coefficient of resistance (TCR) is a crucial factor in the development of space-grade resistors for temperature stability. Consequently, extensive research is underway to achieve zero TCR. In this study, resistors were deposited by co-sputtering nickel-chromium-based composite compositions, metals showing positive TCR, with SiO₂, introducing negative TCR components. It was observed that achieving zero TCR is feasible by adjusting the proportion of negative TCR components in the deposited thin film resistors within certain compositions. Additionally, the correlation between TCR and deposition conditions, such as sputtering power, Ar pressure, and surface roughness, was investigated. We anticipate that these findings will contribute to the study of resistors with very low TCR, thereby enhancing the reliability of space-level resistors operating under high temperatures.

• Journal of Powder Materials
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• v.29 no.6
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• pp.505-510
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• 2022

The thermal shock resistance of cement composites with hollow glass microspheres (HGM) is investigated. Cement composites containing various concentrations of HGM are prepared and their properties studied. The density, thermal conductivity, and coefficient of thermal expansion of the composites decrease with increasing HGM concentration. A thermal shock test is performed by cycling between -60 and 50℃. After the thermal shock test, the compressive strength of the cement composite without HGM decreases by 28.4%, whereas the compressive strength of the cement composite with 30 wt% HGM decreases by 5.7%. This confirms that the thermal shock resistance of cement is improved by the incorporation of HGM. This effect is attributed to the reduction of the thermal conductivity and coefficient of thermal expansion of the cement composite because of the incorporation of HGM, thereby reducing the occurrence of defects due to external temperature changes.

• Proceedings of the SAREK Conference
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• 2005.11a
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• pp.311-316
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• 2005

The experimental study for an operational characteristics and performance of the sodium heat pipe were carried out. For an experiment. the heat pipe which is 1000mm length and 25.4mm diameter of stainless steel container with 50 mesh of screen wick using sodium as a working fluid is manufactured and tested as functions of heat flow rate, inclined angle and operating temperature. The test results are as follows. During the start-up. frontal start up was observed because of the vapor density increasing as increased the hot zone. Also, the heat pipe showed uniform temperature over than $420^{\circ}C$ of the operating temperature. The average heat transfer coefficient increased as the heat flux and the vapor temperature increase, and the range of the total thermal resistance was 0.075-0.04 $^{\circ}C/W$ at the 12-53.55 $kW/m^2$ of heat flux and $500-750^{\circ}C$of operating temperature. The maximum heat flow rate was 750W at the 10 degree of top heating mode.

• Corrosion Science and Technology
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• v.8 no.5
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• pp.193-196
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• 2009

For the estimation of uncertainty in potentiodynamic polarization resistance measurement, the type A uncertainty was measured using type 316 stainless steel in an acidified NaCl solution. Sensitivity coefficients were determined for measurand such as scan rate of potential, temperature of solution, concentration of NaCl, concentration of HCl, surface roughness of specimen and flow rate of purging gas. Sensitivity coefficients were large for the measurand such as the scan rate of potential, temperature of solution and roughness of specimen. However, the sensitivity coefficients were not the major factors influencing the combined standard uncertainty of polarization resistance due to the low values of uncertainty in measurements of the measurands. A major influencing factor was the concentration of NaCl. The value of type A uncertainty was 1.1 times the value of type B uncertainty, and the combined standard uncertainty was 10.5 % of the average value of polarization resistance.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.179-193
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• 2000

Aluminium titanate (Al₂TiO5) with an excellent thermal shock resistant and a low the expansion coefficient was obtained by solid solution with MgO, SiO₂, and ZrO₂ in the Al₂TiO5 lattice or in the grain boundary solution through electrofusion in an arc furnace. However, these materials have low mechanical strength due to the presence of microcracks developed by a large difference in thermal expansion coefficients along crystallographic axes. Pure Al₂TiO5 tends to decompose into α-Al₂O₃ and TiO₂-rutile in the temperature range of 750-1300℃ that rendered it apparently useless for industrial applications. Several thermal shock tests were performed: Long therm thermal annealing test at 1100℃ for 100h; and water quenching from 950 to room temperature (RT). Cyclic thermal expansion coefficients up to 1500℃ before and after decomposition tests was also measured using a dilatometer, changes in the microstructure, thermal expansion coefficients, Young's modulus and strengths were determined. The role of microcracks in relation to thermal shock resistance and thermal expansion coefficient is discussed.

• Journal of the Korean Ceramic Society
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• v.25 no.5
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• pp.431-436
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• 1988

The properties of scid-resistance to boiling HCl, thermal expansion coefficient and softening temperature of mother glass and glass-ceramic of LAS systems were investigated at the contents of SiO2 varing from 57 to 67wt%. The nucleation and growth of crystalline phase of LAS compositions were carried out at 50$0^{\circ}C$ and $700^{\circ}C$. The crystalline phase jconsists of lithium alumino silicate, lithum meta silicate, lithium disilicate, $\alpha$-crystobalite and $\alpha$-quartz. Lithium alumino silicate(virgilite) is the major crystalline phase in the glass ceramics. The degree of acid resistant property was increased in proportion with the silica content for both glass and ceramics. Glass-ceramic gives lower acid-resistance and thermal expansion coefficient while softening temperature shows higher for glass-ceramic than for mother glass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.134-138
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• 2000

The physical, electrical and piezoresitive characteristics of CrN(chromiun nitride) thin-films on silicon substrates have been investigated for use as strain gauges. The thin-film depositions have been carried out by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(5~25 %)$N_2$). The deposited CrN thin-films with thickness of $3500{\AA}$nd annealing conditions($300^{\circ}C$, 48 hr) in Ar-10 % $N_2$ deposition atmosphere have been selected as the ideal piezoresistive material for the strain gauges. Under optimum conditions, the CrN thin-films for the strain gauges is obtained a high electrical resistivity, $\rho=1147.65\;{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=-186 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=11.17.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05b
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• pp.135-141
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• 2000

The physical, electrical and piezoresitive characteristics of CrN(chromiun nitride) thin-films on silicon substrates have been investigated for use as strain gauges. The thin-film depositions have been carried out by OC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(5~25 %)$N_2$). The deposited CrN thin-films with thickness of $3500{\AA}$ and annealing conditions($300^{\circ}C$, 48 hr) in Ar-10 % $N_2$ deposition atmosphere have been selected as the ideal piezoresistive material for the strain gauges. Under optimum conditions, the CrN thin-films for the strain gauges is obtained a high electrical resistivity, $\rho=1147.65\;{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=-186 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=11.17.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.537-540
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• 2001

This paper presents the characteristics of Ta-N thin-film for high precision resistors, which were deposited on Si substrate by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(4~16 %)$N_2$). Structural properties studied using X-ray diffraction(XRD) indicate the presence of TaN, $Ta_3N_5$ or a mixture of Ta-N phases in the films depending on the amount of nitrogen in the sputtering gas. The chemical composition are investigated by auger electro spectroscopy(AES). The optimized conditions of Ta-N thin-film resistors were deposited in 4 % $N_2$ gas flow ratio. Under optimum conditions, the Ta-N thin-film resistors are obtained a high resistivity, $\rho=305.7{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=-36 $ppm/^{\circ}C$.