• Journal of the Korean Society for Precision Engineering
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• v.22 no.6 s.171
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• pp.144-151
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• 2005

Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.202-202
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• 2004

화합물 반도체는 초고속, 초고주파 디바이스에 적합한 재료인 갈큠비소(GaAs), 인듐-인산듐(InP) 등 2 개 이상의 원소로 구성되어 있고, 실리콘에 비해 결정내의 빠른 전자이동속도와 발광성, 고속동작, 고주파특성, 내열특성을 지니고 있어 발광 소자 (LED)와 이동통신(RE)소자의 개발 등에 다양하게 이용되고 있다. 이와 같이 화합물 반도체는 고부가가치의 첨단산업 부품들로 적용되는 만큼 생산제조 공정에 해당하는 연마, 본딩, 디본딩에 관한 방법과 기술에 대한 연구가 꾸준히 진행되고 있다.(중략)

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.122-123
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• 2002

현재 제철소 냉연공장에서는 수지처리 강판을 생산하기 위하여 수지 coater를 사용하고 있다. 그런데 강판의 이면 피복 시, applicator roll에 대한 back-up roll의 균일 하중 부하로 수지의 균일한 피복이 실현되나, 전면을 피복할 때 하중 부하를 위한 별도의 tool이 없는 상태로 강판의 hunting에 대응 불가능한 현장 layout으로 되어 전면 수지부착량 편차가 크게 발생되었다. (중략)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.551-552
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• 2007

Coating films were prepared from silane-terminated Colloidal silaca(CS) and UV-curable acrylate resin. The silane-terminated CSs were synthesized from CS and methyltrimethoxysilane(MTMS) and then treated with 3-methacryloxypropyltrimethoxysilane(MAPTMS)/3-glycidoxypropyltrimethoxysilane( GPTMS)/vinyltrimethoxysilane(VTMS) by sol-gel process, respectively. The silane-terminated CS and acrylate resin were hybridized using UV-curing system. Thin films of hybrid material were prepared using spin coater on the glass. Their hardness, contact angle and transmittance improved with the addition of silane-terminated CS.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2540-2543
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• 2008

Liquid crystal displays (LCD's) are continuously coated with some chemicals in the clean room of a factory. Spreading of these chemicals is causing serious problems both in controlling clean room quality as well as to the workers inside the factory. It is required to alleviate or properly control the offensive odor which is mainly composed of propylene glycol mono ethyl acetate, novolak resin and photo active compound. The control strategy employed is to bleed the offensive odor gas out the clean room. A full scale 3D CFD model was created with anisotropic porous media, chemical species transport with no volumetric reaction, and thermal diffusion with propane gas (tracer gas) to simulate the odor spreading. A segregated implicit solver with standard k-$\varepsilon$ model is employed. The detailed CFD analysis made it possible to develop an effective method of ventilating the coater room and optimizing their capacities.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.1
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• pp.199-206
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• 2005

Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process. In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.

• Korean Chemical Engineering Research
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• v.57 no.4
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• pp.519-524
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• 2019

Even though stainless steel foil is not a highly efficient material for film-type solar cell, it has strong passivation capability without additional process. In this study, silicone resin was employed during a-Si:H thin film solar cell fabrication for the purpose of planarization and electrical insulation. In the first stage of process, silicone resin was coat onto the stainless steel (STS) using spin coater with thickness of $2{\sim}3{\mu}m$ and followed by aluminum deposition using ion beam application. Unexpectedly buckling was formed during aluminum deposition process. After subsequent fabrication processes, solar cell performance was evaluated. In voltage-current data, slight increase of cell performance was obtained and interpreted by the increase of light scattering.

• Restorative Dentistry and Endodontics
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• v.18 no.1
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• pp.38-53
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• 1993

The purpose of this study was to observe the resin infiltration pattern into dentin by various dentin bonding agents. Freshley extracted 36 sound human molars were used in this study. They were stored at $4^{\circ}C$ physiologic saline solution before experiment. All the teeth were cross-sectioned to expose dentin below about 3.0mm at the cusp tip and above 2.0mm at the cemento-enamel junction with Crystal Cutter (MC411 D, Maruto Co., Japan), and were made into specimens for this study (Fig. 1). The specimen experimental groups were divided into 9 groups by dentin surface treatment as following procedures: Group I: Treated with Gluma Cleanser followed by Gluma Primer and Sealer Group 2. Treated with Gluma Cleanser followed by Scotch bond 2 Adhesive Group 3: Treated with Gluma Cleanser followed by Tenure Solution A, Band Visar Seal Group 4: Treated with Scotchprep followed by Scotch bond 2 Adhesive Group 5: Treated with Scotchprep followed by Gluma Primer and Sealer Group 6: Treated with Scotch prep followed by Tenure Solution A, Band Visar Seal Group 7: Treated with Tenure Conditioner followed by Tenure Solution A, Band Visar Seal Group 8: Treated with Tenure Conditioner followed by Scotchbond 2 Adhesive Group 9: Treated with Tenure Conditioner followed by Gluma Primer and Sealer 27 specimens of 36 specimens were divided into 9 groups (Group 1-9), and were used for observation of resin tags. Remaining 9 specimens were divided into 3 groups (Group 1,4 and 7), and were used for observation of fractured dentin surfaces. Specimens to observe the resin tag were demineralized with 20% HCl for 14 hours, specimens to observe the fractured dentin surfaces were demineralized with 10% HCl for 3 minutes. All the specimens were gold-coated with Eiko ion coater (Eiko-engineering Co.), and observed under Scanning electron microscope (Hitachi S-2300) at 20 KV. The following results were obtained: 1. In group 1 treated with Gluma Cleanser, Gluma Primer, and Sealer, most resin tags were more than $100{\mu}m$. 2. In group 4 treated with Scotch prep and Scotchbond 2 Adhesive, most resin tags were about $10{\mu}m$. 3. In group 7 treated with Tenure conditioner, Tenure Solution A, B, and Visar Seal, most resin tags were about $10{\mu}m$ but occasionally resin tags were more than $100{\mu}m$. 4. In groups 2,3,5,6,8 and 9, the lengths of resin tags were inconsistent and the amount of resin tags were reduced.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.503-507
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• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05a
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• pp.169-172
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• 2005

공정시 플라스틱 기판의 변형을 방지하기 위해 PC(Polycarbonate) 기판을 약 12시간 동안 pre-annealing시킨 다음 SiN(silicon nitride)와 PI(Poly-imide)를 각각 Sputter와 Spin-Coater를 이용하여 Coating하였다. 완성된 PC 기판위에 Themal Evaporation으로 Calsium을 증착한 뒤 Al을 올렸다. Calsium 증착 된면에 삼성 코닝의 글래스를 UV resin으로 부착 시킨 다음 상온에서 투습률을 측정하였다. 측정 간격은 12시간으로 하였으며 Calsium Test 의 정확도 향상을 위해 CCD Camera로 측정하여 컴퓨터로 분석하였다. 그래픽 저장 파일은 저장시 이미지 손실을 방지하기 위해 Bitmap방식을 그대로 사용 하였으며 정확도 향상을 위한 분석 프로그램은 MicroSoft 사의 Visual C++로 작성하였다. 화상 처리 면적은 컴퓨터 시스템의 처리 속도를 감안하여 70*70 으로 하였다.