• 제목/요약/키워드: Residual silicon

검색결과 170건 처리시간 0.02초

블리스터 시험법을 이용한 열증착 금박막의 기계적 성질 측정 (Measurement of Mechanical Properties of a Thermally Evaporated Gold Film Using Blister Test)

  • 문호정;함순식;엄윤용;조영호
    • 대한기계학회논문집A
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    • 제20권3호
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    • pp.882-890
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    • 1996
  • Mechanical properties, including Young's modulus, residual stress and rupture strength, of a thermally evaporated gold film have been measured form a blister test. In a theoretical study, the priniple of minimum potential energy and that of virtual work have been applied to the pressurized circular membrane problem, and load-deflection relations have been derived for typical membrane deflection mode of spheroidal shape. In an experimental study, circular gold membranes of 4800 A-thickness and 3.5mm diameter were fabricated by the silicon electropolishing technique. Mecahnical properties of the thin gold films were deduced from the load-deflection curves obtained by the blister test, Young's moduli, obtianed from blister test, have been in the range of 45-70 GPa, while those of bulk gold have been in the range of 78-80 GPa. Residual stresses in the evaporated gold films have been measured as 28-110MPa in tension, The rupture strength of the gold film has turned out to be almost equal to that of dental gold alloy (310-380MPa). It has been demonstrated that the present specimen fabrication method and blister test apparatus have been effective for simultaneous measurement of Young's modulus, residual stress and repture strength of thin solid films. Especially, the electropolishing technique employed here has provided a simple and practical way to fabricate thin membranes in a circular or an arbitrary shape, which could not be obtained by the conventional anisotropic silicon mecromachining technique.

Wear Transition in Alumina and Silicon Carbide Ceramics During Sliding

  • Cho, Seong-Jai;Kim, Dong-Jin;Ryu, Hyun
    • Tribology and Lubricants
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    • 제11권5호
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    • pp.26-30
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    • 1995
  • Sliding experiments have been conducted on alumina and silicon carbide ceramics. Wear and friction data of both materials indicate that wear proceeds in two distinct stages. The wear occurs by a relatively mild plastic-grooving process in the initial stage, but eventually gives way to a severe grain pull-out process after a defined period of sliding test. The datails of the transition mechanism are presented. The effects of grain size and second phase particle on the wear transition are also presented.

질화규소 세라믹볼의 구름피로수명 (Rolling Fatigue Life of Silicon Nitride Ceramic Balls)

  • 최인혁;박창남;최헌진;이준근;신동우
    • Tribology and Lubricants
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    • 제15권2호
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    • pp.150-155
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    • 1999
  • The rolling fatigue lives (RFL) of five kinds of silicon nitride balls were investigated. Four kinds of Si$_3$N$_4$balls were fabricated using different raw materials, sintering aids and sintering conditions. Commercially available Si$_3$N$_4$ball was also studied for comparison. All the balls were finished up to the dimensional accuracy of Grade 10 defined in KS B 2001 (Steel Balls fer Ball Bearings) with a size of 9.525 mm. RFL tests were then conducted under the initial theoretical maximum contact stress 6.38 GPa and the spindle speed 10,000 rpm. Gear oil was provided by oiled race as lubricant. The results of RFL test indicated the prerequisitic conditions for the long rolling life of Si$_3$N$_4$ball : (1) the high density, (2) microstructures consisted of small uniformly distributed grains, (3) little glassy phase in grainboundary, and (4) little crystalline phase and secondary phase that induces residual thermal stress due to the differences of thermal expansion coefficient with Si$_3$N$_4$phase.

Hertzian Crack Suppression and Damage Tolerance of Silicon Nitride Bilayer

  • Lee, Kee-Sung;Kim, Do-Kyung;Lee, Seung-Kun;Lawn, Brian R.
    • The Korean Journal of Ceramics
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    • 제4권4호
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    • pp.356-362
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    • 1998
  • Hertzian crack suppression phenomena and relatively high damage tolerance were investigated in hard/soft silicon nitride ($Si_3N_4$) bilayers. Coarse $\alpha}-Si_3N_4$ powder was wsed for the hard coating layer and fine $\alpha}-Si_3N_4$ powder was used for the soft substrate layer. The two layers were designed with a strong interface. Hertzian indentation was used to investigate contact fracture and damage tolerance property. Hertzian crack suppression has occurred with increasing applied load and decreasing coating thickness. The crack suppression contributed strength improvement, especially in the bilayers with thinner coatings. Ultimately, the combination of hard coating with soft but tough underlayer improved the damage tolerance of brittle $Si_3N_4$ ceramics.

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반응성 이온 식각에 의해 손상된 실리콘의 세정에 관한 연구 (A study on cleaning process of RIE damaged silicon)

  • 이은구;이재갑;김재정
    • E2M - 전기 전자와 첨단 소재
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    • 제7권4호
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    • pp.294-299
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    • 1994
  • CHF$_{3}$/CH$_{4}$Ar 플라즈마에 의해 형성된 산화막 식각 잔류물의 화학구조와 이 잔류물의 제거를 위한 세정방법을 x-ray photoelectron spectroscopy를 이용하여 조사하였다. 잔류무르이 구조는 CF$_{x}$-polymer와 Si-C, Si-O 결합으로 이루어진 SiO$_{y}$ C$_{z}$ 이었다. CF$_{4}$O$_{2}$ 플라즈마에 의한 silicon light etch는 산화막 식각 잔류물인 SiO$_{y}$ C$_{z}$ 층과 손상된 실리콘 표면을 제거하엿으며 NH$_{4}$OH-H$_{2}$O$_{2}$과 HF용액으로 완전히 제거되는 CF$_{x}$-polymer/SiO$_{x}$층을 남겼다. 100.angs.정도의 silicon light etch는 minority carrier life time과 thermal wave signal값을 초기 웨이퍼 수준까지 회복시켰으며 접합누설 전류도 거의 습식 식각 공정수준까지 감소시켰다.

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순도가 향상된 금속급 실리콘 제조를 위한 산침출 연구 (A Study of Acid Leaching for Metallurgical Grade Silicon Manufacturing Improved Purity)

  • 엄명헌;하범용
    • 한국산학기술학회논문지
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    • 제18권11호
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    • pp.118-123
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    • 2017
  • 다양한 산업에 사용되고 있는 금속급 실리콘(MG-Si, Metallurgical grade silicon)을 제조하기 위해 실리콘 원료 내 가장 많이 함유하고 있는 불순물인 알루미늄(Al) 및 철(Fe)을 제거하고자 산(Acid) 침출 실험을 수행하였다. 5가지 종류의 산(HCl, HF, H2SO4, HNO3, H3PO4)을 1, 2, 4, 6M로 조제하여 실리콘 원료에 반응시킨 결과, 1M 농도의 HF가 가장 우수한 Al 및 Fe 제거율을 나타내었으며 각각 97.9%와 95.2로 나타났다. 그러나 HF는 실리콘 부식 특성으로 인해 18% 가량의 수율 감소가 발생하였으며 이러한 수율감소를 최소화하기 위해 두 번째로 제거율이 우수하게 나타난 2M HCl과 혼합하여 실리콘 원료에 적용하였다. 혼합용액의 최적조건을 선정하기 위해 실험을 수행하여 $80^{\circ}C$, 2시간의 침출 최적조건으로 결정되었으며 이 혼합용액의 적용 결과 Al 및 Fe 잔류농도가 각각 141 ppmw 및 93ppmw로 나타나 3N급의 순도를 갖는 금속급 실리콘을 제조하기에 매우 용이한 것으로 확인되었다.

TiN박막의 증착특성에 미치는 플라즈마 화학증착변수들의 영향 (Effects of Deposition Variables on Plasma-Assisted CVD of TiN Films)

  • 이정래;김광호;신동원;박찬경
    • 한국세라믹학회지
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    • 제31권10호
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    • pp.1188-1196
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    • 1994
  • TiN films were deposited onto high speed steel(SKH9) and silicon wafer by plasma-assisted chemical vapor deposition(PACVD) using a TiCl4/N2/H2/Ar gas mixture. The effects of deposition temperature, R.F. power, and H2 concentration on the deposition of TiN were studied. The residual chlorine content and the microhardness of TiN films were also investigated. It was found that TiN films grew with a columnar structure of a strong (200) preferred orientation regardless of the substrate type and the deposition variables. The TiN films consisted of columnar-grains of about 50 to 100 nm in diameter. The columnar grains themselves contained much finer fibrous grains. As deposition temperature increased, the residual chlorine content decreased sharply. R. F. powder enhanced the deposition rate largely. Increasing of H2 concentration had little effect on the residual chlorine.

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초기변형 최소화를 위한 광변조 압전 다층박막 액추에이터의 설계, 제작 및 실험 (Design Fabrication and Test of Piezoelectric Multi-Layer Cantilever Microactuators for Optical Signal Modulation)

  • 김명진;조영호
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제49권9호
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    • pp.495-501
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    • 2000
  • This paper presents a method to minimize the initial deflection of a multi-layer piezoelectric microactuator without loosing its piezoelectric deflection performance required for light modulating micromirror devices. The multi-layer piezoelectric actuator composed of PZT silicon nitride and platinum layers deflects or buckles due to the gradient of residual stress. Based on the structural analysis results and relationship between process conditions and mechanical properties we have modified the fabrication process and the thickness of thin film layers to reduce the initial residual stress deflection without decreasing its piezoelectric deflection performance. The modified designs fabricated by surface-micromachining process achieved the 77% reduction of the initial deflection compared with that of the conventional method based on the measured micromechanical material properties is applicable to the design refinement of multi-layer MEMS devices and micromechanical structures.

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반응소결 SiC 재료의 미세조직 및 강도 특성 (Microstructure and Strength Property of Reaction Sintered SiC Materials)

  • 이상필;신윤석;이진경
    • 한국해양공학회:학술대회논문집
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    • 한국해양공학회 2004년도 학술대회지
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    • pp.380-385
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    • 2004
  • The efficiency of complex slurry preparation route for developing the high performance SiC matrix of RS-SiCf/SiC composites has been investigated. The green bodies for RS-SiC materials prior to the infiltration of nw/ten silicon were prepared with various C/SiC complex matrix slurries, which associated with both different sizes of starting SiC particles and blending ratios of starting SiC and carbon particles. The characterization of RS-SiC materials was examined by means of SEM, TEM, EDS and three point bending test. Based on the mechanical property-microstructure correlation, process optimization methodology is also discussed. The flexural strength of RS-SiC materials greatly depended on the content of residual Si. The decrease of starting SiC particle size in the C/SiC complex slurry was effective for improving the flexural strength of RS-SiC materials.

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