• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.3
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• pp.882-890
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• 1996

Mechanical properties, including Young's modulus, residual stress and rupture strength, of a thermally evaporated gold film have been measured form a blister test. In a theoretical study, the priniple of minimum potential energy and that of virtual work have been applied to the pressurized circular membrane problem, and load-deflection relations have been derived for typical membrane deflection mode of spheroidal shape. In an experimental study, circular gold membranes of 4800 A-thickness and 3.5mm diameter were fabricated by the silicon electropolishing technique. Mecahnical properties of the thin gold films were deduced from the load-deflection curves obtained by the blister test, Young's moduli, obtianed from blister test, have been in the range of 45-70 GPa, while those of bulk gold have been in the range of 78-80 GPa. Residual stresses in the evaporated gold films have been measured as 28-110MPa in tension, The rupture strength of the gold film has turned out to be almost equal to that of dental gold alloy (310-380MPa). It has been demonstrated that the present specimen fabrication method and blister test apparatus have been effective for simultaneous measurement of Young's modulus, residual stress and repture strength of thin solid films. Especially, the electropolishing technique employed here has provided a simple and practical way to fabricate thin membranes in a circular or an arbitrary shape, which could not be obtained by the conventional anisotropic silicon mecromachining technique.

• Tribology and Lubricants
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• v.11 no.5
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• pp.26-30
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• 1995

Sliding experiments have been conducted on alumina and silicon carbide ceramics. Wear and friction data of both materials indicate that wear proceeds in two distinct stages. The wear occurs by a relatively mild plastic-grooving process in the initial stage, but eventually gives way to a severe grain pull-out process after a defined period of sliding test. The datails of the transition mechanism are presented. The effects of grain size and second phase particle on the wear transition are also presented.

• Tribology and Lubricants
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• v.15 no.2
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• pp.150-155
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• 1999

The rolling fatigue lives (RFL) of five kinds of silicon nitride balls were investigated. Four kinds of Si$_3$N$_4$balls were fabricated using different raw materials, sintering aids and sintering conditions. Commercially available Si$_3$N$_4$ball was also studied for comparison. All the balls were finished up to the dimensional accuracy of Grade 10 defined in KS B 2001 (Steel Balls fer Ball Bearings) with a size of 9.525 mm. RFL tests were then conducted under the initial theoretical maximum contact stress 6.38 GPa and the spindle speed 10,000 rpm. Gear oil was provided by oiled race as lubricant. The results of RFL test indicated the prerequisitic conditions for the long rolling life of Si$_3$N$_4$ball : (1) the high density, (2) microstructures consisted of small uniformly distributed grains, (3) little glassy phase in grainboundary, and (4) little crystalline phase and secondary phase that induces residual thermal stress due to the differences of thermal expansion coefficient with Si$_3$N$_4$phase.

• The Korean Journal of Ceramics
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• v.4 no.4
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• pp.356-362
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• 1998

Hertzian crack suppression phenomena and relatively high damage tolerance were investigated in hard/soft silicon nitride ($Si_3N_4$) bilayers. Coarse $\alpha}-Si_3N_4$ powder was wsed for the hard coating layer and fine $\alpha}-Si_3N_4$ powder was used for the soft substrate layer. The two layers were designed with a strong interface. Hertzian indentation was used to investigate contact fracture and damage tolerance property. Hertzian crack suppression has occurred with increasing applied load and decreasing coating thickness. The crack suppression contributed strength improvement, especially in the bilayers with thinner coatings. Ultimately, the combination of hard coating with soft but tough underlayer improved the damage tolerance of brittle $Si_3N_4$ ceramics.

• Electrical & Electronic Materials
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• v.7 no.4
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• pp.294-299
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• 1994

CHF$_{3}$/CH$_{4}$Ar 플라즈마에 의해 형성된 산화막 식각 잔류물의 화학구조와 이 잔류물의 제거를 위한 세정방법을 x-ray photoelectron spectroscopy를 이용하여 조사하였다. 잔류무르이 구조는 CF$_{x}$-polymer와 Si-C, Si-O 결합으로 이루어진 SiO$_{y}$ C$_{z}$ 이었다. CF$_{4}$O$_{2}$ 플라즈마에 의한 silicon light etch는 산화막 식각 잔류물인 SiO$_{y}$ C$_{z}$ 층과 손상된 실리콘 표면을 제거하엿으며 NH$_{4}$OH-H$_{2}$O$_{2}$과 HF용액으로 완전히 제거되는 CF$_{x}$-polymer/SiO$_{x}$층을 남겼다. 100.angs.정도의 silicon light etch는 minority carrier life time과 thermal wave signal값을 초기 웨이퍼 수준까지 회복시켰으며 접합누설 전류도 거의 습식 식각 공정수준까지 감소시켰다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.82-82
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• 1996

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.11
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• pp.118-123
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• 2017

To manufacture MG-Si (Metallurgical grade silicon) for use in various industries, Acid leaching experiments were performed to remove aluminum (Al) and iron (Fe), which are the most common impurities found in the silicon raw material. The silicon raw material was reacted with five types of acids (HCl, HF, H2SO4, HNO3, H3PO4) at 1, 2, 4, and 6M; 1M HF showed the highest Al and Fe removal rates, 97.9% and 95.2%, respectively. HF, however, resulted in an 18% reduced yield due to the silicon corrosion properties. To minimize the yield reduction, 2M HCl, which has a second removal ratio result, was mixed with 1M HF and applied to the silicon raw material. The experiment was conducted to select the optimal conditions for the mixed solution, which were $80^{\circ}C$ and 2hr. Under the optimal conditions, the residual Al and Fe concentrations were 141 ppmw and 93 ppmw, respectively, and it very easy to produce MG-Si with 3N grade purity.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1188-1196
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• 1994

TiN films were deposited onto high speed steel(SKH9) and silicon wafer by plasma-assisted chemical vapor deposition(PACVD) using a TiCl4/N2/H2/Ar gas mixture. The effects of deposition temperature, R.F. power, and H2 concentration on the deposition of TiN were studied. The residual chlorine content and the microhardness of TiN films were also investigated. It was found that TiN films grew with a columnar structure of a strong (200) preferred orientation regardless of the substrate type and the deposition variables. The TiN films consisted of columnar-grains of about 50 to 100 nm in diameter. The columnar grains themselves contained much finer fibrous grains. As deposition temperature increased, the residual chlorine content decreased sharply. R. F. powder enhanced the deposition rate largely. Increasing of H2 concentration had little effect on the residual chlorine.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.9
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• pp.495-501
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• 2000

This paper presents a method to minimize the initial deflection of a multi-layer piezoelectric microactuator without loosing its piezoelectric deflection performance required for light modulating micromirror devices. The multi-layer piezoelectric actuator composed of PZT silicon nitride and platinum layers deflects or buckles due to the gradient of residual stress. Based on the structural analysis results and relationship between process conditions and mechanical properties we have modified the fabrication process and the thickness of thin film layers to reduce the initial residual stress deflection without decreasing its piezoelectric deflection performance. The modified designs fabricated by surface-micromachining process achieved the 77% reduction of the initial deflection compared with that of the conventional method based on the measured micromechanical material properties is applicable to the design refinement of multi-layer MEMS devices and micromechanical structures.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2004.05a
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• pp.380-385
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• 2004

The efficiency of complex slurry preparation route for developing the high performance SiC matrix of RS-SiCf/SiC composites has been investigated. The green bodies for RS-SiC materials prior to the infiltration of nw/ten silicon were prepared with various C/SiC complex matrix slurries, which associated with both different sizes of starting SiC particles and blending ratios of starting SiC and carbon particles. The characterization of RS-SiC materials was examined by means of SEM, TEM, EDS and three point bending test. Based on the mechanical property-microstructure correlation, process optimization methodology is also discussed. The flexural strength of RS-SiC materials greatly depended on the content of residual Si. The decrease of starting SiC particle size in the C/SiC complex slurry was effective for improving the flexural strength of RS-SiC materials.