• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.10 no.1
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• pp.1-6
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• 2004

Amount of residual ink solvent on the packaging materials from Korea, Japan and Europe was measured and compared. The amount of packaging materials from Korea was much higher than that of Japan and Europe. To reduce the residual amounts of ink solvent, aging condition of printed packaging materials including aging time and temperature was modified and evaluated. Aging with high temperature and short time ($60^{\circ}C$ and 24 hours) was more effective for reduction of residual amount of ink solvent than that with low temperature and long time. To find out change of reduction pattern of residual amount of solvent according to plastic packaging material, several monolayer and multilayer packaging materials were selected. Among the monolayer packaging materials, the amount of EVOH and PET was lower than that of polyolefin plastic film including PE and PP. PP/EVOH/PET among the selected multilayer film showed the lowest amount of residual ink solvent on food packaging materials. Result of this research revealed that the residual amount of ink solvent can be reduced by proper selection of aging condition with and by appropriate application of mutilayer plastic film.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.3
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• pp.119-125
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• 2004

Generally, it is used the compensation spring to compensate the inaccuracy of screen image induced by thermal deformation in CRT monitor. Its mechanism is bi-metallic system made of heterogeneous metals and these is bonded by laser welding. But laser welding induces the non-uniform temperature distribution and locally residual stress is yielded by these temperature deviation. This paper studies residual stress of laser weldment using FEA and hole drilling method. The results are followed. In the case of heterogeneous materials weldment, higher residual stress induced in the weldment region of SUS 304 which have larger CTE than Ni 36 and residual stress on the middle of specimen is higher by 10.9% than that of its surface Measured residual stress of SUS 304 yield 481MPa and that of Ni 36 is 140.5MPa in the vicinity of the welding region. And the residual distribution is very similar in comparison with FEA result.

• Journal of the Korean Ceramic Society
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• v.32 no.1
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• pp.120-130
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• 1995

To analyze the mechanical property and the residual stress in functionally gradient materials(FGMs), disctype TZP/Ni-and TZP/SUS304-FGM were hot pressed using powder metallurgy compared with directly bonded materials which were fabricated by the same method. The continuous interface and the microstructure of FGMs were characterized by EPMA, WDS, optical microscope and SEM. By fractography, the fracture behavior of FGMs was mainly influenced by the defects which originated from the fabrication process. And the defectlike cracks in the FGMs induced by the residual stress have been shown to cause failure. This fact has well corresponded to the analysis of the residual stress distribution by Finite Element Method (FEM). The residual stress generated on the interface (between each layer, and matrix and second phase, respectively) were dominantly influenced on the sintering temperature and the material constants. As a consequence, the interfacial stability and the relaxation of residual stress could be obtained through compositional gradient.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.10 no.1
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• pp.63-68
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• 2004

The regulations for migration amounts in USA, EU and Korea are investigated to compare the actual overall and specific migration date from plastic food packaging materials. Among the packaging materials regulated in above countries, printing ink solvents on packaging materials is used very widely and sometimes cause off-flavor in the food by migration of residual solvents. Even though migration of the residual solvents dose not generally cause safety problems in the contained food, it certainly can generate off-flavor and finally deteriorate quality of the finished product. Therefore regulation and development of analytical method for amount of residual ink solvents are very important issue in food industry. The headspace analytical method and tenax method for residual ink solvent on food packaging materials were evaluated from the accuracy, precise, swiftness and convenience of viewpoint. Headspace analytical method was selected and recommended for using in food industry field.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.5
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• pp.1190-1201
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• 1995

Photoelastic experiment has been restricted by three significant problems such as the problems of modeling for a complicated body, of development of experimental model material, and of residual stress in photoelastic specimen. The residual stress in photoelastic model materials is caused by molding, cutting and time effects, etc.. Especially, large residual stress exists on the interface of photoelastic model material for bi-material. Small residual stress occurred in the photoelastic model materials is usually neglected in the photoelastic experiments. But the residual stress provides some errors in the results of photoelastic experiments. In this paper, the stress optic law which can be effectively applied to the phtoelastic model materials with residual stress is developed. By using this stress optic law, we can obtain good results from isochromatic fringe patterns of photoelastic experiment specimen in which residual stress are involved. The stress optic law can be applied to obtain good results of photoelastic experiment from composite materials or bimaterials.

• Journal of Mechanical Science and Technology
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• v.17 no.11
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• pp.1674-1681
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• 2003

Photoelastic experiment has two significant problems. The first problem is manufacturing a model specimen for complicated shapes of structures. The second problem is residual stress contained in the photoelastic model material. In this paper, the stress optic law that can be effectively used on photoelastic model materials with residual stress is developed. By using the stress optic law as developed in this research, we can obtain good results in photoelastic experiments using model material in which residual stress is contained. It is assured that the stress optic law developed in this research is useful. Therefore, it is suggested that the stress optic law considering residual stress can be applied to the photoelastic experiment for the stress analysis of the composite materials or bi-materials in which the residual stress is easily contained.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.622-626
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• 2005

The Residual stress is stress at the inside of materials after plastic deformation. Certainly, this residual stress have an effect on fatigue life. Therefore, it is very important that understanding residual stress at the inside of materials. But in case of U-shaped Pipe that it is dealt with a mailer in this paper, distribution of residual stress is very complicated and exactly become unknown caused by difficulty of measurement. Then, in this paper, we are evaluated residual stress at in the inside of materials by finite clement method program and verified validity by test.

• Korea-Australia Rheology Journal
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• v.19 no.4
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• pp.183-190
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• 2007

Injection molding is one of the most common operations in polymer processing. Good quality products are usually obtained and major post-processing treatment is not required. However, residual stresses which exist in plastic parts affect the final shape and mechanical properties after ejection. Residual stresses are caused by polymer melt flow, pressure distribution, non-uniform temperature field, and density distribution. Residual stresses are predicted in this study by numerical methods using commercially available softwares, $Hypermesh^{TM},\;Moldflow^{TM}\;and\;ABAQUS^{TM}$. Cavity filling, packing, and cooling stages are simulated to predict residual stress field right after ejection by assuming an isotropic elastic solid. Thermo-viscoelastic stress analysis is carried out to predict deformation and residual stress distribution after annealing of the part. Residual stresses are measured by the hole drilling method because the automotive part selected in this study has a complex shape. Residual stress distribution predicted by the thermal stress analysis is compared with the measurement results obtained by the hole drilling method. The molded specimen has residual stress distribution in tension, compression, and tension from the surface to the center of the part. Viscoelastic deformation of the part is predicted during annealing and the deformed geometry is compared with that measured by a three dimensional scanner. The viscoelastic stress analysis with a thermal cycle will enable us to predict long term behavior of the injection molded polymeric parts.

• Korean Journal of Materials Research
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• v.3 no.1
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• pp.58-64
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• 1993

The degree of work hardening in the subsurface zones varied with the experimental conditions under the rolling contact fatigue wear test of high carbon Cr-Ti alloy steel was evaluated by the distribution of residual stresses. Surface residual stresses before the test did not affect the wear property. Surface residual stresses after the test decreased by the increase of contact stress and running. velocity. but the maximum compressive residual stress and its depth of saturation in the subsurface zone increased. The relationship between these experimental results and the distribution of the theoritical shear stress was also discussed.

• Korean Journal of Veterinary Service
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• v.25 no.3
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• pp.229-236
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• 2002

This study was carried out to compare the residual antibiotic materials in muscles of slaughter cattle and swine from slaughterhouses in Seoul from 2000 to 2001 by EEC-4-plate method, Charm II and HPLC method. 1. Residual antibiotic materials were detected from 95 samples(0.8%) by EEC-4-plate and 57 samples(10.2%) by Charm II. The final HPLC method determined the positives are 43(45.3%) and 27(47.3%) respectively. 2. The detection ratios were 45% by EEC-4-plate and 47% by Charm II. 3. Seventy samples were classified as tetracyclines 56(75.7.4%), sulfonamides 10(14.9%), $\beta$-lactam 6(8.1%) chloramphenicol 1(1.4%). Three of them were confirmed to be positive simmultaneously for tetracyclines, sulfonamides and chloramphenicol. 4. The highest residual concentration of chlortetracycline, oxytetracycline, sulfamethazine, sulfadimethoxine, sulfaquinoxaline, penicillin, ampicillin and chloramphenicol were 0.34, 11.29, 68.16, 0.13, 4.0, 0.12, 0.4 and 0.04ppm, respectively.