• Title/Summary/Keyword: Reliability Growth Rate

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Cost Implications of Imperfect Repair in Software Reliability

  • Chuiv, Nora-Ni;Philip J. Boland
    • International Journal of Reliability and Applications
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    • v.2 no.3
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    • pp.147-160
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    • 2001
  • The reliability of computer software is of prime importance for all developers of software. The complicated nature of detecting and removing faults from software has led to a plethora of models for reliability growth. One of the most basic of these is the Jelinski Moranda model, where it is assumed that there are N faults in the software, and that in testing, bugs (or faults) are encountered (and removed when defected) according to a stochastic process at a rate which at a given point in time is proportional to the number of bugs remaining in the system. In this research, we consider the possibility that imperfect repair may occur in any attempt to remove a detected bug in the Jelinski Moranda model. We let p represent the probability that a fault which is discovered or detected is actually perfectly repaired. The possibility that the probability p may differ before and after release of the software is also considered. The distribution of both the number of bugs detected and perfectly repaired in a given time period is studied. Cost models for the development and release of software are investigated, and the impact of the parameter p on the optimal release time minimizing expected costs is assessed.

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Reliability evaluation of Pb-free solder joint with immersion Ag-plated Cu substrate (Immersion Ag가 도금된 Cu기판을 가진 Pb-free solder 접합부의 신뢰성 평가)

  • Yun Jeong-Won;Jeong Seung-Bu
    • Proceedings of the KWS Conference
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    • 2006.05a
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    • pp.30-32
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    • 2006
  • The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

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A Study on the Effect of the Overload Ratio on the Fatigue Crack Growth Retardation (과대하중비가 균열성장지연에 미치는 영향에 관한 연구)

  • Kim, Kyung-Su;Kim, Sung-Chan;Shim, Chun-Sik;Park, Jin-Young;Cho, Hyung-Min
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2003.05a
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    • pp.306-311
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    • 2003
  • A growing fatigue crack is known to be retarded on application of an overload cycle. The retardation may be characterized by the total number of cycles involved during retardation and the retarded crack length. The overload ratio plays an important role to influence the retardation behavior. The objective of the present investigation is to study the effect of different overload ratio on the retardation behavior. For DENT(double edge notched tension) specimens and ESET(eccentrically-loaded single edge crack tension) specimens, fatigue crack growth tests are conducted under cyclic constant-amplitude loading including a single tensile overloading with different overload ratios. The proposed crack retardation model predicts crack growth retardation due to a single tensile overloading. The predictions are put into comparison with the experimental results to confirm the reliability of this model.

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Multivariate Analysis of Covariance on Characteristics Influencing Technological and Managerial Barriers of Technology Startups

  • Geonil Ko;Namjae Cho
    • Journal of Information Technology Applications and Management
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    • v.31 no.1
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    • pp.27-43
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    • 2024
  • This study investigated technological and managerial barriers in technology startups through a survey of 151 companies, yielding 118 responses (78.1% response rate). Factor and multivariate analyses identified two distinct barriers: technological and managerial. Reliability analysis validated the measurement tool. Using MANCOVA, 12 hypotheses were tested, incorporating six independent variables. Results revealed significant disparities in technological and managerial barriers based on establishment type, commercialization goals, growth stage, and commercialization stage, with 5 hypotheses supported. This study highlights the crucial role of these variables in understanding barriers within technology-based startups.

Modeling and Analysis of Warranty Cost for 2D-Policies Associated with Sale of Second-hand Products

  • Chattopadhyay G.;Yun Won-Young
    • International Journal of Reliability and Applications
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    • v.7 no.1
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    • pp.71-77
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    • 2006
  • The market for second hand products has been growing for a variety of reasons (e.g., new products appearing at a faster rate and the expected life of products increasing due to rapid advances in technology). The demand for warranties for second-hand products has been growing along with the growth of the market for second-hand products. Warranty for new products (consumer durables, industrial and commercial, and specialized defense products) has received a lot of attention. In contrast, warranties for second-hand product have received very little attention. Often, dealers of second-hand product such as cars offer 2D-warranties (Year and Kilometers). The expected warranty cost associated with a second-hand product for 2D-Policies is a function of the age of the item and its usage (as it affects failures over the warranty period), the warranty terms and the servicing strategy used by the dealer. This paper deals with development of models for warranty cost analysis along with the decision on sale price and warranty cover for 2D-Warranty policies associated with sale of second-hand products.

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Optimal capacity and allocation of distributed generation by minimum operation cost of distribution system (배전계통 운영비용의 최소화에 의한 분산전원의 최적용량과 위치결정)

  • Park, Jung-Hoon;Bae, In-Su;Kim, Jin-O;Shim, Hun
    • Proceedings of the KIEE Conference
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    • 2003.07a
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    • pp.360-362
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    • 2003
  • In operation of distribution system, DGs(Distributed Generations) are installed as an alternative of extension and establishment of substations, transmission and distribution lines according to increasing power demand. Optimal capacity and allocation of DGs improve power quality and reliability. This paper proposes a method for determining the optimal number, size and allocation of DGs needed to minimize operation cost of distribution system. Capacity of DGs for economic operation of distribution system can be estimated by the load growth and line capacity during operation planning duration. DG allocations are determined to minimize total cost with failure rate and annual reliability cost of each load point using GA(Genetic Algorithm).

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A Methodology for Estimating Reliability and Development Cost of a New Liquid Rocket Engine -focused on Staged Combustion Cycle with LOX/LH2 (액체로켓엔진의 신뢰도 및 개발비용 추정 방법 -LOX/LH2 다단연소 사이클을 중심으로)

  • Kim, Kyungmee O.;Hwang, Junwoo
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.42 no.5
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    • pp.437-443
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    • 2014
  • Engine is one of the most important parts in a rocket for completing its mission successfully. In this paper, we provide a methodology for estimating reliability and development cost of a liquid rocket engine newly developed. To estimate reliability, a baseline engine is selected considering factors whose effects on reliability are unquantifiable. Then reliability of a baseline engine is adjusted to reflect the effect of factors that can be modeled quantitatively. Using the previous Transcost engine cost expressed in terms of mass and the number of hot firing tests, the engine development cost is reexpressed in reliability and thrust requirements. Finally, a numerical example is given to illustrate the application of the methodology to a turbopump rocket engine using staged combustion cycle with LOX/LH2 propellant.

A study on the fault detection efficiency of software (소프트웨어의 결함 검출 효과에 관한 연구)

  • Kim, Sun-Il;Che, Gyu-Shik;Jo, In-June
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.4
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    • pp.737-743
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    • 2008
  • I compare my parameter estimation methodoloay with existing method, considering both of testing effort and fault detecting rate simultaneously in software reliability modeling. Generally speaking, fault detection/removal mechanism depends on how apply previous fault detection/removal and testing effort of S/W. The fault removal efficiency makes large influence to the reliability growth, testing and removal cost in developing stage S/W. This is very useful measure during all the developing stages and much helpful for the developer to estimate debugging efficiency, and furthermore, to anticipate additional working amount.

Reasonability of Logistic Curve on S/W (로지스틱 곡선을 이용한 타당성)

  • Kim, Sun-Il;Che, Gyu-Shik;Jo, In-June
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.1
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    • pp.1-9
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    • 2008
  • The Logistic cone is studied as a most desirable for the software testing effort. Assuming that the error detection rate to the amount of testing effort spent during the testing phase is proportional to the current error content, a software-reliability growth model is formulated by a nonhomogeneous Poisson process. Using this model the method of data analysis for software reliability measurement is developed. After defining a software reliability, This paper discusses the relations between testing time and reliability and between duration following failure fixing and reliability are studied SRGM in several literatures has used the exponential curve, Railleigh curve or Weibull cure as an amount of testing effort during software testing phase. However, it might not be appropriate to represent the consumption curve for testing effort by one of already proposed curves in some software development environments. Therefore, this paper shows that a logistic testing- effort function can be adequately expressed as a software development/testing effort curve and that it gives a good predictive capability based on real failure data.

A Study on the Reliability of S/W during the Developing Stage (소프트웨어 개발단계의 신뢰도에 관한 연구)

  • Yang, Gye-Tak
    • Journal of Korea Society of Industrial Information Systems
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    • v.14 no.5
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    • pp.61-73
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    • 2009
  • Many software reliability growth models(SRGM) have been proposed since the software reliability issue was raised in 1972. The technology to estimate and grow the reliability of developing S/W to target value during testing phase were developed using them. Most of these propositions assumed the S/W debugging testing efforts be constant or even did not consider them. A few papers were presented as the software reliability evaluation considering the testing effort was important afterwards. The testing effort forms which have been presented by this kind of papers were exponential, Rayleigh, Weibull, or Logistic functions, and one of these 4 types was used as a testing effort function depending on the S/W developing circumstances. I propose the methology to evaluate the SRGM using least square estimater and maximum likelihood estimater for those 4 functions, and then examine parameters applying actual data adopted from real field test of developing S/W.