• Title/Summary/Keyword: Relaxation of residual stress

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Analysis of Welding Residual Stresses and Heat Treatment used by Finete Element Method (유한요소법을 이용한 용접 잔류응력과 열처리 해석)

  • Lee, Bong-Yeol;Jo, Jong-Rae;Mun, Yeong-Hun
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.334-339
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    • 2003
  • The welding residual stress has on important effect on welding deformation, fatigue fracture, buckling strength, brittle fracture, etc. For the purpose of relaxation of welding residual stress, post welding heat treatment is widely used. In this paper, residual stresses were calculated by two dimensional thermal elasto-plastic analysis using finite element method. Heat transfer analysis are performed by transient analysis. Also structure analysis are carried out by of thermal-mechanical coupled analysis. Numerical analysis are used by ANSYS 5.7.

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Fatigue Life Analysis of Butt-welded specimen by Local Strain Approach (국부변형률방법을 이용한 용접시험편의 피로수명 해석)

  • Lee Dong-Hyong;Seo Jung-Won;Goo Byeong-choon;Seok Chang-Sung
    • Proceedings of the KSR Conference
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    • 2003.10c
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    • pp.73-78
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    • 2003
  • The residual stresses and. distortions of structures by welding exert negative effect on the safety of railroad structures. This investigation performs a thermal elasto-plastic analysis using finite element techniques to evaluate residual stresses in butted-welded joint. Considering this initial residual stresses, local stress and strain at the critical location (weld toe) during the loading were analyzed by elastic plastic finite element analysis. Fatigue crack initiation life and fatigue crack propagation life of butt-welded specimen were predicted by local strain approach and Neuber's role and Paris law. It is demonstrated that fatigue life estimates by local strain approach closely approximate the experimental results.

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The Improvement of Electrical Characteristics of Inkjet-printed Cu films with Stress Relaxation during Thermal Treatment (잉크젯 프린팅된 Cu 박막의 응력해소를 통한 전기적 특성 개선)

  • Yi, Seol-Min;Joo, Young-Chang
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.57-62
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    • 2014
  • Using flexible bismaleimide-triazine co-polymer as a substrate, inkjet-printed Cu films were also investigated for low-cost and process feasibility of flexible electronics. After annealing at $200^{\circ}C$ for 1 h under various reducing ambient, surface color was changed to red and electrical resistivity was decreased to the level of conductor under formic acid ambient. However, its resistivity was much higher than conventional copper films due to surface crack. In order to reduce the residual film stress after annealing, additional isothermal treatment was inserted before anneal hiring the stress relaxation applied in processes of amorphous materials. As a result, no surface crack was observed and electrical resistivity of $3.4{\mu}{\Omega}cm$ was measured after annealing at $230^{\circ}C$ with stress relaxation while electrical resistivity of $7.4{\mu}{\Omega}cm$ was observed after normal annealing without relaxation. The effect of stress relaxation was also confirmed by observing surface crack after decreasing the relaxation time to 0 min.

Experiments and Finite Element Analysis for the Estimation of Stress Relief in Welded Structures (반복 하중을 받는 용접 구조물의 잔류 응력 저감 파악을 위한 유한요소 해석 및 실험적 연구)

  • Yang, Yong-Sic;Kang, Joong-Kyoo;Lee, Jang-Hyun;Kim, Sung-Chan;Hwang, Se-Yum
    • Journal of the Society of Naval Architects of Korea
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    • v.48 no.3
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    • pp.238-245
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    • 2011
  • Welding inevitably introduces the residual stresses which affect the fatigue strength of the joint structure. The mitigation of fatigue strength depends on the residual stress magnitude and distribution. Stress relief analyses are of practical interest for all cyclic loaded welded structures, such as ships and offshore structures. In order to estimate the effects of relaxation of residual stresses in the welded structure, this paper presents a finite element analysis procedure and experimental results for the welded structure. Cruciform specimens joint by MAG welding have been tested to measure the released stress. Relieved welding residual stresses obtained by finite element analysis are compared with those measured by experiment.

Effects of Cryogenic Treatment Cycles on Residual Stress and Mechanical Properties for 7075 Aluminum Alloy (극저온 열처리가 7075 알루미늄 합금의 잔류응력과 기계적 특성에 미치는 영향)

  • Kim, Hoi-Bong;Jeong, Eun-Wook;Ko, Dae-Hoon;Kim, Byung-Min;Cho, Young-Rae
    • Korean Journal of Materials Research
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    • v.23 no.1
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    • pp.18-23
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    • 2013
  • In this study, the effects of cryogenic treatment cycles on the residual stress and mechanical properties of 7075 aluminum alloy (Al7075) samples, in the form of a tube-shaped product with a diameter of 500 nm, were investigated. Samples were first subjected to solution treatment at $470^{\circ}C$, followed by cryogenic treatment and aging treatment. The residual stress and mechanical properties of the samples were systematically characterized. Residual stress was measured with a cutting method using strain gauges attached on the surface of the samples; in addition, tensile strength and Vickers hardness tests were performed. The detailed microstructure of the samples was investigated by transmission electron microscopy. Results showed that samples with 85 % relief in residual stress and 8% increase in tensile strength were achieved after undergoing three cycles of cryogenic treatments; this is in contrast to the samples processed by conventional solution treatment and natural aging (T4). The major reasons for the smaller residual stress and relatively high tensile strength for the samples fabricated by cryogenic treatment are the formation of very small-sized precipitates and the relaxation of residual stress during the low temperature process in uphill quenching. In addition, samples subjected to three cycles of cryogenic treatment demonstrated much lower residual stress than, and similar tensile strength compared to, those samples subjected to one cycle of cryogenic treatment or artificial aging treatment.

Influences of Cooling Conditions on the Thermally-Induced Birefringence in Injection Molding (사출성형 냉각조건이 열에 의한 복굴절에 미치는 영향)

  • Lee, H.S.;Isayev, A.I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.10a
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    • pp.258-261
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    • 2007
  • Simulations of the thermally-induced residual stresses and birefringence in freely quenched plates of polycarbonate were performed by using the linear viscoelastic and photoviscoelastic constitutive equations for the mechanical and optical properties, respectively, and the first order rate equation for volume relaxation. The predictions for the birefringence showed good agreement with experimental measurements. Based on the simulation, the influences of various cooling conditions on the residual stress and birefringence in plates were investigated. The residual stress and birefringence increased with increasing initial temperature, decreasing coolant temperature and increasing heat transfer coefficient of coolants.

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Effect of Annealing on c-axis Orientation of $PbTiO_3$ Thin Films by D.C magnetron Reactive Sputtering (D.C Magnetron Reactive Sputtering 법으로 증착한 $PbTiO_3$ 박막의 열처리에 따른 c-축 배향성의 변화)

  • 이승현;권순용;최한메;최시경
    • Journal of the Korean Ceramic Society
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    • v.33 no.7
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    • pp.802-808
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    • 1996
  • PbTiO3 thin films were fabricated onto MgO(100) single crystal substrate by reactive D. C magnetron sput-tering of Pb and Ti metal in an oxygen and argon gas mixture. The annealing of the thin films resulted in the decrease of both the c-axis orientation ratio and the lattice parameter. It is well known that the c-axis lattice parameter of thin film is dependent on the Pb/(Pb+Ti)ratio and the residual stress in the film The PbTiO3 thin films with a Pb/(Pb+T) ratio ranging from 0.45 to 0.57 were fabricated and annealed. The structure of the film the c-axis orientation ratio and the lattice parameter were not dependent on the Pb/(Pb+Ti) ratio before and after annealing. These experimental results proved that the decrease of the c-axis lattice parameter under the annealing conditions was due to the relaxation of the intrinsic stress in the film. This relaxation of the intrinsic stress caused the decrease of the c-axis orientation ratio and this phenomenon can be explained by c-axis growth lattice model.

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Curing Induced Residual Stresses in Laminated Cylindrical Shells

  • Lee, Soo-Yong
    • Journal of Mechanical Science and Technology
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    • v.14 no.1
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    • pp.19-29
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    • 2000
  • A viscoelastic finite element analysis is presented to investigate residual stresses occurred in a laminated cylindrical shell during cure. An incremental viscoelastic constitutive equation that can describe stress relaxation during the cure is derived as a recursive formula which can be used conveniently for a numerical analysis. The finite element analysis program is developed on the basis of a 3-D degenerated shell element and the first order shear deformation theory, and is verified by comparing with an one dimensional exact solution. Viscoelastic effect on the residual stresses in the laminated shell during the cure is investigated by performing both the viscoelastic and linear elastic analyses considering thermal deformation and chemical shrinkage simultaneously. The results show that there is big difference between viscoelastic stresses and linear elastic stresses. The effect of cooling rates and cooling paths on the residual stresses is also examined.

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The influence of residual stress on the engineering behaviour of rock (잔류응력이 암석의 공학적 거동에 끼치는 영향)

  • 박형동
    • Tunnel and Underground Space
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    • v.5 no.4
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    • pp.363-375
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    • 1995
  • Critical literature review in this study revealed that there can be a significant influence of the residual stress on the engineering properties of rock. The review also showed that few number of research works on the quantification of the influence was attributed to the limitation of the two classical measurement techniques, viz, X-ray diffraction and mechanical relaxation method. In this study, a new way of approach was sought based on the assumption that residual stress up to the failure. A series of hoop tests conducted onthe samples from the limb of Carboniferous Limestone in Clevedon, England, revealed that (i) there is no preferential orientations of microcracks and minerals which have been widely believed as the main source of the strength anisotropy of rock; (ii) the anisotropy of the tensile strength of the limestone results from the influence of the residual stress; (iii) since jointing commenced within the fold, residual stored strain energy has been released preferentially in the direction perpendicular to the major joints(o$^{\circ}$ and 90$^{\circ}$); (ⅳ) during the hoop test making it much easier to create tensile fracture in these directons, viz 45$^{\circ}$ and 135$^{\circ}$)was released during the hoop test making it much easier to create tensile fracture in these directions, viz 45$^{\circ}$and 135$^{\circ}$;(v) the direction in which the stored strain energy may be presumed to be the least, required the greatest work to cause failure.

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Study on Residual Stress in Viscoelastic Thin Film Using Curvature Measurement Method

  • Im, Young-Tae;Park, Seung-Tae;Park, Tae-Sang;Kim, Jae-Hyun
    • Journal of Mechanical Science and Technology
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    • v.18 no.1
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    • pp.12-19
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    • 2004
  • Using LSM (laser scanning method) , the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100$^{\circ}C$ and 20% at 150$^{\circ}C$ for two hours.