• Title/Summary/Keyword: Reference signal compensation circuit

Search Result 13, Processing Time 0.025 seconds

A Study on the Design of a ROIC for Uncooled Infrared Ray Detector Using Differential Delta Sampling Technique (차동 델타 샘플링 기법을 이용한 비냉각형 적외선 검출회로의 설계에 관한 연구)

  • Jung, Eun-Sik;Kwan, Oh-Sung;Lee, Po;Jeong, Se-Jin;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.24 no.5
    • /
    • pp.387-391
    • /
    • 2011
  • A uncooled infrared ray sensor used in an infrared thermal imaging detector has many advantages. But because the uncooled infrared ray sensor is made by MEMS (micro-electro-mechanical system) process variation of offset is large. In this paper, to solve process variation of offset a ROIC for uncooled infrared ray sensor that has process variation of offset compensation technique using differential delta sampling and reference signal compensation circuit was proposed. As a result of simulation that uses the proposed ROIC, it was possible to acquire compensated output characteristics without process variation of offsets.

A Low Jitter Delay-Locked Loop for Local Clock Skew Compensation (로컬 클록 스큐 보상을 위한 낮은 지터 성능의 지연 고정 루프)

  • Jung, Chae-Young;Lee, Won-Young
    • The Journal of the Korea institute of electronic communication sciences
    • /
    • v.14 no.2
    • /
    • pp.309-316
    • /
    • 2019
  • In this paper, a low-jitter delay-locked loop that compensates for local clock skew is presented. The proposed DLL consists of a phase splitter, a phase detector(PD), a charge pump, a bias generator, a voltage-controlled delay line(VCDL), and a level converter. The VCDL uses self-biased delay cells using current mode logic(CML) to have insensitive characteristics to temperature and supply noises. The phase splitter generates two reference clocks which are used as the differential inputs of the VCDL. The PD uses the only single clock from the phase splitter because the PD in the proposed circuit uses CMOS logic that consumes less power compared to CML. Therefore, the output of the VCDL is also converted to the rail-to-rail signal by the level converter for the PD as well as the local clock distribution circuit. The proposed circuit has been designed with a $0.13-{\mu}m$ CMOS process. A global CLK with a frequency of 1-GHz is externally applied to the circuit. As a result, after about 19 cycles, the proposed DLL is locked at a point that the control voltage is 597.83mV with the jitter of 1.05ps.

A 1.1V 12b 100MS/s 0.43㎟ ADC based on a low-voltage gain-boosting amplifier in a 45nm CMOS technology (45nm CMOS 공정기술에 최적화된 저전압용 이득-부스팅 증폭기 기반의 1.1V 12b 100MS/s 0.43㎟ ADC)

  • An, Tai-Ji;Park, Jun-Sang;Roh, Ji-Hyun;Lee, Mun-Kyo;Nah, Sun-Phil;Lee, Seung-Hoon
    • Journal of the Institute of Electronics and Information Engineers
    • /
    • v.50 no.7
    • /
    • pp.122-130
    • /
    • 2013
  • This work proposes a 12b 100MS/s 45nm CMOS four-step pipeline ADC for high-speed digital communication systems requiring high resolution, low power, and small size. The input SHA employs a gate-bootstrapping circuit to sample wide-band input signals with an accuracy of 12 bits or more. The input SHA and MDACs adopt two-stage op-amps with a gain-boosting technique to achieve the required DC gain and high signal swing range. In addition, cascode and Miller frequency-compensation techniques are selectively used for wide bandwidth and stable signal settling. The cascode current mirror minimizes current mismatch by channel length modulation and supply variation. The finger width of current mirrors and amplifiers is laid out in the same size to reduce device mismatch. The proposed supply- and temperature-insensitive current and voltage references are implemented on chip with optional off-chip reference voltages for various system applications. The prototype ADC in a 45nm CMOS demonstrates the measured DNL and INL within 0.88LSB and 1.46LSB, respectively. The ADC shows a maximum SNDR of 61.0dB and a maximum SFDR of 74.9dB at 100MS/s, respectively. The ADC with an active die area of $0.43mm^2$ consumes 29.8mW at 100MS/s and a 1.1V supply.