• Bulletin of the Korean Chemical Society
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• 제2권4호
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• pp.132-138
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• 1981

Ab initio molecular orbital calculations have been performed in an effort to determine which types of chemical interactions play essential roles for the system, , $H_2O+CH_2SH^+$, and $H_2O+ CH_2S$. The most important contribution to the interaction energy in controlling reaction path is the exchange repulsion energy, EX, which is largely responsible for the shape of the total interaction energy curve. In the ion-molecule reaction, prior protonation of thioformaldehyde or prior deprotonation of water leads to formation of the corresponding ionic adducts ($H_2O+CH_2SH$ and $HOCH_2S^-$), with no barrier to reaction, simulating specific acid and base catalysis, respectively, as in the case of formaldehyde. Otherwise, approach of water to thioformaldehyde gives rise to a completely repulsive interaction.

• Bulletin of the Korean Chemical Society
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• 제10권3호
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• pp.273-278
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• 1989

The gas-phase reactions of methyl formate with anions, $-NH_2,\;-OH,\;-CH_2CN$, are studied theoretically using the AM1 method. Stationary points are located by the reaction coordinate method, refined by the gradient norm minimization and characterized by the determination of Hessian matrix. Potential energy profiles and the stationary point structures are presented for all conceivable processes. Four reaction paths are found to be possible: formyl proton and methyl proton abstractions, carbonyl addition, and $S_N2$ process. For the most basic anion $-NH_2$ the proton abstraction path is favored, while in other case, $OH\;and\;-CH_2CN$, the carbonyl addition paths are favored. In all cases the $S_N2$ process is the most exothermic, but due to the relatively high activation barrier the process can be ruled out.

• 한국산업융합학회 논문집
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• 제9권1호
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• pp.13-19
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• 2006

The ozone produced by a dielectric barrier discharge device was injected into the exhaust gas to oxidize a part of NO to $NO_2$, and then the exhaust gas containing the mixture of NO and $NO_2$ was further treated in a catalytic reactor where both NO and $NO_2$ were reduced to $N_2$ in the presence of ammonia as the reducing agent. The $NO_2$ content in the mixture of NO and $NO_2$ was changed by the amount of ozone added to the exhaust gas. The experiments were primarily concerned with the effect of reaction temperature on the catalytic $NO_x$ reduction at various $NO_2$ contents. The increase in the $NO_2$ content by the ozone injection remarkably improved the performance of the catalytic $NO_x$ reduction, especially at low temperatures.

• 대한한방소아과학회지
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• 제35권3호
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• pp.128-137
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• 2021

Objective The purpose of this study was to confirm the effectiveness of coptidis rhizoma extract-ceramide complex on skin barrier, transepidermal water loss (TEWL) and pH reduction, and inflammation of the skin. Methods Coptidis rhizoma extract-ceramide complex was applied in 6-week-old Balb/C mice after dermatitis was induced. To confirm the skin condition changes, TEWL and pH were observed, and filaggrin in the stratum corneum of the skin was observed. Kallikrein-related peptidase (KLK) 7, Protease activated receptor (PAR)-2, Thymic stromal lymphopoietin (TSLP), and IL-4 were observed in the stratum corneum to confirm the changes in the inflammatory response. Results Filaggrin positive reaction was increased in the experiment group compared to the control group. TEWL and pH were lower in the experiment group compared to the control group. KLK7, PAR2, TSLP, and IL-4 positive responses were decreased in the experiment group compared to the control group. Conclusions It was confirmed that the coptidis rhizoma extract-ceramide complex can relieve the inflammatory response of atopic dermatitis by restoring the skin lipid barrier damage.

• 한국표면공학회지
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• 제56권6호
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• pp.443-450
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• 2023

SiC/SiC_f CMC is vulnerable to water vapor corrosion at a high temperature of 1500℃. So, EBC (Environmental Barrier Coating) materials are required to protect Si-based CMCs. Ytterbium silicates are reported to have coefficient of thermal expansion (CTE) similar to that of the base material, such as SiC/SiC_f CMC. When the EBC are materials exposed to high temperature environment, the interface between ytterbium silicates and SiC/SiC_f CMC is not separated, and the coating purpose can be safely achieved. For the perspective of EBC applications, thermally grown oxide (TGO) layer with different CTE is formed by the reaction with water vapor in EBC, which leads to a decrease in life time. In this study, we prepare two types of ytterbium silicates to observe the corrosion behavior during the expose to high temperature and water vapor. In order to observe this behavior, the steam-jet furnace is prepared. In addition, phase formation of these ytterbium silicates is analyzed with microstructures by the before/after steam-jet evaluation at 1500℃ for 100 h.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.239-240
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• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

• 한국지하수토양환경학회:학술대회논문집
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• 한국지하수토양환경학회 2000년도 창립총회 및 춘계학술발표회
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• pp.52-55
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• 2000

The effects of environmental conditions, initial dissolved oxygen concentrations, pH, and the presence of electron carrier vitamin B$_{12}$ , on the reduction rate of TNT by Fe$^{0}$ was Quantitatively analyzed using a batch reactor. In all experiments, TNT reduction was best described with a first order reaction and the reduction rate decreased with the increase in the initial DO concentration. However, the specific reaction rate did not decrease linearly with the increase in the initial DO concentration. In the presence of HEPES buffer 0.2 and 2.0 mM(pH 5.7$\pm$0.2), the specific reaction rate increased more than 5.8 times, which showed reduction rate is rather significantly influenced by the pH of the solution. To test the possibility of reaction rate enhancement, well-known electron carrier(or mediator), vitamin B$_{12}$ has augmented besides Fe$^{0}$ . In the presence of 8.0 $\mu\textrm{g}$/L of vitamin B$_{12}$ , the specific reaction rate increased as much as 14.6 times. The results indicate that the addition of trace amount of vitamin B$_{12}$ can be a promising rate controlling option for the removal of organics using a Fe$^{0}$ filled permeable reactive barrier.

• Bulletin of the Korean Chemical Society
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• 제34권8호
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• pp.2473-2479
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• 2013

The kinetics of the radical-polar molecule reaction $CH_3+HBr{\rightarrow}CH_4+Br$ has been studied at temperatures between 150 and 1000 K using classical dynamics procedures. Potential energy surfaces constructed using analytical forms of inter- and intramolecular interaction energies show a shallow well and barrier in the entrance channel, which affect the collision dynamics at low temperatures. Different collision models are used to distinguish the reaction occurring at low- and high-temperature regions. The reaction proceeds rapidly via a complex-mode mechanism below room temperature showing strong negative temperature dependence, where the effects of molecular attraction, H-atom tunneling and recrossing of collision complexes are found to be important. The temperature dependence of the rate constant between 400 and 1000 K is positive, the values increasing in accordance with the increase of the mean speed of collision. The rate constant varies from $7.6{\times}10^{-12}$ at 150 K to $3.7{\times}10^{-12}$ at 1000 K via a minimum value of $2.5{\times}10^{-12}\;cm^3\;molecule^{-1}\;s^{-1}$ at 400 K.

• Bulletin of the Korean Chemical Society
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• 제26권12호
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• pp.1953-1961
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• 2005

We have performed high-level quantum mechanical calculation for multiple proton transfer in HOCl + HCl and $H_2O$ + $ClONO_2$ on water clusters, which can be used as a model of the reactions on ice surface in stratospheric clouds. Multiple proton transfer on ice surface plays crucial role in these reactions. The structures of the clusters with 0-3 water molecules and the transition state structures for the multiple proton transfer have been calculated. The energies and barrier heights of the proton transfer were calculated at various levels of theory including multi-coefficient correlated quantum mechanical methods (MCCM) that have recently been developed. The transition state structures and the predicted reaction mechanism depend very much on the level of theory. In particular, the HF level can not correctly predict the TS structure and barrier heights, so the electron correlation should be considered appropriately.

• Nuclear Engineering and Technology
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• 제53권5호
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• pp.1612-1618
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• 2021

The fusion-barrier distribution is very sensitive to the structure of the colliding nuclei such as nuclear quadrupole and hexadecapole deformation parameters and their signs. If the nuclei that enter the fusion reaction are deformed, the barrier problem becomes complicated. Therefore the deformation parameters are taken into account in the calculations. In this study, Neuro-Fuzzy approach, ANFIS, method has been used for the estimation of ground-state quadrupole (𝜀₂) and hexadecapole (𝜀₄) deformation parameters for the nuclei. According to the results, the method is suitable for this task and one can confidently use it to obtain the data that is not available in the literature.