• Journal of Korean Society of Transportation
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• 제23권4호
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• pp.7-16
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• 2005

Rejected Takeoff Accidents are not common. but if occurred, it leads to big disaster From the year of 1959, when Jet Transport service opened, to the year of 2000, Rejected Takeoff accidents/incidents occurred total of 94 cases. All cases led to overrun, and major cause is to initiate stopping maneuvers over $V_1$, takeoff decision speed, according to National Transport Safety Board of America. Similar results are represented in Aviation Safety Reporting System of National Aeronautics and Space Administration. So I believe that it is worth studying if Airplane Flight Manual, which is the reference Performance criteria, is appropriate to operations of line pilots. The definition of $V_1$ has been revised a couple of times and Rejected Takeoff Certification Standards for Transport Airplanes was changed in 1998. It shows that up to now there are some portions unreasonable. This study focused on gathering the pilot's tendency for current Rejected Takeoff Procedures of K airlines and analyze the factors they concern. I chose B777 airplane and actually measured the recognition and reaction time of the rejected takeoff transitions through Simulators. And compared the results with the data of flight test and Airplane Flight Manual.

• Journal of the Microelectronics and Packaging Society
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• 제14권2호
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• pp.59-63
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• 2007

This paper presented a low-cost thick film gas sensor module, which was based on simple PCB (Printed Circuit Board) process. The proposed sensor module included a $NO_2/H_2$ gas sensor, a relative humidity sensor, and a heating element. The $NO_2/H_2$ gas and relative humidity sensors were realized by screen-printing $SnO_2,\;BaTiO_3$ nano-powders on IDTS (Interdigital Transducer) of a PCB substrate, respectively. At first 1% $H_2$ gas flowed into the sensor chamber. After 4 min, air filled the chamber while $H_2$ gas flow stopped. This experiment was performed repeatedly. The Identical procedure was used for the $NO_2$ detection. The result for sensing $H_2$ gas showed the increase of voltage from 0.8V to 3.5V due to the conductance increase and its reaction response time by hydrogen flow was 65 sec. $NO_2$ sensing results showed 2.7 V voltage drop due to the conductance decrease and its response time was 3 sec through a voltage monitoring.

• Journal of Radiation Protection and Research
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• 제42권1호
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• pp.33-41
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• 2017

Background: Phosphate rock and its by-product are widely used in various industries to produce phosphoric acid, gypsum, gypsum board, and fertilizer. Owing to its high level of natural radioactive nuclides (e.g., $^{238}U$ and $^{226}Ra$), the radiological safety of workers who work with phosphate rock should be systematically managed. In this study, $^{238}U$, $^{232}Th$, $^{226}Ra$, and $^{40}K$ levels were measured to analyze the transport characteristics of these radionuclides in the production cycle of phosphate rock. Materials and Methods: Energy dispersive X-ray fluorescence and gamma spectrometry were used to determine the activity of $^{238}U$, $^{232}Th$, $^{226}Ra$, and $^{40}K$. To evaluate the extent of secular disequilibrium, the analytical results were compared using statistical methods. Finally, the distribution of radioactivity across different stages of the phosphate rock production cycle was evaluated. Results and Discussion: The concentration ratios of $^{226}Ra$ and $^{238}U$ in phosphate rock were close to 1.0, while those found in gypsum and fertilizer were extremely different, reflecting disequilibrium after the chemical reaction process. The nuclide with the highest activity level in the production cycle of phosphate rock was $^{40}K$, and the median $^{40}K$ activity was $8.972Bq{\cdot}g^{-1}$ and $1.496Bq{\cdot}g^{-1}$, respectively. For the $^{238}U$ series, the activity of $^{238}U$ and $^{226}Ra$ was greatest in phosphate rock, and the distribution of activity values clearly showed the transport characteristics of the radionuclides, both for the byproducts of the decay sequences and for their final products. Conclusion: Although the activity of $^{40}K$ in k-related fertilizer was relatively high, it made a relatively low contribution to the total radiological effect. However, the activity levels of $^{226}Ra$ and $^{238}U$ in phosphate rock were found to be relatively high, near the upper end of the acceptable limits. Therefore, it is necessary to systematically manage the radiological safety of workers engaged in phosphate rock processing.

• Journal of Marine Life Science
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• 제7권1호
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• pp.29-36
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• 2022

Sea cucumber, Aposticopus japonicus, is a major invertebrate species in the coastal regions of Korea. To evaluate the short-term stress levels according to the releasing methods, this study investigated the gene expression profiles of heat shock protein 90 (HSP90) by real-time quantitative polymerase chain reaction. When the juvenile sea cucumbers were packed in the vinyl bag with oxygen followed by transportation for 30 min or air-exposed for 1 h, the HSP90 gene expression levels in the experimental groups were significantly increased compared to those of the control groups (transported group, p=0.001; air-exposed group, p=0.032). The experimental group at 6 h post-release by seed-spreading method and at 2~6 h post-release by underwater hose-releasing method on board a fishing boat showed that the levels of HSP90 gene expression were not statistically significant but decreased slightly compared to the control group (seed-spreading group, p=0.069; hose-releasing group, p=0.093). On the other hand, the HSP90 gene expression showed an increasing pattern as the time passed (~6 h) after underwater release of juvenile sea cucumbers by divers (p=0.061). These results suggest that HSP90 gene expression can be used to investigate short-term stress response and effective releasing methods of juvenile sea cucumbers.

• Journal of the Microelectronics and Packaging Society
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• 제29권3호
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.