• Title/Summary/Keyword: Rapid thermal process

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Durability Improvement of Functional Polymer Film by Heat Treatment and Micro/nano Hierarchical Structure for Display Applications (열처리와 복합구조화를 통한 디스플레이용 기능성 고분자 필름의 내구성 향상 연구)

  • Yeo, N.E.;Cho, W.K.;Kim, D.I.;Jeong, M.Y.
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.47-52
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    • 2018
  • In this study, the effects of the heat treatment and multi-scale hierarchical structures on the durability of the nano-patterned functional PMMA(Poly(methyl-methacrylate)) film was evaluated. The heat treatments that consisted of high-pressure/high-temperature flat pressing and rapid cooling process were employed to improve mechanical property of the PMMA films. Multi-scale hierarchical structures were fabricated by thermal nanoimprint to protect nano-scale structures from the scratch. Examination on surface structures and functionalities such as wetting angle and transmittance revealed that the preopposed heat treatment and multi-scale hierarchical structures are effective to minimize surface damages.

Recent Progress in Energy Harvesters Based on Flexible Thermoelectric Materials (유연한 열전소재를 이용한 에너지 하베스터 연구개발 동향)

  • Park, Jong Min;Kim, Seoha;Na, Yujin;Park, Kwi-Il
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.2
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    • pp.119-128
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    • 2022
  • Recent advancement of Internet of Things (IoT) and energy harvesting technology enable realization of flexible thermoelectric energy harvester (f-TEH), with technological prowess for use in biomedical monitoring system integrated applications. To expand a flexible thermoelectric energy harvesting platform, the f-TEH must be required for optimized flexible thermoelectric materials and device structure. In response to these demands related to thermoelectric energy harvesting, many research groups have investigated various f-TEHs applied as a power source for wearable electronics. As a key member of the f-TEH, film-based f-TEHs possess significant applicability in research to realize self-powered wearable electronics, owing to their excellent flexibility, low thermal conductivity, and convenient fabrication process. Thus, based on the rapid growth of thermoelectric film technology, this review aims to overview comprehensively the f-TEH made of various inorganic/organic thermoelectric materials including developed fabrication methods, high thermoelectric performance, and wide-range applications.

A Rapid and Simple Detection Assay for Rice Bacterial Leaf Blight by Recombinase Polymerase Amplification (벼 흰잎마름병의 신속하고 간편한 진단을 위한 Recombinase Polymerase Amplification 등온증폭법)

  • Kim, Shinhwa;Lee, Bong Choon;Kim, Hyun Ju;Choi, Soo Yeon;Seo, Su Jwa;Kim, Sang-Min
    • Research in Plant Disease
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    • v.26 no.4
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    • pp.195-201
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    • 2020
  • Rice bacterial leaf blight (BLB) by Xanthomonas oryzae pv. oryzae (Xoo) is considered to be one of the major rice diseases steadily occurring around the rice-producing countries. In this study, we developed a recombinase polymerase amplification (RPA) assay for the rapid, convenient and specific diagnosis of Xoo by targeting Xoo-specific transposase A gene. As the target gene can be amplified in 10 min without DNA extraction process and special equipment for temperature control, RPA for BLB can be useful and practical component for on-site diagnosis.

Microwave hybrid sintering of NTC themistor (마이크로파 하이브리드 소결법에 의한 NTC 서미스터의 제조)

  • 최영락;안진용;안주삼;백동규;최승철
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.8 no.3
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    • pp.508-512
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    • 1998
  • The NTC thermistors were sintered by using microwave hybrid heating method at $1100^{\circ}C$~$1300^{\circ}C$ and those electrical properties were investigated. The obtained $B_{25^{\circ}C/85^{\circ}C}$ values from temperature dependence of electrical resisitivity were around 3100~3200 K which were almost the same values as conventionally sintered ones. Compared with conventional sintering process, this process could complete whole sintering process within 20 minutes. This the processing time and energy consumption could be reduced through this rapid heating by using microwave hybrid heating.t there were showed only two peaks, glycolide melting peak and lower molecular weight melting peak without lauryl alcohol. Conversion increased slowly with the reaction time up to 50 minutes, and then gave a sudden increase above that. The reaction time to disappear in glycolide melting peak during polymerization was shortened with the increase of lauryl alcohol content. Zero-shear viscosity of polyglycolic acid decreased with the increase of free acid content in glycolide.ssional energy and bending hysteresis increased. \circled3 Surface characteristics such as friction coefficient and thickness variation of highly shrinkage fabrics became relatively roughened state. \circled4 Since stiffened and roughened characteristics of highly shrinkage fabrics, drapabilities of them were significantly lowered. Additionally thermal insulation property of high shrinkage fabric was higher than that of low shrinkage fabric due to bulky and thickened feature. From the results, it is considered that the silk fabrics with high filling shrinkage have the good bulkiness and heat keeping properties and thus they have the suitable characteristics for high quality men's and women's formal garments.

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A facile synthesis of transfer-free graphene by Ni-C co-deposition

  • An, Sehoon;Lee, Geun-Hyuk;Jang, Seong Woo;Hwang, Sehoon;Yoon, Jung Hyeon;Lim, Sang-Ho;Han, Seunghee
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.129-129
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    • 2016
  • Graphene, as a single layer of $sp^2$-bonded carbon atoms packed into a 2D honeycomb crystal lattice, has attracted much attention due to its outstanding properties. In order to synthesize high quality graphene, transition metals, such as nickel and copper, have been widely employed as catalysts, which needs transfer to desired substrates for various applications. However, the transfer steps are not only complicated but also inevitably induce defects, impurities, wrinkles, and cracks of graphene. Furthermore, the direct synthesis of graphene on dielectric surfaces has still been a premature field for practical applications. Therefore, cost effective and concise methods for transfer-free graphene are essentially required for commercialization. Here, we report a facile transfer-free graphene synthesis method through nickel and carbon co-deposited layer. In order to fabricate 100 nm thick NiC layer on the top of $SiO_2/Si$ substrates, DC reactive magnetron sputtering was performed at a gas pressure of 2 mTorr with various Ar : $CH_4$ gas flow ratio and the 200 W DC input power was applied to a Ni target at room temperature. Then, the sample was annealed under 200 sccm Ar flow and pressure of 1 Torr at $1000^{\circ}C$ for 4 min employing a rapid thermal annealing (RTA) equipment. During the RTA process, the carbon atoms diffused through the NiC layer and deposited on both sides of the NiC layer to form graphene upon cooling. The remained NiC layer was removed by using a 0.5 M $FeCl_3$ aqueous solution, and graphene was then directly obtained on $SiO_2/Si$ without any transfer process. In order to confirm the quality of resulted graphene layer, Raman spectroscopy was implemented. Raman mapping revealed that the resulted graphene was at high quality with low degree of $sp^3$-type structural defects. Additionally, sheet resistance and transmittance of the produced graphene were analyzed by a four-point probe method and UV-vis spectroscopy, respectively. This facile non-transfer process would consequently facilitate the future graphene research and industrial applications.

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Cu2ZnSn(S,Se)4 Thin Film Solar Cells Fabricated by Sulfurization of Stacked Precursors Prepared Using Sputtering Process

  • Gang, Myeng Gil;Shin, Seung Wook;Lee, Jeong Yong;Kim, Jin Hyeok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.97-97
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    • 2013
  • Recently, Cu2ZnSn(S,Se)4 (CZTSS), which is one of the In- and Ga- free absorber materials, has been attracted considerable attention as a new candidate for use as an absorber material in thin film solar cells. The CZTSS-based absorber material has outstanding characteristics such as band gap energy of 1.0 eV to 1.5 eV, high absorption coefficient on the order of 104 cm-1, and high theoretical conversion efficiency of 32.2% in thin film solar cells. Despite these promising characteristics, research into CZTSS based thin film solar cells is still incomprehensive and related reports are quite few compared to those for CIGS thin film solar cells, which show high efficiency of over 20%. I will briefly overview the recent technological development of CZTSS thin film solar cells and then introduce our research results mainly related to sputter based process. CZTSS thin film solar cells are prepared by sulfurization of stacked both metallic and sulfide precursors. Sulfurization process was performed in both furnace annealing system and rapid thermal processing system using S powder as well as 5% diluted H2S gas source at various annealing temperatures ranging from $520^{\circ}C$ to $580^{\circ}C$. Structural, optical, microstructural, and electrical properties of absorber layers were characterized using XRD, SEM, TEM, UV-Vis spectroscopy, Hall-measurement, TRPL, etc. The effects of processing parameters, such as composition ratio, sulfurization pressure, and sulfurization temperature on the properties of CZTSS absorber layers will be discussed in detail. CZTSS thin film solar cell fabricated using metallic precursors shows maximum cell efficiency of 6.9% with Jsc of 25.2 mA/cm2, Voc of 469 mV, and fill factor of 59.1% and CZTS thin film solar cell using sulfide precursors shows that of 4.5% with Jsc of 19.8 mA/cm2, Voc of 492 mV, and fill factor of 46.2%. In addition, other research activities in our lab related to the formation of CZTS absorber layers using solution based processes such as electro-deposition, chemical solution deposition, nano-particle formation will be introduced briefly.

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Property of Nickel Silicides with 10 nm-thick Ni/Amorphous Silicon Layers using Low Temperature Process (10 nm-Ni 층과 비정질 실리콘층으로 제조된 저온공정 나노급 니켈실리사이드의 물성 변화)

  • Choi, Youngyoun;Park, Jongsung;Song, Ohsung
    • Korean Journal of Metals and Materials
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    • v.47 no.5
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    • pp.322-329
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    • 2009
  • 60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

Ohmic Contact of Ti/Au Metals on n-type ZnO Thin Film (Ti/Au 금속과 n-type ZnO 박막의 Ohmic 접합 연구)

  • Lee, Kyoung-Su;Suh, Joo-Young;Song, Hoo-Young;Kim, Eun-Kyu
    • Journal of the Korean Vacuum Society
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    • v.20 no.5
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    • pp.339-344
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    • 2011
  • The Ohmic contact of Ti/Au metals on n-type ZnO thin film deposited on c-plane sapphire substrates by pulsed laser deposition was investigated by TLM (transfer length method) patterns. The Ti/Au metal films with thickness of 35 nm and 90 nm were deposited by electron-beam evaporator and thermal evaporator, respectively. By using the photo-lithography method, the $100{\times}100{\mu}m^2$ TLM patterns with $6{\sim}61{\mu}m$ gaps were formed. To improve the electrical properties as well as to decrease an interface states and stress between metal and semiconductor, the post-annelaing process was done in oxygen ambient by rapid thermal annealing system at temperature of $100{\sim}500^{\circ}C$ for 1 min. In this study, it appeared that the minimum specific contact resistivity shows about $1.1{\times}10^{-4}{\Omega}{\cdot}cm^2$ in $300^{\circ}C$ annealed sample, which may be originated from formation of oxygen vacancies of ZnO during an oxidation of Ti metal at the interface of Ohmic contacts.

Property of Nickel Silicides on ICP-CVD Amorphous Silicon with Silicidation Temperature (ICP-CVD 비정질 실리콘에 형성된 처리온도에 따른 저온 니켈실리사이드의 물성 변화)

  • Kim, Jong-Ryul;Choi, Young-Youn;Park, Jong-Sung;Song, Oh-Sung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.9 no.2
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    • pp.303-310
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    • 2008
  • We fabricated hydrogenated amorphous silicon(a-Si:H) 140 nm thick film on a $180\;nm-SiO_2/Si$ substrate with an inductively-coupled plasma chemical vapor deposition(ICP-CVD) equipment at $250^{\circ}C$. Moreover, 30 nm-Ni film was deposited with a thermal-evaporator sequently. Then the film stack was annealed to induce silicides by a rapid thermal annealer(RTA) at $200{\sim}500^{\circ}C$ in every $50^{\circ}C$ for 30 minuets. We employed a four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), and scanning probe microscope(SPM) in order to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure evolution, and surface roughness, respectively. We confirmed that nano-thick high resistive $Ni_3Si$, mid-resistive $Ni_2Si$, and low resistive NiSi phases were stable at the temperature of <300, $350{\sim}450^{\circ}C$, and >$450^{\circ}C$, respectively. Through SPM analysis, we confirmed the surface roughness of nickel silicide was below 12 nm, which implied that it was superior over employing the glass and polymer substrates.

Corrosion Behavior of $Y_2O_3$ Coating in an Electrolytic Reduction Process (전해환원공정에서 $Y_2O_2$ 코팅층의 부식거동)

  • Cho, Soo-Haeng;Hong, Sun-Seok;Kang, Dae-Seung;Jeong, Myeong-Soo;Park, Byung-Heong;Hur, Jin-Mok;Lee, Han-Soo
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.8 no.1
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    • pp.33-39
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    • 2010
  • The electrolytic reduction of a spent oxide fuel involves a liberation of the oxygen in a molten LiCl electrolyte, which results in a chemically aggressive environment that is too corrosive for typical structural materials. Accordingly, it is essential to choose the optimum material for the processing equipment that handles the high molten salt. In this study, hot corrosion studies were performed on bare as well as coated superalloy specimens after exposure to lithium molten salt at $675^{\circ}C$ for 216 h under an oxidizing atmosphere. The IN713LC superalloy specimens were sprayed with an aluminized NiCrAlY bond coat and then with an $Y_2O_3$ top coat. The bare superalloy reveals an obvious weight loss due to spalling of the scale by the rapid scale growth and thermal stress. The chemical and thermal stability of the top coat has been found to be beneficial for increasing to the corrosion resistance of the structural materials for handling high temperature lithium molten salts.