• Title/Summary/Keyword: Range cutting

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Relationship between Contents of Moisture and Chemical Components in Burley Tobacco after Heat Treatment (버어리종 열처리에 의한 수분과 화학성분의 상관성 분석)

  • 김용옥;장기철;정한주;김기환
    • Journal of the Korean Society of Tobacco Science
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    • v.23 no.1
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    • pp.40-44
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    • 2001
  • This study was carried out to investigate relationship between contents of moisture and chemical components in burley tobacco after heat treatment. Initial moisture contents of burley tobacco was 32% after cutting and casing. Burely cut tobaccos were treated at various temperature(10$0^{\circ}C$, 13$0^{\circ}C$, 145$^{\circ}C$ and 16$0^{\circ}C$) and time(0, 5, 10, 15, 20 and 30 min) in mechanical convection oven. Moisture contents of burley tobacco after heat treatment were in the range of 1.9% to 18.4%. Relationship between moisture contents and total sugar, pH, total volatile base, ammonial, L value of color, nicotine, nornicotine, and $\beta$-nicotyrine contents were positively correlated. Correlation between moisture contents and crude ash, ether extracts, 2,6-deoxyfructosazine, 2,5-deoxyfructosazine, a value of color, citric acid, m-xylene, ${\gamma}$-butyrolactone and 5-methyl-2-furfural were negative.

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A Study on the Characterization on Some Semiconuctor Materials by Neutron Activation Analysis. Characterization of Semiconductor Silicon

  • Lee Chul;Kwun Oh Cheun;Kim Ho Kun;Lee Jong Du;Chung Koo Soon
    • Bulletin of the Korean Chemical Society
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    • v.10 no.1
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    • pp.30-32
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    • 1989
  • Traces of nine elements, gold, arsenic, cobalt, chromium, copper, europium, hafnium, sodium and antimony in commercially available silicon crystals were determined by the instrumental neutron activation analysis using the single comparator method. The values of the concentrations of these elements in both single and polycrystals were found to decrease significantly to a low limiting level by simply washing and etching surface contaminants having been introduced during various steps of sample preparation and irradiation. However, the chromium levels in polycrystals were not easily decreased, these depending upon the cutting tools employed. The Sb-doped content in each semiconductor has been compared with the associated quantities such as the concentration and the conductivity range given by the sample donor. Uncertainty in the sodium analysis due to the fission neutron reaction by silicon itself was discussed.

Assessment of cerchar abrasivity test in anisotropic rocks

  • Erarslan, Nazife
    • Geomechanics and Engineering
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    • v.17 no.6
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    • pp.527-534
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    • 2019
  • There have been developed a number of methods to assess the abrasivity of rock materials with the increased use of mechanized rock excavation. These methods range from determination of abrasive and hard mineral content using petrographic thin section analysis to weight loss or development of wear flat on a specified cutting tool. The Cerchar abrasivity index (CAI) test has been widely accepted for the assessment of rock abrasiveness. This test has been considered to provide a reliable indication of rock abrasiveness for isotropic rocks. However, a great amount of rocks in nature are anisotropic. Hence, viability assessment of Cerchar abrasivity test for the anisotropic rocks is investigated in this research. The relationship between CAI value and quartz content for the isotropic rocks is well known in literature. However, a correlation between EQ, F-Schimazek value, Rock Abrasivity Index (RAI) and CAI of anisotropic rocks such as phyllite was done first time in literature with this research. The results obtained with this research show F-Schimazek values and RAI values should be considered when determination of the abrasivity of anisotropic rocks instead of just using Cerchar scratch test.

A Study on the Surface Polishing of Diamond Thin Films by Thermal Diffusion (열확산에 의한 다이아몬드 박막의 표면연마에 관한 연구)

  • Bae, Mun Ki;Kim, Tae Gyu
    • Journal of the Korean Society for Heat Treatment
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    • v.34 no.2
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    • pp.75-80
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    • 2021
  • The crystal grains of polycrystalline diamond vary depending on deposition conditions and growth thickness. The diamond thin film deposited by the CVD method has a very rough growth surface. On average, the surface roughness of a diamond thin film deposited by CVD is in the range of 1-100 um. However, the high surface roughness of diamond is unsuitable for application in industrial applications, so the surface roughness must be lowered. As the surface roughness decreases, the scattering of incident light is reduced, the heat conduction is improved, the mechanical surface friction coefficient can be lowered, and the transmittance can also be improved. In addition, diamond-coated cutting tools have the advantage of enabling ultra-precise machining. In this study, the surface roughness of diamond was improved by thermal diffusion reaction between diamond carbon atoms and ferrous metals at high temperature for diamond thin films deposited by MPCVD.

The principles of artificial intelligence and its applications in dentistry

  • Yoohyun Lee;Seung-Ho Ohk
    • International Journal of Oral Biology
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    • v.48 no.4
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    • pp.45-49
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    • 2023
  • Digital dentistry has witnessed significant advancements in recent years, driven by extensive research following the introduction of cutting-edge technologies such as CAD/CAM and 3D oral scanners. Until now, 2D images obtained via x-ray or CT scans were critical to detect anomalies and for decision-making. This review describes the main principles and applications of supervised, unsupervised, and reinforcement learning in medical applications. In this context, we present a diverse range of artificial intelligence networks with potential applications in dentistry, accompanied by existing results in the field.

Development of a Root-Removed Splice Grafting System for Cucurbitaceous Vegetables (1) - Analysis of Grafting Process and System Setting - (박과채소용 단근합접 접목시스템 개발(1) -작업공정 분석과 시스템 설정 -)

  • Kang, C.H.;Lee, S.K.;Han, K.S.;Lee, Y.B.;Choi, H.K.
    • Journal of Biosystems Engineering
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    • v.33 no.6
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    • pp.453-461
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    • 2008
  • This study was conducted to develop a root-removed splice grafting system for cucurbitaceous vegetables, mainly watermelon and cucumber seedlings, for the seedlings factories where currently most of seedlings grafting works are carried out by manual works. The major results of the study are as follows. The dimensions of rootstocks and scions, except cotyledon width, of root- removed splice grafting of watermelon and cucumber were shown to be varied within the 2.5-fold range. The growth status of seedlings were not consistent in terms of cotyledon sprouting direction and angle which were considered as one of the important factors for in root-removed splice grafting. The grafting work of root-removed splice for grafted watermelon and cucumber could be divided by four sub-operations: seedling supplying, cutting, clipping and potting, while a part or all root of the rootstock was removed in the seedlings supplying operation. The cutting angles of the rootstock and scion were $34-45^{\circ}$ and $20-45^{\circ}$, respectively, while the stem length of the scion varied from 6 mm to 12 mm. The splices of rootstock and scion were heaped up in parallel and then fixed by a clip. It indicated that the ideal grafting system, adopting conventional grafting processes of seedlings specifications as well as conventionally manual root-removed splice grafting method, performed very well for seedlings gripping and transporting, supplying clip, clipping and discharging grafted seedlings while workers supplied seedlings to the semi-automatical system.

Trend on the Recycling Technologies for Silicon Sludge by the Patent and Paper Analysis (특허(特許)와 논문(論文)으로 본 실리콘 슬러지의 재활용(再活用) 기술(技術) 동향(動向))

  • Jang, Hee-Dong;Kil, Dae-Sup;Chang, Han-Kwon;Cho, Young-Ju;Cho, Bong-Gyoo
    • Resources Recycling
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    • v.21 no.4
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    • pp.60-68
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    • 2012
  • Silicon wafer for making semiconductor devices and solar cell is used in the semiconductor and solar industry, respectively. Silicon wafer is produced by cutting with silicon ingot and sludge contains silicon occurs from cutting process. Generation of silicon sludge is increasing on developing all industry sectors which have need of semiconductor device. These days it has been widely studied for the recycling technologies of the silicon sludge from view points of economy and efficiency. In this paper, patents and paper on the recycling technologies of the silicon sludge were analyzed. The range of search was limited in the open patents of USA (US), European Union (EU), Japan (JP), Korea (KR) and SCI journals from 1982 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

High Quality Tissue Miniarray Technique Using a Conventional TV/Radio Telescopic Antenna

  • Elkablawy, Mohamed A.;Albasri, Abdulkader M.
    • Asian Pacific Journal of Cancer Prevention
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    • v.16 no.3
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    • pp.1129-1133
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    • 2015
  • Background: The tissue microarray (TMA) is widely accepted as a fast and cost-effective research tool for in situ tissue analysis in modern pathology. However, the current automated and manual TMA techniques have some drawbacks restricting their productivity. Our study aimed to introduce an improved manual tissue miniarray (TmA) technique that is simple and readily applicable to a broad range of tissue samples. Materials and Methods: In this study, a conventional TV/radio telescopic antenna was used to punch tissue cores manually from donor paraffin embedded tissue blocks which were pre-incubated at $40^{\circ}C$. The cores were manually transferred, organized and attached to a standard block mould, and filled with liquid paraffin to construct TmA blocks without any use of recipient paraffin blocks. Results: By using a conventional TV/radio antenna, it was possible to construct TmA paraffin blocks with variable formats of array size and number ($2-mm{\times}42$, $2.5-mm{\times}30$, $3-mm{\times}24$, $4-mm{\times}20$ and $5-mm{\times}12$ cores). Up to $2-mm{\times}84$ cores could be mounted and stained on a standard microscopic slide by cutting two sections from two different blocks and mounting them beside each other. The technique was simple and caused minimal damage to the donor blocks. H&E and immunostained slides showed well-defined tissue morphology and array configuration. Conclusions: This technique is easy to reproduce, quick, inexpensive and creates uniform blocks with abundant tissues without specialized equipment. It was found to improve the stability of the cores within the paraffin block and facilitated no losses during cutting and immunostaining.

Analysis of Patents on the Recycling Technologies for the Waste Silicon Sludge (폐실리콘 슬러지의 재활용(再活用) 기술(技術)에 관한 특허동향(特許動向) 분석(分析))

  • Kil, Dae-Sup;Jang, Hee-Dong;Kang, Kyung-Seok;Han, Hye-Jung
    • Resources Recycling
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    • v.17 no.4
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    • pp.66-76
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    • 2008
  • Silicon wafer is used in making semiconductor device of various forms in the semiconductor industry. Silicon wafer is produced by cutting silicon ingot and sludge containing silicon results from cutting process. The amount of silicon sludge is increasing owing to the usage of semiconductor device in many industry sectors. These days the recycling technologies of the waste silicon sludge has been widely studied from view point of economy and efficiency. In this study, patents on the recycling technologies of the waste silicon sludge were analyzed. The range of search was limited in the open patents of USA, European Union, Japan, and Korea up to september, 2007. Patents were collected using key-words and filtered by filtering criteria. The trend of the patents was analyzed by the years, countries, companies, and technologies.

Cutting and Conveying Characteristics for Development of Chinese Leek Harvester (부추 수확기 개발을 위한 예취 및 이송특성 구명)

  • Jun H. J.;Kim S. H.;Hong J. T.;Choi Y.
    • Journal of Biosystems Engineering
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    • v.30 no.4 s.111
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    • pp.220-228
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    • 2005
  • This study was conducted to investigate the main factors that contain a rotating velocity ratio between wheel and conveyor belt, a tilt angle of conveyor belt and a rotating velocity of a dick cutter for mechanization of Chinese leek harvest. In the survey on the cultivation of Chinese leek, row spacing of 350 m and cutting height of 10 mm from the ground were set up for field tests. Test equipment was designed to cut, pick up and convey Chinese leek one row by one row. From the results of material tests, pick-up height of conveyor belt was set up at $60\~90m$ from the bottom, and the strain and stress at rupture of Chinese leek was 0.487 m/m and 0.01078 MPa. An elastic coefficient of the rubber (Neoprene) of conveyor belts was 1.1077 under the strain of 0.3 nym. from the results of field tests, the tilt angle of conveyor belt was the range of $25^{\circ}\~30^{\circ}$ under consideration far space of container, the velocity ratio between vehicle and conveying belt was 1 to 2.4~1.7 at 0.1~0.3 m/s of vehicle, and optimum rotating velocity of the disk cutter was 34.8 m/s or more under consideration for soil friction.