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A Study of the Electrical Characteristics of WOx Material for Non-Volatile Resistive Random Access Memory (비-휘발성 저항 변화 메모리 응용을 위한 WOx 물질의 전기적 특성 연구)

  • Jung, Kyun Ho;Kim, Kyong Min;Song, Seung Gon;Park, Yun Sun;Park, Kyoung Wan;Sok, Jung Hyun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.5
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    • pp.268-273
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    • 2016
  • In this study, we observed current-voltage characteristics of the MIM (metal-insulator-metal) structure. The $WO_x$ material was used between metal electrodes as the oxide insulator. The structure of the $Al/WO_x/TiN$ shows bipolar resistive switching and the operating direction of the resistive switching is clockwise, which means set at negative voltage and reset at positive voltage. The set process from HRS (high resistance state) to LRS (low resistance state) occurred at -2.6V. The reset process from LRS to HRS occurred at 2.78V. The on/off current ratio was about 10 and resistive switching was performed for 5 cycles in the endurance characteristics. With consecutive switching cycles, the stable $V_{set}$ and $V_{reset}$ were observed. The electrical transport mechanism of the device was based on the migration of oxygen ions and the current-voltage curve is following (Ohm's Law ${\rightarrow}$ Trap-Controlled Space Charge Limited Current ${\rightarrow}$ Ohm's Law) process in the positive voltage region.

Two layered Secure Password Generation with Random Number Generator (난수 발생기를 이용한 이중화 구조의 안전한 비밀번호 생성 기법)

  • Seo, Hwa-Jeong;Kim, Ho-Won
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.18 no.4
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    • pp.867-875
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    • 2014
  • Rapid development of internet service is enabling internet banking services in anywhere and anytime. However, service access through internet can be exposed to adversary easily. To prevent, current service providers execute authentication process with user's identification and password. However, majority of users use short and simple password and do not periodically change their password. As a result of this, user's password could be exposed to attacker's brute force attack. In this paper, we presented enhanced password system which guarantee higher security even though users do not change their current password. The method uses additional secret information to replace real password periodically without replacement of real password.

Si3N4/AlN 이중층 구조 소자의 자가 정류 특성

  • Gwon, Jeong-Yong;Kim, Hui-Dong;Yun, Min-Ju;Kim, Tae-Geun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.306.2-306.2
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    • 2014
  • 전자기기의 휴대성과 이동성이 강조되고 있는 현대사회에서 비휘발성 메모리는 메모리 산업에 있어 매우 매력적인 동시에 커다란 잠재성을 지닌다. 이미 공정의 한계에 부딪힌 Flash 메모리를 대신하여 10nm 이하의 공정이 가능한 상변화 메모리(Phase-Change Memory, PRAM), 스핀 주입 자화 반전 메모리(Spin Transfer Torque-Magnetic RAM, STT-MRAM), 저항 변화 메모리(Resistive Random Access Memory, ReRAM)가 차세대 비휘발성 메모리 후보로서 거론되고 있으며, 그 중에서도 ReRAM은 빠른 속도와 낮은 소비 전력, CMOS 공정 호환성, 그리고 비교적 단순한 3차원 적층 구조의 특성으로 인해 활발히 연구되고 있다. 특히 최근에는 질화물 또는 질소를 도핑한 산화물을 저항변화 물질로 사용하는 ReRAM이 보고되고 있는데, 이들은 동작전압이 낮을 뿐만 아니라 저항 변화(Resistive Switching, RS) 과정에서 일어나는 계면 산화를 방지할 수 있으므로 ReRAM의 저항 변화 재료로서 각광받고 있다. 그러나 Cell 단위의 ReRAM 소자를 Crossbar Array 구조에 적용시켰을 때 주변 Cell과의 저항 상태 차이로 인해 전류가 낮은 저항 상태(LRS)의 Cell로 흘러 의도치 않은 동작을 야기한다. 이와 같이 누설 전류(Leakage Current)로 인한 상호간의 간섭이 일어나는 Cross-talk 현상이 존재하며, 공정의 간소화와 집적도를 유지하면서 이 문제를 해결하는 것은 실용화하기에 앞서 매우 중요한 문제이다. 따라서, 본 논문에서는 Read 동작 시 발생하는 Cell과 Cell 사이의 Cross-talk 문제를 해결하기 위해 자가 정류 특성(Self-Rectifying)을 가지는 실리콘 질화물/알루미늄 질화물 이중층(Si3N4/AlN Bi-layer)으로 구성된 ReRAM 소자 구조를 제안하였으며, Sputtering 방법을 이용하여 제안된 소자를 제작하였다. 전압-전류 특성 실험결과, 제안된 구조에 대한 에너지 밴드 다이어그램 시뮬레이션 결과와 동일하게 Positive Bias 영역에서 자가 정류 특성을 획득하였고, 결과적으로 Read 동작 시 발생하는 Cross-talk 현상을 차단할 수 있는 결과를 확보하였다.

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Improved Resistive Characteristic of Ti-doped AlN-based ReRAM

  • Gwon, Jeong-Yong;Kim, Hui-Dong;Yun, Min-Ju;Kim, Tae-Geun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.306.1-306.1
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    • 2014
  • 정보화 시대의 발전에 따라 점점 더 많은 정보를 더욱 빠르게 처리할 수 있는 기기들이 요구되고 있다. 메모리는 그 중에서 핵심적인 부품으로써 소자의 고집적화와 고속화가 계속 진행되면서 기존의 메모리 소자들은 집적화에서 그 한계에 도달하고 있다. 기존 소자들의 집적화의 한계를 극복하기 위하여 새로운 비휘발성 메모리 소자들이 제안되었다. 그 중 resistive switching random access memory(ReRAM)은 저항의 변화특성을 사용하는 메모리로 간단한 구조를 가지고 있기 때문에 집적화에 유리하다는 장점을 가지고 있다. 그 외에도 빠른 동작 속도와 낮은 전압에서의 동작이 가능하여 차세대 메모리로써 각광받고 있는 추세이다. 본 연구실에서는 이미 nitride 물질을 기반으로 한 여러 ReRAM 소자들을 제안해 왔다. 그 중 AlN-based ReRAM 소자는 빠른 동작 속도와 좋은 내구성을 보인 바 있다. 하지만 상업화를 위해서 해결해야 할 문제점들이 아직 존재하고 있다. 대표적으로 소자의 배열에서 각 소자의 균일한 동작이 보증되어야 하기 때문에 소자의 셋/리셋 전압의 산포를 줄이고 동작 전류 레벨을 낮추어야 할 필요성이 존재한다. 이러한 ReRAM의 이슈를 해결하기 위해, 본 실험에서는 기존의 AlN-based ReRAM 소자에 Ti를 도핑 방법을 이용하여 소자의 동작 전압 및 전류의 산포를 줄이기 위한 연구를 진행 하였다. 본 실험은 co-sputtering 방법을 이용하여 Ti가 도핑된 AlN을 저항변화 물질로 사용하여 그 특성을 살펴보았다. Ti의 도핑 효과로 소자의 신뢰성 향상 및 동작 전압의 감소 등의 효과를 얻을 수 있었다. 이는 nitride 기반 물질에서 Ti dopant에 의해 형성된 TiN의 효과로 설명된다. TiN는 metallic한 특성을 지니고 있기에 저항변화물질 내에서 일종의 metallic particle의 역할을 수행할 수 있다. 따라서 conducting path의 형성과정에서 이러한 particle 들이 전계를 유도하여 좀 더 균일한 set/reset 특성을 나타내게 된다.

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Microwave Annealing in Ag/HfO2/Pt Structured ReRAM Device

  • Kim, Jang-Han;Kim, Hong-Ki;Jang, Ki-Hyun;Bae, Tae-Eon;Cho, Won-Ju;Chung, Hong-Bay
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.373-373
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    • 2014
  • Resistive-change random access memory (ReRAM) device is one of the promising candidates owing to its simple structure, high scalability potential and low power operation. Many resistive switching devices using transition metal oxides materials such as NiO, Al2O3, ZnO, HfO2, $TiO_2$, have attracting increased attention in recent years as the next-generation nonvolatile memory. Among various transition metal oxides materials, HfO2 has been adopted as the gate dielectric in advanced Si devices. For this reason, it is advantageous to develop an HfO2-based ReRAM devices to leverage its compatibility with Si. However, the annealing temperature of these high-k thin films for a suitable resistive memory switching is high, so there are several reports for low temperature process including microwave irradiation. In this paper, we demonstrate the bipolar resistive switching characteristics in the microwave irradiation annealing processed Ag/HfO2/Pt ReRAM device. Compared to the as-deposited Ag/HfO2/Pt device, highly improved uniformity of resistance values and operating voltage were obtained from the micro wave annealing processed HfO2 ReRAM device. In addition, a stable DC endurance (>100 cycles) and a high data retention (>104 sec) were achieved.

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MBE Growth and Electrical and Magnetic Properties of CoxFe3-xO4 Thin Films on MgO Substrate

  • Nguyen, Van Quang;Meny, Christian;Tuan, Duong Ahn;Shin, Yooleemi;Cho, Sunglae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.370.1-370.1
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    • 2014
  • Giant magnetoresistance (GMR), tunneling magnetoresistance (TMR), and magnetic random-access memory (MRAM) are currently active areas of research. Magnetite, Fe3O4, is predicted to possess as half-metallic nature, ~100% spin polarization (P), and has a high Curie temperature (TC~850 K). On the other hand, Spinel ferrite CoFe2O4 has been widely studies for various applications such as magnetorestrictive sensors, microwave devices, biomolecular drug delivery, and electronic devices, due to its large magnetocrystalline anisotropy, chemical stability, and unique nonlinear spin-wave properties. Here we have investigated the magneto-transport properties of epitaxial CoxFe3-xO4 thin films. The epitaxial CoxFe3-xO4 (x=0; 0.4; 0.6; 1) thin films were successfully grown on MgO (100) substrate by molecular beam epitaxy (MBE). The quality of the films during growth was monitored by reflection high electron energy diffraction (RHEED). From temperature dependent resistivity measurement, we observed that the Werwey transition (1st order metal-insulator transition) temperature increased with increasing x and the resistivity of film also increased with the increasing x up to $1.6{\Omega}-cm$ for x=1. The magnetoresistance (MR) was measured with magnetic field applied perpendicular to film. A negative transverse MR was disappeared with x=0.6 and 1. Anomalous Hall data will be discussed.

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Resistive Switching Behavior of Cr-Doped SrZrO3 Perovskite Thin Films by Oxygen Pressure Change (산소 분압의 변화에 따른 Cr-Doped SrZrO3 페로브스카이트 박막의 저항변화 특성)

  • Yang, Min-Kyu;Park, Jae-Wan;Lee, Jeon-Kook
    • Korean Journal of Materials Research
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    • v.20 no.5
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    • pp.257-261
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    • 2010
  • A non-volatile resistive random access memory (RRAM) device with a Cr-doped $SrZrO_3/SrRuO_3$ bottom electrode heterostructure was fabricated on $SrTiO_3$ substrates using pulsed laser deposition. During the deposition process, the substrate temperature was $650^{\circ}C$ and the variable ambient oxygen pressure had a range of 50-250 mTorr. The sensitive dependences of the film structure on the processing oxygen pressure are important in controlling the bistable resistive switching of the Cr-doped $SrZrO_3$ film. Therefore, oxygen pressure plays a crucial role in determining electrical properties and film growth characteristics such as various microstructural defects and crystallization. Inside, the microstructure and crystallinity of the Cr-doped $SrZrO_3$ film by oxygen pressure were strong effects on the set, reset switching voltage of the Cr-doped $SrZrO_3$. The bistable switching is related to the defects and controls their number and structure. Therefore, the relation of defects generated and resistive switching behavior by oxygen pressure change will be discussed. We found that deposition conditions and ambient oxygen pressure highly affect the switching behavior. It is suggested that the interface between the top electrode and Cr-doped $SrZrO_3$ perovskite plays an important role in the resistive switching behavior. From I-V characteristics, a typical ON state resistance of $100-200\;{\Omega}$ and a typical OFF state resistance of $1-2\;k{\Omega}$, were observed. These transition metal-doped perovskite thin films can be used for memory device applications due to their high ON/OFF ratio, simple device structure, and non-volatility.

Effect of plasma oxidation time on TMR devices prepared by a ICP sputter (ICP 스퍼터를 이용한 TMR 소자 제작에서 절연막의 플라즈마 산화시간에 따른 미세구조 및 자기적 특성 변화)

  • Lee, Yeong-Min;Song, O-Seong
    • Korean Journal of Materials Research
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    • v.11 no.10
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    • pp.900-906
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    • 2001
  • We prepared tunnel magnetoresistance(TMR) devices of Ta($50\AA$)/NiFe($50\AA$)/IrMn(150$\AA$)/CoFe($50\AA$)/Al ($13\AA$)-O/CoFe($40\AA$)/NiFe($400\AA$)/Ta(50$\AA$) structure which has 100$\times$100 $\mu\textrm{m}^2$ junction area on $2.5\Times2.5 cm^{2}$ $Si/SiO_2$ ($1000\AA$) substrates by a inductively coupled plasma(ICP) magnetron sputter. We fabricated the insulating layer using a ICP plasma oxidation method by varying oxidation time from 80 sec to 360 sec, and measured resistances and magnetoresistance(MR) ratios of TMR devices. We used a high resolution transmission electron microscope(HRTEM) to investigate microstructural evolution of insulating layer. The average resistance of devices increased from 16.38 $\Omega$ to 1018 $\Omega$ while MR ratio decreased from 30.31 %(25.18 %) to 15.01 %(14.97 %) as oxidation time increased from 80 sec to 360 sec. The values in brackets are calculated values considering geometry effect. By comparing cross-sectional TEM images of 220 sec and 360 sec-oxidation time, we found that insulating layer of 360 sec-oxidized was 30 % and 40% greater than that of 150 sec-oxidized in thickness and thickness variation, respectively. Therefore, we assumed that increase of thickness variation with oxidation time is major reason of MR decrease. The resistance of 80 sec-oxidized specimen was 160 k$\Omega$$\mu\textrm{m}^2$ which is appropriate for industrial needs of magnetic random access memory(MRAM) application.

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I/O Translation Layer Technology for High-performance and Compatibility Using New Memory (뉴메모리를 이용한 고성능 및 호환성을 위한 I/O 변환 계층 기술)

  • Song, Hyunsub;Moon, Young Je;Noh, Sam H.
    • Journal of KIISE
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    • v.42 no.4
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    • pp.427-433
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    • 2015
  • The rapid advancement of computing technology has triggered the need for fast data I/O processing and high-performance storage technology. Next generation memory technology, which we refer to as new memory, is anticipated to be used for high-performance storage as they have excellent characteristics as a storage device with non-volatility and latency close to DRAM. This research proposes NTL (New memory Translation layer) as a technology to make use of new memory as storage. With the addition of NTL, conventional I/O is served with existing mature disk-based file systems providing compatibility, while new memory I/O is serviced through the NTL to take advantage of the byte-addressability feature of new memory. In this paper, we describe the design of NTL and provide experiment measurement results that show that our design will bring performance benefits.

Efficient Counter-Based Broadcast Scheme for High Reachability and Energy Efficiency (높은 접근성과 에너지 효율을 갖는 계수기반 브로드캐스트 기법)

  • Jung, Ji-Young;Seo, Dong-Yoon;Lee, Jung-Ryun
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.41 no.12
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    • pp.1780-1792
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    • 2016
  • In this paper, we propose an efficient counter-based broadcast scheme for high reachability and energy efficiency. To achieve this, we propose a method to calculate additional coverage when a node receives the same broadcast message from both nodes, in order to rebroadcast by a node who can cover an large area. We also propose a formula to determine random access delay (RAD) considering addition coverage, distance, density, and remaining battery information, and a formula to determine count threshold ($C_{th}$) considering density and remaining battery information. In addition, we evaluate the performance of the proposed broadcast scheme compared with the existing counter-based broadcast schemes through simulation.