• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.9 no.6
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• pp.534-538
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• 2016

This paper discusses the characteristics and effects of dielectric inner-supports on discone antenna for broadband RF test chamber, and the verification has been performed by simulation. Several design parameters such as the thickness of the gap support, the position of the side support, and the thickness of the side support has been analyzed. The thickness of the gap support affected the reflection coefficient. An effect of the offset of the side support from the center was slight below 3 GHz and significant above 3 GHz. The thickness of the side support did not affect the reflection coefficient or the gain much. The performance of the fabricated discone antenna was in good agreement with the simulated results. This investigation of a dielectric support effects could be used to design a commercial discone antenna for broadband RF test chamber, focusing on electrical performance and mechanical stability.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.204-205
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• 2011

In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is a most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. For best performance of thin film silicon solar cell, the dopant profiles at p/i and i/n interfaces need to be as sharp as possible. The sharpness of dopant profiles can easily achieved when using multi-chamber PECVD equipment, in which each layer is deposited in separate chamber. However, in a single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of a single-chamber PECVD system in spite of the advantage of lower initial investment cost for the equipment. In order to resolve the cross-contamination problem in single-chamber PECVD systems, flushing method of the chamber with NH3 gas or water vapor after doped layer deposition process has been used. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. A single-chamber VHF-PECVD system was used for superstrate type p-i-n a-Si:H solar cell manufacturing on Asahi-type U FTO glass. A 80 MHz and 20 watts of pulsed RF power was applied to the parallel plate RF cathode at the frequency of 10 kHz and 80% duty ratio. A mixture gas of Ar, H2 and SiH4 was used for i-layer deposition and the deposition pressure was 0.4 Torr. For p and n layer deposition, B2H6 and PH3 was used as doping gas, respectively. The deposition temperature was $250^{\circ}C$ and the total p-i-n layer thickness was about $3500{\AA}$. In order to remove the deposited B inside of the vacuum chamber during p-layer deposition, a high pulsed RF power of about 80 W was applied right after p-layer deposition without SiH4 gas, which is followed by i-layer and n-layer deposition. Finally, Ag was deposited as top electrode. The best initial solar cell efficiency of 9.5 % for test cell area of 0.2 $cm^2$ could be achieved by applying the in-situ plasma cleaning method. The dependence on RF power and treatment time was investigated along with the SIMS analysis of the p-i interface for boron profiles.

• Aerospace Engineering and Technology
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• v.6 no.2
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• pp.52-59
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• 2007

Telecommunication satellite consists of a bus system and an RF payload system with high efficiency and high gain reflector antennas. Antenna measurement and also RF system performance (antenna under test, payload and satellite level) have to be evaluated enough before launching in the far-field range or equivalent test range. Basically far-field range is required in a range from two hundred meters to several kilo meters, and it is highly constrained to the externa1 environment, like the RF and the whether environment So the compact antenna test range is developed and used efficiently without external environments as in-door facility. This paper describes the configuration of the compact antenna test range, the range error, and the physical concept of the plane wave illumination Also, it provides a overall design of the anechoic chamber and range parameter values to accommodate the precision measurements in antenna test range.

• Journal of the Korean Vacuum Society
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• v.15 no.3
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• pp.314-324
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• 2006

The vacuum characteristics of the KSTAR ICRF antenna were experimentally investigated. The fabricated antenna was installed in the RF Test Chamber(RFTC) which has a vacuum system with an effective pumping speed of 1015 l/s. The time variations of RFTC pressure, total gas load and ultimate pressure were measured before the RF test. RF conditioning effect was studied by repeating RF pulses at low power level. A time variation of the RFTC pressure was measured during a RF power was applied to the antenna. Threshold pressure at which a RF breakdown occurs was investigated. Whenever the pressure was higher than $10^{-4}$ mbar, the RF breakdown occurred. During a long pulse testing, the temperature of the antenna and RFTC pressure were measured to investigate long pulse limitation of the maximum available voltage without any cooling, which were compared with testing results with a water cooling of the antenna.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.241.1-241.1
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• 2014

The large-area high-power radio-frequency (RF) driven ion sources based on the negative hydrogen (deuterium) ion beam extraction are the major components of neutral beam injection (NBI) systems in future large-scale fusion devices such as an ITER and DEMO. Positive hydrogen (deuterium) RF ion sources were the major components of the second NBI system on ASDEX-U tokamak. A test large-area high-power RF ion source (LAHP-RaFIS) has been developed for steady-state operation at the Korea Atomic Energy Research Institute (KAERI) to extract the positive ions, which can be used for the NBI heating and current drive systems in the present fusion devices, and to extract the negative ions for negative ion-based plasma heating and for future fusion devices such as a Fusion Neutron Source and Korea-DEMO. The test RF ion source consists of a driver region, including a helical antenna and a discharge chamber, and an expansion region. RF power can be transferred at up to 10 kW with a fixed frequency of 2 MHz through an optimized RF matching system. An actively water-cooled Faraday shield is located inside the driver region of the ion source for the stable and steady-state operations of RF discharge. The characteristics and uniformities of the plasma parameter in the RF ion source were measured at the lowest area of the expansion bucket using two RF-compensated electrostatic probes along the direction of the short- and long-dimensions of the expansion region. The plasma parameters in the expansion region were characterized by the variation of loaded RF power (voltage) and filling gas pressure.

• Korean Journal of Materials Research
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• v.21 no.3
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• pp.149-155
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• 2011

We investigated tribological characteristics of diamond-like carbon (DLC) in a condition with carbon nanotube (CNT) content of 1wt% in aqueous solution. Si-DLC films were deposited by radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) process on Al6061 aluminum alloy. In this study, the deposition of DLC films was carried out in vacuum with a chamber pressure of 10-5 to 10-3 Torr achieved by mechanical pump followed by turbo molecular pump. The surface adsorbed oxygen on the Aluminum substrates was removed by passing Ar gas for 10 minutes. The RF power was maintained at 500W throughout the experiment. A buffer layer of HMDSO was deposited on the substrate to improve the adhesion of DLC coating. At this point CH4 gas was introduced in the chamber using gas flow controller and DLC coating was deposited on the buffer layer along with HMDSO for 50 min. The thickness of 1 ${\mu}m$ was obtained for DLC films on aluminum substrates The tribological properties of as synthesized DLC films were analyzed by wear test in the presence of dry air, water and lubricant such as CNT ink.

• Korean Journal of Materials Research
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• v.15 no.10
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• pp.621-625
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• 2005

Effects of rf power, pressure, sputtering gas composition, and substrate temperature on the deposition rate of the $WC_x$ coatings were investigated. The effects of rf power and sputtering gas composition on the hardness and corrosion resistance of the $WC_x$ coatings deposited by reactive sputtering were also investigated. X-ray diffraction (XRD) and Auger electron spectroscopy (AES) analyses were performed to determine the structures and compositions of the films, respectively. The hardnesses of the films were investigated using a nanoindenter, scanning electron microscopy, ana a salt-spray test, respectively. The deposition rate of the films was proportional to rf power and inversely proportional to the $CH_4$ content of $Ar/CH_4$ sputtering gas. The deposition rate linearly increased with increasing chamber pressure. The hardness of the $WC_x$ coatings Increased as rf power increased. The highest hardness was obtained at a $Ar/CH_4$ concentration of $10 vol.\%$ in the sputtering gas. The hardness of the $WC_x$ film deposited under optimal conditions was found to be much higher than that of the electroplated chromium film, although the corrosion resistance of the former was slightly lower than that of the latter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.144-145
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• 2006

ZnO is a promising material to make high efficiency violet or blue light emitting diodes (LEDs) for its large binding energy (60meV) and big bandgap. But the high quality p-type conduction of ZnO is a dilemma to achieve LEDs with it. In present study, we presented a reliable method to prepare ZnO thin films on (100)silicon substrates by RF magnetron sputtering in the mixture ambient of $N_2$ and $O_2$, accompanying with low pressure annealing in the sputtering chamber in $O_2$ at $600^{\circ}C$ and $800^{\circ}C$ respectively. X-ray diffraction and Hail effect with Van der Paul method were performed to test ZnO films. Seeback effect was also carried out to identify carrier types in ZnO films and showed the N-doped ZnO film annealed at $800^{\circ}C$ had achieved p-type conduction.

• Current Industrial and Technological Trends in Aerospace
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• v.8 no.1
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• pp.55-61
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• 2010

Thermal vacuum test should be carried out to verify the performance of the S/C on the ground under the simulated space environment. KARI already completed the construction of a Large Thermal Vacuum Chamber(LTVC) with 8 m of diameter and 10 m of length dimension. LTVC is for the purpose of performing the orbital environment test for large Space Craft(S/C). Inside LTVC, S/C is much smaller than LTVC. For the function test of S/C during the thermal vacuum test, the S/C has to be connected to Electrical Ground Support Equipment(EGSE) which includes several cable and RF wave guide inside LTVC. Also, MLI should be installed on S/C before the test. But it is very difficult to access the S/C inside big LTVC. To solve the accessibility to the S/C inside LTVC, KARI designed an access fixture. This fixture provides easy access to the any S/C thus can help safe installation and saving time for the related work inside LTVC. This paper describes whole process for the design of the access fixture.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.74-74
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• 2009

Titanium nitride has been used as hardmask for semiconductor process, capacitor of MIM type and diffusion barrier of DRAM, due to it's low resistivity, thermodynamic stability and diffusion coefficient. Characteristics of the TiN film are high intensity and chemical stability. The TiN film also has compatibility with high-k material. This study is an experimental test for better condition of TiN film etching process. The etch rate of TiN film was investigated about etching in $BCl_3/Ar/O_2$ plasma using the inductively coupled plasma (ICP) etching system. The base condition were 4 sccm $BCl_3$ /16 sccm Ar mixed gas and 500 W the RF power, -50 V the DC bias voltage, 10 mTorr the chamber pressure and $40\;^{\circ}C$ the substrate temperature. We added $O_2$ gas to give affect etch rate because $O_2$ reacts with photoresist easily. We had changed $O_2$ gas flow rate from 2 sccm to 8 sccm, the RF power from 500 W to 800 W, the DC bias voltage from -50 V to -200 V, the chamber pressure from 5 mTorr to 20 mTorr and the substrate temperature from $20\;^{\circ}C$ to $80\;^{\circ}C$.