• The Korean Journal of Applied Statistics
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• v.35 no.5
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• pp.579-591
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• 2022

Functional data is collected in various fields. It is often necessary to test whether there are differences among groups of functional data. In this case, it is not appropriate to explain using the point-wise ANOVA method, and we should present not the point-wise result but the integrated result. Various studies on functional data analysis of variance have been proposed, and recently implemented those methods in the package fdANOVA of R. In this paper, I first explain ANOVA and multivariate ANOVA, then I will introduce various methods of analysis of variance for univariate and multivariate functional data recently proposed. I also describe how to use the R package fdANOVA. This package is used to test equality of weekly temperatures in Seoul and Busan through univariate functional data ANOVA, and to test equality of multivariate functional data corresponding to handwritten images using multivariate function data ANOVA.

• Journal of Pharmaceutical Investigation
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• v.8 no.4
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• pp.23-36
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• 1978

Since the active center of digestive enzymetic preparations, while under storage, lose their activity and potency by the exposure to moisture, colorization, solidifying and other physical changes. It is more important than beautiful package form that protected packaging form from moisture to get a pharmaceutical safety preparations and to maintain a definite potency. Then, in order to get a desirable conditions of storage and packaging, we used shellac and $AEA^{\circledR}$ as a coating base, and blister package, foil and bottle container as a packaging material. Temperature were set on room temperature and $37^{\circ}C$, moisture was adjusted to 40% RH and 80 % RH as a accelerated conditions. Accelerated test was carried out 6 times. The results are as follows: 1) The effect of packaging conditions give great influence on the maintenace of the stable potency. 2) Best result was produced with bottle container package. 3) $AEA^{\circledR}$ is more useful than shellac as a coating base of prevention from moisture. 4) Absorption of moisture gave considerable effects on potency and it has a limited point. 5) Difference in potency between optimal and worst condition is 472 u/2T, and difference in effective period is about 44 months.

• The Korean Journal of Applied Statistics
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• v.23 no.5
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• pp.933-941
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• 2010

Biplot is a modern graphical methodology allowing for the projection of high-dimensional data to a low-dimensional subspace that is rich in information on variation in the data, correlation among variables as well as class separation. For the construction of biplots, we use a BiplotGUI package in a free statistical software R with increasing popularity. Moreover, using data from questionnaires given to Chonbuk National University freshmen in 2009, the relationship between career goals and career maturity are studied by applying the biplot method.

• Journal of Sensor Science and Technology
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• v.32 no.4
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• pp.207-212
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• 2023

H₂S is a toxic and harmful gas, even at concentrations as low as hundreds of parts per million; thus, developing an H₂S sensor with excellent performance in terms of high response, good selectivity, and fast response time is important. In this study, an H₂S sensor with a high response and fast response time, consisting of a sensing material (SnO₂), an electrode, a temperature sensor, and a micro-heater, was developed using micro-electro-mechanical system technology. The developed H₂S sensor with a micro-heater (circular type) has excellent H₂S detection performance at low H₂S concentrations (0-10 ppm), with quick response time (<16 s) and recovery time (<65 s). Therefore, we expect that the developed H₂S sensor will be considered a promising candidate for protecting workers and the general population and for responding to tightened regulations.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Genomics & Informatics
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• v.20 no.1
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• pp.13.1-13.4
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• 2022

A major issue in the use of immune checkpoint inhibitors is their lack of efficacy in many patients. Previous studies have reported that the T cell inflamed signature can help predict the response to immunotherapy. Thus, many studies have investigated mechanisms of immunotherapy resistance by defining the tumor microenvironment based on T cell inflamed and non-T cell inflamed subsets. Although methods of calculating T cell inflamed subsets have been developed, valid screening tools for distinguishing T cell inflamed from non-T cell inflamed subsets using gene expression data are still needed, since general researchers who are unfamiliar with the details of the equations can experience difficulties using extant scoring formulas to conduct analyses. Thus, we introduce TcellInflamedDetector, an R package for distinguishing T cell inflamed from non-T cell inflamed samples using cancer gene expression data via bulk RNA sequencing.

• The Korean Journal of Applied Statistics
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• v.33 no.4
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• pp.421-437
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• 2020

This paper implemented a method to predict the fertility rate, mortality rate, and international migration rate using the R program, which has been widely used in recent years, that calculates population projection by substituting the results into the Leslie matrix. In particular, the generalization log gamma model for the fertility rate by Kaneko (2003), LC-ER model for mortality rate by Li et al. (2013), and functional data model for international migration rates proposed by Ramsay and Silverman (2005) and Hyndman and Booth (2008), Hyndman et al. (2013) can be directly demonstrated with R programs. Demography and bayesPop have been introduced as a representative demographic package implemented in R; however, it can be analyzed only for data uploaded to Human Mortality Database (HMD) and Human Fertility Database (HFD) with data changes and modifications requiring application of other data. In particular, in Korea, there is a limitation in applying this package because it is provided only for short-term data in HMD. This paper introduces an R program that can reflect this situation and the different patterns of low fertility, aging, migration of domestic and foreigners in Korea, and derives a population projection for the year 2117.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.10
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• pp.94-100
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• 1994

By using the RAPHAEL 3D inductance calculation program RI3, the PGA package inductance values of INTEL i486 microprocessor have been extracted. The lead frame layouts are drawn using the mentor Boardstation and the output files are converted into the RI3 program input format of RAPHAEL. The power and ground planes of the PGA package are modeled y grid-line structures of single bars. The capacitance valuse of signal lines have been clalculated by using the RAPHAEL 2D/3D capacitance extraction program. The extraced L, C, R values have been converted into the SPICE netlist formats with lumped circuit model for future use in the signal ingegrity analysis.

• Journal of the Korean institute of surface engineering
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• v.43 no.3
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• pp.142-147
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• 2010

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.