• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Proceedings of the KIEE Conference
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• 2002.07b
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• pp.808-810
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• 2002

Higher current-rating and improved thermal performance are being sought for existing medium-voltage vacuum circuit breakers(VCB) in order to meet market needs which require to be compact and downsized. In this paper, thermal performance of medium voltage vacuum circuit breaker was investigated through experiments and numerical analysis. We changed several major parameters of current-rating and heat sink affecting on thermal behaviors in the breaker and observed the results. To predict the temperature distribution in complex three-dimensional (3-D) VCB components and gas, the commercial package was used to simulate conjugate heat transfer. Although some assumptions and simplifications were introduced to simulate the model, results from the computational model were in good agreement with actual temperature rise measurements obtained from experiments.

• Proceedings of the KIEE Conference
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• 2002.11d
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• pp.39-42
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• 2002

In this study, the computational heat transfer of the high-voltage vacuum circuit breaker was investigated. Higher normal current-ratings and stabilized thermal characteristics become more important in existing circuit breakers in order to satisfy market needs. Increases in current-ratings have an even greater effect on the Joule heating in the main circuit of the breakers. The thermal design must account for this increase in heat produced for the breaker to meet various temperature-rise limits set by industry standards. We are studying to enhance the normal current-ratings without major frame change of our present production models. As the method used in this research, we performed the computational analysis using the commercial Package, ICEPAK. We could get optimized thermal design suitable for 25% upgraded normal current-ratings through parametric study.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.445-446
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• 2007

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

• The Bulletin of The Korean Astronomical Society
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• v.39 no.1
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• pp.54.2-54.2
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• 2014

IGRINS (Immersion GRating Infrared Spectrograph) is a high spectral resolution near-infrared spectrograph that has been developed in a collaboration between the Korea Astronomy & Space Science Institute and the University of Texas at Austin. By using a silicon immersion echelle grating, the size of the fore optics is reduced by a factor of three times and we can make a more compact instrument. One exposure covers the whole of the H- and K-band spectrum with R=40,000. While the operation of and data reduction for this instrument is relatively simple compared to other grating spectrographs, we still need to operate three infrared arrays, cryostat sensors, calibration lamp units, and the telescope during astronomical observations. The IGRINS Instrument Control Software consists of a Housekeeping Package (HKP), Slit Camera Package (SCP), Data Taking Package (DTP), and Quick Look Package (QLP). The SCP will do auto guiding using a center finding algorithm. The DTP will take the echellogram images of the H and K bands, and the QLP will confirm fast processing of data. We will have a commissioning observations in 2014 March. In this poster, we present the performance of the software during the test observations.

• Korean Journal of Remote Sensing
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• v.34 no.1
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• pp.89-99
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• 2018

Spatial downscaling is often applied to coarse scale satellite products with high temporal resolution for environmental monitoring at a finer scale. An area-to-point regression kriging (ATPRK) algorithm is regarded as effective in that it combines regression modeling and residual correction with area-to-point kriging. However, an open source tool or package for ATPRK has not yet been developed. This paper describes the development and code organization of an R-based spatial downscaling tool, named R4ATPRK, for the implementation of ATPRK. R4ATPRK was developed using the R language and several R packages. A look-up table search and batch processing for computation of ATP kriging weights are employed to improve computational efficiency. An experiment on spatial downscaling of coarse scale land surface temperature products demonstrated that this tool could generate downscaling results in which overall variations in input coarse scale data were preserved and local details were also well captured. If computational efficiency can be further improved, and the tool is extended to include certain advanced procedures, R4ATPRK would be an effective tool for spatial downscaling of coarse scale satellite products.

• Journal of the Korea Society of Computer and Information
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• v.22 no.1
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• pp.49-56
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• 2017

In this paper we propose the approach for big data integration so as to analyze, visualize and predict the future of the trend of the market, and that is to get the integration data model using the R language which is the future of the statistics and the Hadoop which is a parallel processing for the data. As four approaching methods using R and Hadoop, ff package in R, R and Streaming as Hadoop utility, and Rhipe and RHadoop as R and Hadoop interface packages are used, and the strength and weakness of four methods are described and analyzed, so Rhipe and RHadoop are proposed as a complete set of data integration model. The integration of R, which is popular for processing statistical algorithm and Hadoop contains Distributed File System and resource management platform and can implement the MapReduce programming model gives us a new environment where in R code can be written and deployed in Hadoop without any data movement. This model allows us to predictive analysis with high performance and deep understand over the big data.

• Journal of the Korean Ceramic Society
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• v.53 no.3
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• pp.263-272
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• 2016

Electronic structure calculations have become a powerful foundation for computational materials engineering. Four major factors have enabled this unprecedented evolution, namely (i) the development of density functional theory (DFT), (ii) the creation of highly efficient computer programs to solve the Kohn-Sham equations, (iii) the integration of these programs into productivity-oriented computational environments, and (iv) the phenomenal increase of computing power. In this context, we describe recent applications of the Vienna Ab-initio Simulation Package (VASP) within the MedeA$^{(R)}$ computational environment, which provides interoperability with a comprehensive range of modeling and simulation tools. The focus is on technological applications including microelectronic materials, Li-ion batteries, high-performance ceramics, silicon carbide, and Zr alloys for nuclear power generation. A discussion of current trends including high-throughput calculations concludes this article.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.6
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• pp.431-438
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• 2016

Recently, concerns about the environment are becoming more important because of global warming and the exhaustion of earth's resources. In the aviation and automobile industries, the application of light materials is increasingly important for eco-friendly and effective. Carbon Fiber Reinforced Plastics is a composite material which great formability and the high strength of carbon fiber. CFRP, which is both light and strong, is hard to manufacture. In addition, CFRP machining has a high chance of defects. This research discusses the development of a manufacturing system package for CFRP machining. It involving CFRP Drilling/Water-jet Manufacturing Machines, Inspection/Post-processing Systems, CNC platform for an EtherCAT servo Communication, Flexible Manufacturing Systems and CFRP machining Processes.