• Title/Summary/Keyword: R&D Sigma Level

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A study on target Sigma Level at R&D stage and robust limits for design margins (R&D 분야의 목표 시그마 수준 설정과 설계 공차의 강건 한계 결정에 대한 연구)

  • Ko, Seoung-gon
    • The Korean Journal of Applied Statistics
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    • v.29 no.2
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    • pp.369-379
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    • 2016
  • The Sigma Level, proposed by Motorola Inc., is one of the many Process Capability Index (PCI)'s that have been presented since the 1970's. It is used to evaluate process capability and unlike other PCI's, it has an advantage in that it uses population probability distribution. However, it is originally designed for mass production and is inadequate to evaluate prototypes or early products in the R&D stages. For use in such cases, we propose an R&D target Sigma Level, derived by considering 1.5 sigma shifts in traditional sigma level from a statistical point of view. We also explain the way to find robust limits for design tolerance because the sigma level or defect probability is useful to establish economical tolerance limits at the R&D stage and mass production.

A 9 mW Highly-Digitized 802.15.4 Receiver Using Bandpass ∑Δ ADC and IF Level Detection

  • Kwon, Yong-Il;Park, Ta-Joon;Lee, Hai-Young
    • Journal of electromagnetic engineering and science
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    • v.8 no.2
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    • pp.76-83
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    • 2008
  • A low power(9 mW) highly-digitized 2.4 GHz receiver for sensor network applications(IEEE 802.15.4 LR-WPAN) is realized by a $0.18{\mu}m$ CMOS process. We adopted a novel receiver architecture adding an intermediate frequency (IF) level detection scheme to a low-power complex fifth-order continuous-time(CT) bandpass L:tl modulator in order to digitalize the receiver. By the continuous-time bandpass architecture, the proposed $\Sigma\Delta$ modulator requires no additional anti-aliasing filter in front of the modulator. Using the IF detector, the achieved dynamic range(DR) of the over-all system is 95 dB at a sampling rate of 64 MHz. This modulator has a bandwidth of 2 MHz centered at 2 MHz. The power consumption of this receiver is 9.0 mW with a 1.8 V power supply.

A Study on the Stress and Crystal in Die-Upsetted Nd-Fe-B-Cu Alloys as a Function of Working Temperature (가공온도에 따라 다이업셋한 Nd-Fe-B-Cu 합금의 응력과 결정에 관한 연구)

  • Park, J.D.;Yang, H.S.;Kwak, C.S.;Jeung, W.Y.
    • Journal of the Korean Society for Heat Treatment
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    • v.7 no.1
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    • pp.61-71
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    • 1994
  • This study is to investigate the stress distributions, crystal orientations and magnetic properties during die-upsetting according to working temperature of Nd-Fe-B-Cu alloys. The stress distributions in the specimens during compressing process were calculated by a finite element method program(SPID). The calculated stresses were effective stress (${\sigma}_{eff}$), compression stress(${\sigma}_z$), radial direction stress(${\sigma}_r$) rotational direction stress(${\sigma}_e$) and shear stress(${\tau}_{rz}$). The stress distributions of ${\sigma}_z$, obtained by a computer simulation showed that the stress components causing the magnetic alignment during die-upsetting of the cast magnets were very high at the center-part of a specimen, and decreased toward the periphery-part of a specimen. In view of the above results the magnetic properties should be better at the center-part of a specimen than any other parts. But the measured magnetic properties were better at the mid-part. These results should be due to the fact that the specimens were casted. Normally the magnetic properties are affected by the casting process as well as by the stress levels. ${\sigma}_r$, ${\sigma}_e$ are thought to affect the liquid phase flowing and domain patterns, respectively. The influence of ${\tau}_{rz}$ was trivial, ${\sigma}_{eff}$ distributed similar throughout the specimen. The Nd-rich phase appeared at the peripheral of the specimen where the stress level of ${\sigma}_r$, ${\sigma}_z$, was low or the stress level of ${\sigma}_e$ was high. The Nd-rich phase was squeezed out during die-upsetting. This phase had an effect on the crystal orientation and grain growth. The stress distributions of alloy were irregular at the parts of the specimen where the die contacted with specimen.

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A New Management Innovation Strategy Through 6sigma for R&D linked with TRIZ (개발분야의 6시그마와 TRIZ 연계를 통한 새로운 경영혁신 전략)

  • An, Young-Soo;Hwang, In-Keuk
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.32 no.3
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    • pp.178-187
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    • 2009
  • Six Sigma emphasizes KPI and establishes the present level as well as the goal level through statistical calculation and tries to achieve management innovation through process improvement. But in the area of new product development or service, sufficient data for statistical measurement may not be secured. On the other side, looking for contradictions through problem analysis, TRIZ is a methodology that stresses the process of solving these problems. TRIZ also has its own problems: it is hard to define its initial task, to objectify the measurement of effect, and to optimize the drawn out idea. The purpose of this report is to give a comprehensive understanding about each methodology (Sigma Six and TRIZ) through its analysis, to confirm the need of linking both methodologies, and to suggest a model for this linking process. Also, they will be verified through examples, and the synergy effect will be discussed.

A Study on Six Sigma Robust Design of Gripper Part for LCD Transfer System (식스 시그마 기반 LCD이송장치의 Gripper부 강건설계에 관한 연구)

  • Chung, W.J.;Jung, D.W.;Kim, S.B.;Yoon, Y.M.
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.5
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    • pp.65-71
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    • 2006
  • This paper presents the robust design of gripper part for a high-speed LCD(Liquid Crystal Display) transfer system. In this paper, the $1^{st}$ DOE(Design of Experiment) is conducted to find out main-effect factors for the design of gripper part. Thirty-six analysis are performed using $ANSYS^{(R)}$ and their results are statistically analyzed using $MINITAB^{(R)}$, which shows that the factors, i.e., First-width, Second-width, Rec-width, and thickness of gripper part, are more important than other factors. The main effect plots shows that the maximum deflection and mass of gripper part are minimized by increasing First-width, Second-width, Rec-width and thickness. The $2^{nd}$ DOE is conducted to obtain RSM(Response Surface Method) equation. The CCD(Central Composite Design) technique with four factors is used. Optimum design is conducted using the RSM equation. Genetic algorithm is used for optimal design. Six sigma robust design is conducted to find out a guideline for control range of design parameter. To obtain six sigma level quality, the standard deviations of design parameters are shown to be controlled within 5% of average design value.

A Study on the Safety Stock (안전재고에 관한 연구)

  • 박병기;정종식
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.10 no.16
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    • pp.143-147
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    • 1987
  • Safety stocks constitute one of the major means of dealing with the uncertainties associated with variation in demand and lead time. Adeguate safety facilitate production activities and help to assure customers if good service on the other hand, carrying safety storks ties up working capital on goods that sit idle. The major problem of safety stocks management thus of consists of trying to achieve an optimal balance between the other carrying cost and the costs of stock shortage. Therefore, this study aims to find safety stock level of the fixed reorder quantity system and the fixed reorder cycle system of minimizing total cost when both demand and lead time are variable. (The distribution of demand and lead time is a mere assumption that follows the normal distribution) The results can be summarized as follows. i) Safety factor on the safety stock is determined by carrying cost and the costs of stock shortage: An optimal safety stick=the costs of stork shortage($C_s$) (the carrying cost($C_h$)+the costs of stock storage($C_s$). ii) The safety stock level of the fixed reorder quantity system is ($a{\;}_p\sqrt{L}{\sigma}$) under uncertainties. iii) The safety stock level of the fixed reorder cycle system is ($a{\;}_p\sqrt{R+L{\sigma}}$) under uncertain demand and constant lead time. ($a{\;}_p\sqrt{L{\sigma}_d{\;^2+{\mu}^2L{\sigma}^2}$) under demand and lead time uncertainties.

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An Exploratory Study on the Possibility of Creative Quality Management (창조적 품질경영의 가능성에 대한 탐색적 연구)

  • Oh, Hyung-Sool;Seong, Baek-Seo;Kim, Seon-Min
    • Journal of the Korea Safety Management & Science
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    • v.11 no.1
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    • pp.103-113
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    • 2009
  • Motorola which had developed and commercialized wireless telephone and mobile phone for the first time in the world made a decision on the separation of the mobile unit from the Motorola due to the continuous bad performance turn. In addition, the Korean company named Raincom which had developed and commercialized MP3 player have been disappeared since Raincom failed to compete with iPod of Apples. What is the main cause the companies that have been top of the world level weed out of IT product market? For less product life cycle and globalization of market, the company's competitiveness tends to be determined based on company's creative capability, rather than process implementation capability. Thus, companies spent a great amount of time and effort in the introduction of creativity management and R&D activities. However, as company's continuous investment on R&D and innovation activities did not lead to business performance, they starts to pay much attention on the effective R&D and innovation activities. Therefore, this paper tries to solve the limitation of the effectiveness of R&D activities by introducing the concept of 'creative quality'. The creative quality is executed by the creative process, which is designed for getting over the limitation of the traditional brainstorming method. This paper presents the concept so called 'creative quality management' and expects it to be an alternative to conquest the limitation of six sigma management.

A Study on the Creep Fracture Life of Al 7075 alloy( I ) (Al 7075 합금의 크리이프 파단수명에 관한 연구( I ))

  • 강대민
    • Journal of the Korean Society of Safety
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    • v.8 no.4
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    • pp.27-40
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    • 1993
  • High temperature tensile tests, steady state creep tests, Internal stress tests and creep rupture tests using A17075 alloy( $T_{6}$ ) were performed over the temperature range of 9$0^{\circ}C$~50$0^{\circ}C$ (0.4 $T_{m}$ ~0.85 $T_{m}$ ) and stress range of 0.64~17.2(kgf/$\textrm{mm}^2$). The main results obtained in this paper were as follows. (1) The activation energies for yielding at the temperature of 0.4 $T_{m}$ ~0.75 $T_{m}$ were calculated to be 25.7~36.5kcal/mol, which were nearly equal to the activation energies for creep. (2) At around the temperature of 9$0^{\circ}C$~12$0^{\circ}C$ and under the stress level of 10~17.2(kgf/$\textrm{mm}^2$), and at around the temperature of 200~41$0^{\circ}C$ and under the stress level of 1.53~9.55(kgf/$\textrm{mm}^2$) and again at around the temperature of 470~50$0^{\circ}C$ and under the stress level of 0.62~l.02(kgf/$\textrm{mm}^2$), the applied stress dependence of steady state creep rate $n_{measu}$ measured were, respectively, 3.15, 6.62 and 1.1, which were in good agreement the calculated stress dependence $n_{ealeu}$ obtained by the difference of the applied stress dependence of the Internal stress and the ratio of the internal stress to the applied stress. (3) At the temperature range of 0.4~0.43 $T_{m}$ , and at the temperature range of 0.52~0.75 $T_{m}$ and again at the temperature range of 0.82~0.85 $T_{m}$ , the activation energies $Q_{measu}$ obtained by steady state creep rate, respective, 26. 16, 34.9, 36.2 and 36.1kcal/mol, which were in good agreement with those obtained with the activation energies under constant effective stress and the temperature dependence of Internal stress. (4) At the temperature range of the 0.52~0.73 $T_{m}$ and under the stress level of 1.53~9.55(kgf/$\textrm{mm}^2$), the stress dependence of rupture life(n’) measured was 6.3~6.6, which was in good agreement with the stress dependence of steady state creep rate(n). And at the same condition the activation energy for rupture( $Q_{f}$ ) measured was 32.0~36.9kca1/mol, which was also in good agreement with the activation energy obtained by steady state creep rate ( $Q_{c}$ ). (5) The rupture life( $t_{f}$ ) might be represented by athermal process attributed to the difference of the applied stress dependence of the internal stress and the ratio of the internal stress to the applied stress, and the thermal activated process attributied to the temperature dependence of the internal stress as $t_{f}$ = A'$\sigma$$_{a}$ {n(1-d $\sigma$$_{i}$ /d $\sigma$$_{a}$ )/(1-$\sigma$$_{i}$ / $\sigma$$_{a}$ )}.exp[{ $Q_{c}$ $^{*}$-( $n_{o}$ R $T^2$/ $E_{(T)}$) (d $E_{(T)}$/dT) - ( $n_{0}$ R $T^2$/ $\sigma$$_{a}$ - $\sigma$$_{i}$ ) (d $\sigma$$_{i}$ /dT)}/RT]. (6) The relationship betwween Larson-Miller rupture parameter and logarithmic stress was linearly decreased, so creep rupture life of Al 7075 alloy seemed to be predicted exactly with Larson-Miller parameter.meter.

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Six Sigma based on Robust Design of Gripper for LCD Transfer System (LCD 이송장치의 그립퍼부 시그마 기반 강건설계)

  • Chung W.J.;Jung D.W.;Kim H.J.;Yoon Y.M.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.361-362
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    • 2006
  • This paper presents the robust design of gripper part for a high-speed LCD (Liquid Crystal Display) transfer system. In this paper, the 1st DOE (Design of Experiment) is conducted to find out main-effect factors fur the design of gripper part. Thirty-six experiments are performed using $ANSYS^{(R)}$ and their results are statistically analyzed using $MINITAB^{(R)}$, which shows that the factors, i.e., First-width, Second-width, Rec-width, and thickness of gripper part, are more important than other factors. The main effect plots shows that the maximum deflection and mass of gripper part are minimized by increasing First-width, Second-width, Rec-width and thickness. The 2nd DOE is conducted to obtain RSM (Response Surface Method) equation. The CCD (Central Composite Design) technique with four factors is used. Optimum design is conducted using the RSM equation. Genetic algorithm is used for optimal design. Six sigma robust design is conducted to find out a guideline for control range of design parameter. To obtain six sigma level reliability, the standard deviations of design parameters are shown to be controlled within 5% of average design value.

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A Preliminary Study for Deriving Subjects of MOT Method Based on the Utilization Status in Korea Enterprises (기업활용수준을 반영한 기술경영 연구방법론 교과도출을 위한 사전연구)

  • Lee, Jae-Ha;Na, Won-Shik
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.35 no.2
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    • pp.212-219
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    • 2012
  • This study focus on what methods of MOT are needed and utilized to solve a technical problem in the MOT leading company. We first classified the MOT methods by project life cycle and R&D job quality based on the several discussion with working group. In order to study, the survey was carried out by 168 experts working on MOT practices. Our main research findings are as follows. The level of utilized MOT methods was above average because MOT sector was beginning to represent an increasing share of total R&D business. But the satisfaction level on the MOT majors was below average. The more utilized MOT methods in practices were 'environment analysis and opportunity research,' 'business feasibility,' 'roadmapping,' 'portfolio,' 'technology tree,' 'scheduling,' 'risk management,' 'six sigma,' 'design of experiment,' 'quality control,' 'cost analysis' etc. And the subjects of product realization process were also needed to MOT practice such as 'design for reliability,' 'design for cost,' 'design for performance,' 'design for safety' deeply involved to product quality. Finally, the capability requested to University students were 'problem define and solving,' 'technology planning and strategy,' 'creative thinking.'