• Title/Summary/Keyword: Pulsed

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Dynamics of Rouleaux Patterns of Red Blood Cells under Pulse Magnetic Field (강한 펄스자기장 자극에 의한 적혈구 연전현상의 활동성 조사)

  • Hwang, Do Guwn
    • Journal of the Korean Magnetics Society
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    • v.27 no.3
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    • pp.92-97
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    • 2017
  • It is widely known that pulsed magnetic field (PMF) is very useful tool to manipulate chemical and physiological processes in human body. The purpose of our study is to observe dynamics of rouleaux patterns of red blood cells (RBC) under PMF. The aggregation of RBCs or rouleaux formation is caused by fibrinogen in blood plasma. The maximum magnetic field intensity is 0.27 T and pulse time of 0.102 msec and pulse repetition rate was 1 Hz. PMF stimulus was applied to the palm of left hand for 5, 10, 15 and 20 min. Live blood analysis was used in vitro in order to quantitatively estimate the velocity of RBC exposed to PMF stimulus. The velocity of stacked-RBC of 10 minute PMF stimulus was increased up to $8{\times}10^{-4}m/sec$, but it decreased rapidly as the time passed. The results of present study have adduced that PMF stimulus on hand provide the improvement of RBC rouleaux formation, increase of RBC's moving velocity as well as low blood viscosity.

Enhancement of Crystallinity in ZnO:Al Films Using a Two-Step Process Involving the Control of the Oxygen Pressure (산소 압력의 조절과 함께 두 번의 증착 과정을 이용한 ZnO:Al 박막에 결정성의 향상)

  • Moon, Tae-Ho;Yoon, Won-Ki;Lee, Seung-Yoon;Ji, Kwang-Sun;Eo, Young-Joo;Ahn, Seh-Won;Lee, Heon-Min
    • Journal of the Korean Vacuum Society
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    • v.19 no.2
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    • pp.128-133
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    • 2010
  • ZnO:Al films were deposited by DC-pulsed magnetron sputtering using a two-step process involving the control of the oxygen pressure. The seed layers were prepared with various Ar to oxygen flow ratios and the bulk layers were deposited under pure Ar. As the oxygen pressure during the deposition of the seed layer increased, the crystallinity and degree of (002) texturing increased. The resistivity gradually decreased with increasing crystallinity from $4.7\times10^4\Omega{\cdot}cm$ (no seed) to $3.7\times10^4\Omega{\cdot}cm$ (Ar/$O_2$ = 9/1). The etched surface showed a crater-like structure and an abrupt morphology change appeared as the crystallinity was increased. The sample deposited at an Ar/$O_2$ flow ratio of 9/1 showed a very high haze value of 88% at 500 nm, which was explained by the large feature size of the craters, as shown in the AFM image.

교류형 플라즈마 방전 표시기 방전유지 전압의 전압 상승 시간의 변화에 따른 방전 현상의 변화

  • 김중균;양진호;윤차근;황기웅
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.229-229
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    • 1999
  • 교류형 플라즈마 방전 표시기(AC Plasma Display Panel, AC PDP)의 구동에서의 방전 현상은 기입방전, 유지방전, 소거 방전이 있다. 이중 유지 방전은 표시장치로서의 휘도와 계조의 표현을 위한 방전으로 표시기로서의 효율을 결정하게 된다. 본 연구에서는 유지 방전 전압의 상승 시간의 변화에 따른 방전현상과 휘도, 효율의 변화를 살펴 보았다. 방전 현상에서의 가장 큰 변화는 교류형 플라즈마 방전 표시기의 방전 개시 전압과 방전 유지 전압의 변화이다. 유지 전압의 상승시간이 증가할수록 방전 개시 전압과 방전 유지 전압의 변화이다. 유지 전압의 상승 시간이 증가할수록 방전 개시 전압과 방전 유지 전압의 차(sustain margin)는 감소하여 상승 시간이 1$\mu$s/100V 이상의 영역에서는 방전 개시 전압과 방전 유지 전압이 차이가 없어지게 된다. 이는 방전 유지 전극 위의 유전체에 쌓이게 되는 벽전하(wall charge) 양의 감소에 의한 방전 약화의 영향을 보여질 수 있다. 그러나 방전 유지 전압의 형태와 전류의 시간적인 변화를 살펴보면 이러한 약한 방전은 벽전하의 감소에 의한 방전 시의 전계 감소보다는 방전 전류의 발생 시간이 방전 전압이 증가하여 최고점에 이르지 못한 시간에 위치하여 방전이 형성될 때의 전계가 강하지 못하기 때문인 것을 알 수 있다. 방전 전류를 측정한 결과에 의하면 방전 전류의 시작은 변위 전류가 흐르고 난 후부터 시작되며 그 결과 방전 전류가 최고점에 도달하는 시간은 방전 전압 상승 시간이 길어질수록 낮은 전압에서 형성되게 된다. 또한 방전 유지 전압의 상승 시간이 길어질수록 플라즈마 방전표시기의 휘도와 효율은 낮아지고 이 결과 또한 약한 전계에서의 방전에 의한 결과로 생각되어진다.플라즈마의 강도값을 입력하여 플라즈마의 radiation을 검출하고, 스퍼터링 공정중 실질적인 in-situ 정보로 이용하였다. PEM을 통하여 In/Sn의 플라즈마 강도변화를 조사하였다. 초기 In/Sn의 플라즈마 강도(intensity)는 강도를 100하여, 산소를 주입한 결과, plasma intensity가 35 줄어들었고, 이때 우수한 ITO 박막을 얻을 수 있었다. Pulsed DC power를 사용하여 아크 현상을 방지하였다. PET 상에 coating 된 ITO 박막의 표면저항과 광투과도는 4-point prove와 spectrophotometer를 이용하여 분석하였고, AES로 박막의 두께에 따른 성분비를 확인하였다. ITO 박막의 광투과도는 산소의 유량과 sputter 된 In/Sn ion의 plasma emission peak에 따라 72%-92%까지 변화하였으며, 저항은 37$\Omega$/$\square$ 이상을 나타내었다. 박막의 Sn/In atomic ratio는 0.12, O/In의 비율은 In2O3의 화학양론적 비율인 1.5보다 작은 1.3을 나타내었다.로 보인다.하면 수평축과 수직축의 분산 장벽의 비에 따라 cluster의 두께비가 달라지는 성장을 볼 수 있었고, 한 축 방향으로의 팔 넓이는 fcc(100) 표면의 경우 동일한 Ed+Ep값에 대응하는 팔 넓이와 거의 동일한 결과가 나타나는 것을 볼 수 있다. 따라서 이러한 비대칭적인 모양을 가지는 성장의 경우도 cluster 밀도, cluster 모양, cluster의 양 축 방향 길이 비, 양 축 방향의 평균 팔 넓이로부터 각 축 방향의 분산 장벽을 얻어낼 수 있을 것으로 보인다. 기대할 수 있는 여러 장점들을 보고하고자 한다.성이 우수한 시

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Experimental and FEMLAB Simulation Study of Ibuprofen Racemate Separation in HPLC (Ibuprofen Racemate의 HPLC 분리실험과 FEMLAB 전산모사 연구)

  • Lee, Eun;Chang, Sang-Mork;Kim, Jong-Min;Kim, Woo-Shick;Kim, In-Ho
    • KSBB Journal
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    • v.21 no.3
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    • pp.224-229
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    • 2006
  • FEMLAB is a powerful interactive environment for modeling, solving all kinds of scientific and engineering problems based on partial differential equations(PDEs). Separation process of chiral compound in HPLC columns was simulated by FEMLAB. To study change of elution profile with isotherm models, non-competitive and competitive Langmuir adsorption isotherm were adopted. Separated material was (R, S)-ibuprofen [(R, S)-2-(4-isobutyl phenyl) propionic acid], an anti-inflammatory agent, which retain the pharmacological activity in the (S)-(+)-enantiomer. Sample concentrations were changed from 0.5 mg/ml to 2.0 mg/ml at a flow rate of 1 ml/min and flow rate varied from 1 ml/min to 3 ml/min at an ibuprofen concentration of 2.0 mg/ml and $20{\mu}l$ of injection volume. Simulated results were well fitted with experimental data.

X-Band 50 W Pulse-Mode GaN HEMT Internally Matched Power Amplifier (X-대역 50 W급 펄스 모드 GaN HEMT 내부 정합 전력 증폭기)

  • Kang, Hyun-Seok;Bae, Kyung-Tae;Lee, Ik-Joon;Cha, Hyen-Won;Min, Byoung-Gue;Kang, Dong-Min;Kim, Dong-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.10
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    • pp.892-899
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    • 2016
  • In this paper, an X-band 50 W internally matched power amplifier is designed and fabricated using an $80{\times}150{\mu}m$ GaN HEMT that is developed by the $0.25{\mu}m$ GaN HEMT process of ETRI. The optimum source and load impedances are experimentally extracted from the loadpull measurement using impedance-transform-prematching circuits, and the transistor performance is predicted. The power performance of the internally matched power amplifier, whose matching circuits are fabricated on a substrate with ${\varepsilon}_r$ of 10.2, is measured under the pulsed mode of $100{\mu}s$ pulse period and 10 % duty cycle, and the best output power of 47.46 dBm(55.5 W) and the power-added efficiency of 46.6 % are obtained at 9.2 GHz. The output power of 47~47.46 dBm(50~55.7 W) is measured in 9.0~9.5 GHz, and the power-added efficiency is measured to be greater than 43 % in 9.0~9.3 GHz and above 36 % in 9.4~9.5 GHz.

A Study on the Discharge Guide Technology by infrared Laser Applied to Discharge Processing Devices (적외선 레이저에 의한 방전 유도 기술의 방전 가공 장치에의 적용 연구)

  • 조정수;이동훈;남경훈
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.13 no.1
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    • pp.1-8
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    • 1999
  • In recent years, concern has been raised about the technique of controlling electrical breakdown by using laser in many fields. Especially, laser has attracted much attention in the Electro-Discharge Machining(EDM) because of its many rrents. 1berefore, this research has been perfonred to obtain fundarrental data for the discharge guide technology by a pulsed Nd:YAG laser which can be awJied to discharge processing machining. 1be experilnnts of laser-guided de discharge have been carried out at low air pressure ranging from 0.2 to 20 torr. The minimum laser-guided de discharge voltage $V_{G.min}$ at the given pressures P and distances d between an anode and a cathode was rreasured It is found that $V_{G.min}$ is much lower than the natural discharge voltage $V_{ND}$, and the values of VGrrin and $V_{ND}$ as a function of P.d has a similar tendency. The laser output energy $E_{out}$ decreases with input pulse duration $t_p$ increasing, and the rrore the value of $t_p$ increases, the higher that of V$V_{G.min}$ is obtained because the number of photons N decreases with $t_p$ increasing. In addition, the laser-guided de discharge range and the discharge guide characteristics as laser outpIt $E_{out}$ was investigated.igated.

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Ferromagnetism and Anomalous Hall Effect of $TiO_2$-based superlattice films for Dilute Magnetic Semiconductor Applications

  • Jiang, Juan;Seong, Nak-Jin;Jo, Young-Hun;Jung, Myung-Hwa;Yang, Jun-Mo;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.41-41
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    • 2007
  • For use in spintronic materials, dilute magnetic semiconductors (DMS) are under consideration as spin injectors for spintronic devices[l]. $TiO_2$-based DMS doped by a cobalt, iron, and manganese et al. was recently reported to show ferromagnetic properties, even at temperatures above 300K and the magnetic ordering was explained in terms of carrier-induced ferromagnetism, as observed for a III-V based DMS. An anomalous Hall effect (AHE) and co-occurance of superparamagnetism in reduced Co-doped rutile $TiO_{2-\delta}$ films have also been reported[2]. Metal segregation in the reduced metal-doped rutile $TiO_2-\delta$ films still remains as problems to solve the intrinsic DMS properties. Superlattice films have been proposed to get dilute magnetic semiconductor (DMS) with intrinsicroom-temperature ferromagnetism. For a $TiO_2$-based DMS superlattice structure, each layer was alternately doped by two different transition metals (Fe and Mn) and deposited to a thickness of approximately $2.7\;{\AA}$ on r-$Al_2O_3$(1102) substrates by pulsed laser deposition. The r-$Al_2O_3$(1102) substrates with atomic steps and terrace surface were obtained by thermal annealing. Samples of $Ti_{0.94}Fe_{0.06}O_2$(TiFeO), $Ti_{0.94}Mn_{0.06}O_2$(TiMnO), and $Ti_{0.94}(Fe_{0.03}Mn_{0.03})O_2$ show a low remanent magnetization and coercive field, as well as superparamagnetic features at room temperature. On the other hand, superlattice films (TiFeO/TiMnO) show a high remanent magnetization and coercive field. An anomalous Hall effect in superlattice films exhibits hysisteresis loops with coercivities corresponding to those in the ferromagnetic Hysteresis loops. The superlattice films composed of alternating layers of $Ti_{0.94}Fe_{0.06}O_2$ and $Ti_{0.94}Mn_{0.06}O_2$ exhibit intrinsic ferromagnetic properties for dilute magnetic semiconductor applications.

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High rate deposition of poly-si thin films using new magnetron sputtering source

  • Boo, Jin-Hyo;Park, Heon-Kyu;Nam, Kyung-Hoon;Han, Jeon-Geon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.186-186
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    • 2000
  • After LeComber et al. reported the first amorphous hydrogenated silicon (a-Si: H) TFT, many laboratories started the development of an active matrix LCDs using a-Si:H TFTs formed on glass substrate. With increasing the display area and pixel density of TFT-LCD, however, high mobility TFTs are required for pixel driver of TF-LCD in order to shorten the charging time of the pixel electrodes. The most important of these drawbacks is a-Si's electron mobiliy, which is the speed at which electrons can move through each transistor. The problem of low carier mobility for the a-Si:H TFTs can be overcome by introducing polycrystalline silicon (poly-Si) thin film instead of a-Si:H as a semiconductor layer of TFTs. Therefore, poly-Si has gained increasing interest and has been investigated by many researchers. Recnetly, fabrication of such poly-Si TFT-LCD panels with VGA pixel size and monolithic drivers has been reported, . Especially, fabricating poly-Si TFTs at a temperature mach lower than the strain point of glass is needed in order to have high mobility TFTs on large-size glass substrate, and the monolithic drivers will reduce the cost of TFT-LCDs. The conventional methods to fabricate poly-Si films are low pressure chemical vapor deposition (LPCVD0 as well as solid phase crystallization (SPC), pulsed rapid thermal annealing(PRTA), and eximer laser annealing (ELA). However, these methods have some disadvantages such as high deposition temperature over $600^{\circ}C$, small grain size (<50nm), poor crystallinity, and high grain boundary states. Therefore the low temperature and large area processes using a cheap glass substrate are impossible because of high temperature process. In this study, therefore, we have deposited poly-Si thin films on si(100) and glass substrates at growth temperature of below 40$0^{\circ}C$ using newly developed high rate magnetron sputtering method. To improve the sputtering yield and the growth rate, a high power (10~30 W/cm2) sputtering source with unbalanced magnetron and Si ion extraction grid was designed and constructed based on the results of computer simulation. The maximum deposition rate could be reached to be 0.35$\mu$m/min due to a high ion bombardment. This is 5 times higher than that of conventional sputtering method, and the sputtering yield was also increased up to 80%. The best film was obtained on Si(100) using Si ion extraction grid under 9.0$\times$10-3Torr of working pressure and 11 W/cm2 of the target power density. The electron mobility of the poly-si film grown on Si(100) at 40$0^{\circ}C$ with ion extraction grid shows 96 cm2/V sec. During sputtering, moreover, the characteristics of si source were also analyzed with in situ Langmuir probe method and optical emission spectroscopy.

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Growth and electrical properties of $MgTiO_3$ thin films ($MgTiO_3$산화물 박막의 성장 및 전기적 특성 연구)

  • 강신충;임왕규;안순홍;노용한;이재찬
    • Journal of the Korean Vacuum Society
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    • v.9 no.3
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    • pp.227-232
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    • 2000
  • $MgTiO_3$thin films have been grown on various substrates by pulsed laser deposition (PLD) to investigate the application for microwave dielectrics and optical devices. Epitaxial $MgTiO_3$thin films were obtained on sapphire (c-plane$A1_2O_3$$MgTiO_3$thin films deposited on $SiO_2/Si$ and platinized silicon ($Pt/Ti/SiO_2/Si$) substrates were highly oriented. $MgTiO_3$thin films grown on sapphire were transparent in the visible and had a sharp absorption edge about 290 nm. These $MgTiO_3$thin films had extremely fine feature of surface morphology, i.e., rms roughness of 0.87 nm, which was examined by AFM. We have investigated the dielectric properties of the $MgTiO_3$thin films in $MIM(Pt/MgTiO_3/Pt)$ capacitors. Dielectric constant and loss of $MgTiO_3$thin films deposited by PLD were about 24 and 1.5% at 1 MHz, respectively. These $MgTiO_3$thin films also exhibited little dielectric dispersion.

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Sol-gel deposited TiInO thin-films transistor with Ti effect

  • Kim, Jung-Hye;Son, Dae-Ho;Kim, Dae-Hwan;Kang, Jin-Kyu;Ha, Ki-Ryong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.200-200
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    • 2010
  • In recent times, metal oxide semiconductors thin films transistor (TFT), such as zinc and indium based oxide TFTs, have attracted considerable attention because of their several advantageous electrical and optical properties. There are many deposition methods for fabrication of ZnO-based materials such as chemical vapor deposition, RF/DC sputtering and pulsed laser deposition. However, these vacuum process require expensive equipment and result in high manufacturing costs. Also, the methods is difficult to fabricate various multicomponent oxide semiconductor. Recently, several groups report solution processed metal oxide TFTs for low cost and non vacuum process. In this study, we have newly developed solution-processed TFTs based on Ti-related multi-component transparent oxide, i. e., InTiO as the active layer. We propose new multicomponent oxide, Titanium indium oxide(TiInO), to fabricate the high performance TFT through the sol-gel method. We investigated the influence of relative compositions of Ti on the electrical properties. Indium nitrate hydrate [$In(NO^3).xH_2O$] and Titanium isobutoxide [$C_{16}H_{36}O_4Ti$] were dissolved in acetylacetone. Then monoethanolamine (MEA) and acetic acid ($CH_3COOH$) were added to the solution. The molar concentration of indium was kept as 0.1 mol concentration and the amount of Ti was varied according to weighting percent (0, 5, 10%). The complex solutions become clear and homogeneous after stirring for 24 hours. Heavily boron (p+) doped Si wafer with 100nm thermally grown $SiO_2$ serve as the gate and gate dielectric of the TFT, respectively. TiInO thin films were deposited using the sol-gel solution by the spin-coating method. After coating, the films annealed in a tube furnace at $500^{\circ}C$ for 1hour under oxygen ambient. The 5% Ti-doped InO TFT had a field-effect mobility $1.15cm^2/V{\cdot}S$, a threshold voltage of 4.73 V, an on/off current ratio grater than $10^7$, and a subthreshold slop of 0.49 V/dec. The 10% Ti-doped InO TFT had a field-effect mobility $1.03\;cm^2/V{\cdot}S$, a threshold voltage of 1.87 V, an on/off current ration grater than $10^7$, and a subthreshold slop of 0.67 V/dec.

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