• Title/Summary/Keyword: Pulse laser ablation

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Treatment of Recurrent Respiratory Papillomatosis Using Laser and Available Adjuvant Therapies

  • Woo, Seung Hoon;Chung, Phil-Sang;Lee, Sang Joon
    • Medical Lasers
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    • v.9 no.2
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    • pp.126-133
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    • 2020
  • Recurrent respiratory papillomatosis (RRP) is a benign tumor that occurs in the respiratory tract, especially in the larynx. The etiology of RRP is human papillomavirus (HPV). According to the age of occurrence, RRP is divided into childhood-onset and adult-onset types. Generally, childhood-onset RRP shows a high recurrence rate and diffuse involvement in the respiratory tract. Adult-onset RRP is more localized and appears more frequently as a solitary lesion. It may be the result of sexual transmission or the proliferation of latent HPV infections. At present, the treatment of choice for RRP is CO2 laser ablation. In addition, pulse dye laser or KTP (KTiOPO: potassium-titanyl-phosphate) lasers are also used. Non-surgical adjuvant therapies can be applied in cases requiring repetitive surgery or with diffuse extensions. This review will introduce the clinical features of RRP and various treatment options including lasers.

Intrapulpal Temperature Change during Cavity Preparation on the Enamel and Dentin with an Er:YAG Laser (Er:YAG 레이저를 이용한 법랑질 및 상아질 와동 형성시의 치수내 온도변화)

  • Yang, Hee-Young;Kim, Mee-Eun;Kim, Ki-Suk
    • Journal of Oral Medicine and Pain
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    • v.30 no.4
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    • pp.457-464
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    • 2005
  • The purpose of our study was to investigate whether the intrapulpal temperature during cavity preparation of enamel or dentin with Er:YAG laser still remained in range of safety for dental pulp protection when combined with appropriate water flow rate. The effect of different pulse repetition rates at the same pulse energy during ablation was evaluated as well. Caries-free, restoration-free extracted human molar teeth were prepared for the specimen and divided two experimental groups of enamel and dentin. Each group comprised 5 specimens and each of tooth specimens were embedded into a resin block each and measuring probe was placed on the irradiated pulpal walls. For experiments of dentin ablation, enamel layers were prepared to produce dentin specimen with a same dentin thickness of 2 mm. A pulse energy of Er:YAG laser was set to 300 mJ and three different pulse repetition rates of 20 Hz, 15 Hz and 10 Hz were employed. Laser beam was delivered with 3 seconds and less per application over enamel and dentin surfaces constant sized by $3\;mm{\times}2\;mm$ and water spray added during irradiation was a rate of 1.6 ml/min. Temperature change induced by Er:YAG laser irradiation was monitored and recorded While enamel was ablated, there was no significant difference of temperature related to pulse repetition rates(p=0.358) and temperature change at any pulse repetition rate was negligible. Significant statistical difference in temperature changes during cavity preparation in dentin existed among three different pulse groups(p=0.001). While temperature rise was noticeable when the dentinal wall was perforated, actual change of temperature due to Er:YAG laser irradiation was not enough to compromise safety of dental pulp when irradiation was conjugated with appropriate water spray. Conclusively, it can be said that cavity preparation on enamel or dentin with an Er:YAG laser is performed safely without pulp damage if appropriate volume of water is sprayed properly over the irradiated site.

Time-resolved transient reflective image on silicon surface after single-shot fs-laser pulse irradiation (단일 펨토초 레이저펄스를 이용한 실리콘 표면에서의 시분해 반사율 측정 연구)

  • Moon, Heh-Young;Sidhu, Mehra Singh;Lee, Hyun-Kyu;Jeoung, Sae-Chae
    • Laser Solutions
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    • v.14 no.4
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    • pp.21-27
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    • 2011
  • In this work, we have studied on time-resolved transient reflective image of single crystalline Si surface after single-shot fs-laser irradiation with varying the laser fluence under two different laser spot sizes. The temporal profiles of transient reflectivity changes as well as its maximum values at the early delay time were found to be strongly dependent on both the laser beam spot size and laser fluence. We have interpreted the dependence of transient reflectivity changes on the laser spot size in terms of a relaxation of the generated free carriers to the bulk silicon, which should be interacted with the plasma.

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A Comparative Study of ITO Glass Ablation Using Femtosecond and Nanosecond Lasers (펨토초 레이저와 나노초 레이저를 이용한 ITO Glass의 어블레이션 비교 연구)

  • Jeon, Jin-Woo;Shin, Young-Gwan;Kim, Hoon-Young;Choi, Wonsuk;Ji, Seok-Young;Kang, Hee-Shin;Ahn, Sanghoon;Chang, Won Seok;Cho, Sung-Hak
    • Korean Journal of Optics and Photonics
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    • v.28 no.6
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    • pp.356-360
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    • 2017
  • Indium tin oxide (ITO) provides high electrical conductivity and transparency at visible and near-IR wavelengths. ITO is widely used as a transparent electrode for the fabrication of LCDs, OLEDs, and many kinds of optical applications. It is widely employed for electrodes in various electric and display sectors because of its transparency in the visible range and high conductivity. Therefore, one issue is removing a specific area of a layer of material such as ITO or metallic film on a substrate, without affecting the properties of the substrate. ITO-on-glass removal using a laser is friendlier to the environment than traditional methods. In this study, ablation of ITO film on glass using a femtosecond-laser micromachining system (wavelength 1026 nm, pulse duration 150 fs) and a nanosecond-laser micromachining system (wavelength 1027 nm, pulse duration 5 ns) are described, compared, and analyzed.

3D Packaging Technology Using Femto Laser (팸토초 레이저를 이용한 3차원 패키징 기술)

  • Kim, Ju-Seok;Sin, Yeong-Ui;Kim, Jong-Min;Han, Seong-Won
    • Proceedings of the KWS Conference
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    • 2006.10a
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    • pp.190-192
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    • 2006
  • The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

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A Spectroscopic Study on A Plume Produced By Laser Ablation of Graphite in a Nitrogen Atmosphere

  • Wee, Sang-Wook
    • Journal of Photoscience
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    • v.6 no.3
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    • pp.141-144
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    • 1999
  • A Spectroscopic study on a pulme produced by a reactive laser pulse irradiates the graphite target in a nitrogen atmosphere, two emission bands of C2(d3IIg longrightarrowa3 IIu, Swan band) and CN(B2$\Sigma$+ longrightarrowX$^2$$\Sigma$+, Violet band ) were observed. By simulation of the optical emissionspectra, spectroscopic temperature of $C_2$ and CN molecules were obtained. The depended of vibrational and rotational temperatures on the laser fluence and distance from the target as well as the pressure dependence of the emission intensities of $C_2$ and CN was examined to elucidate the expansion dynamics of the plume and formation mechanisms of $C_2$and CN molecules.

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Development of Internal Laser Scribing System for Cutting of Sapphire Wafer in LED Chip Fabrication Processes (LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 시스템 개발)

  • Kim, Jong-Su;Ryu, Byung-So;Kim, Ki-Beom;Song, Ki-Hyeok;Kim, Byung-Chan;Cho, Myeong-Woo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.6
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    • pp.104-110
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    • 2015
  • LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

Probing of Microscale Phase-Change Phenomena Based on Michelson Interforometry (Michelson 간섭계를 응용한 미세 상변화 현상 계측)

  • Kim, Dong-Sik;Park, Hee-K.;Grigoropoulos, Costas P.
    • Proceedings of the KSME Conference
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    • 2001.06d
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    • pp.348-353
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    • 2001
  • Experimental schemes that enable characterization of phase-change phenomena in the micro scale regime is essential for understanding the phase-change kinetics. Particularly, monitoring rapid vaporization on a submicron length scale is an important yet challenging task in a variety of laser-processing applications, including steam laser cleaning and liquid-assisted material ablation. This paper introduces a novel technique based on Michelson interferometry for probing the liquid-vaporization process on a solid surface heated by a KrF excimer laser pulse (${\lambda}=248nm,\;FWHM=24\;ns$) in water. The effective thickness of a microbubble layer has been measured with nanosecond time resolution. The maximum bubble size and growth rate are estimated to be of the order of $0.1{\mu}m\;and\;1\;m/s$, respectively. The results show that the acoustic enhancement in the laser induced vaporization process is caused by bubble expansion in the initial growth stage, not by bubble collapse. This work demonstrates that the interference method is effective for detecting bubble nucleation and microscale vaporization kinetics.

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Probing of Microscale Phase-Change Phenomena Based on Michelson Interforometry (Michelson 간섭계를 응용한 미세 상변화 현상 계측)

  • Kim, Dong-Sik;Park, Hui-Gwon;Grigoropoulos, Costas-P.
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.25 no.8
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    • pp.1140-1147
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    • 2001
  • Experimental schemes that enable characterization of phase-change phenomena in the microscale regime are essential for understanding the phase-change kinetics. Particularly, monitoring rapid vaporization on a submicron length scale is an important yet challenging task in a variety of laser-processing application, including steam laser cleaning and liquid-assisted material ablation. This paper introduces a novel technique based on Michelson interferometry for probing the liquid-vaporization process on a solid surface heated by a KrF excimer laser pulse(λ=248nm, FWHM=24ns) in water. The effective thickness of a microbubble layer has been measured with nanosecond time resolution. The maximum bubble size and growth rate are estimated to be of the order of 0.1㎛ and 1m/s, respectively. The results show that the acoustic enhancement in the laser induced vaporization process is caused by bubble expansion in the initial growth stage, not by bubble collapse. This work demonstrates that the interference method is effective for detecting bubble nucleation and microscale vaporization kinetics.

CUTTING EFFICACY OF Er:YAG LASER AND CONVENTIONAL BUR IN DECIDUOUS AND PERMANENT TEETH (Er:YAG laser와 Conventional bur의 유치와 영구치 치아삭제효과 비교)

  • Park, In-Cheon;Lee, Chang-Seop;Lee, Nan-Young;Lee, Sang-Ho
    • Journal of the korean academy of Pediatric Dentistry
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    • v.30 no.2
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    • pp.272-285
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    • 2003
  • This study was conducted to observe the microscopic structures of cavities formed after ablation of primary teeth, permanent teeth, enamel and dentin in using a bur and cavities formed after ablation using laser and the following results were obtained after comparing the effects of ablation. Using a #330 bur and Er:YAG laser irradiated at 150 mJ, 200 mJ, 250 mJ and 300 mJ all at the frequency of 5 Hz, 1 mm enamel and dentin samples were ablated and the ablation time was measured. In order to measure the surfaces ablated, 5 each of primary teeth and permanent teeth were ablated using a #330 bur and Er:YAG laser at 150 mJ, 200 mJ, 250 mJ and 300 mJ for 1 sec and the cross section and vertical section were observed. The following results were obtained : 1. Cutting time of Er:YAG laser was longer than that of conventinal high-speed bur regardless of teeth type. 2. Cutting on enamel, Cutting time of conventional high-speed bur in deciduous teeth was longer than in permanent teeth(P<0.05). But Er:YAG laser was not showed any difference between the deciduous and permanent teeth(P>0.05). 3. Cutting on dentin, Cutting time of conventional high-speed bur in permanent teeth was longer than deciduous teeth. Er:YAG laser of 150 mJ, 5 Hz in permanent teeth was longer than in deciduous teeth(p<0.05). But laser of other power did not showed mean difference. 4. The cavity surface treated with the convetional high-speed bur revealed a relatively flat appearance, almost covered with a debris-like smear layer. Cavity wall showed striped appearance because of blade of bur. 5. The cavity surface treated by the Er:YAG laser system was irregular or rough surface with the absence charring, carbonization, or cracking of the dentin. In addition, there was an absence of a smear layer. Cavity floor was round and relatively smooth. According to these results, cutting time of Er:YAG laser was almostly same in permanent and deciduous teeth, but more effective in dentin than enamel. Cutting the sample, Er:YAG laser was needed more time than conventional bur. But SEM findings suggested that laser device produced favorable surface characteristic(i.e, no smear layer, irregular surface, cracking).

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