• Biotechnology and Bioprocess Engineering:BBE
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• v.4 no.1
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• pp.46-50
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• 1999

The application of pulsed electric field was investigated in the crossflow ultrafiltration of BSA (bovine serum albumn) to economize the application time of electric current as well as to avoid inherent problems of long-term application of electric field. During the application of various cyclic patterns of pulsed electric current, the averaged filtration flowrate and the degree of concentration were maintained higher than those obtained in the absence of electric current application. The temperature increase, pH change, and BSA loss by electrodeposition were all negligible during the operation. The averaged filtration flowrate increased as the ON/OFF duration ratio of electric current was higher and as the period of ON/OFF cycle was shorter. The re-establishment of concentration polarization was dependent to the duration of current OFF state and, therefore, a longer duration of OFF state was not favorable in maintaining higher filtration flow rate. Although the averaged filtration flowrate was enhanced as the magnitude of electric current increased, the flowrate enhancement became smaller as the magnitude of current value above which the degree of electrokinetic depolarization is no further improved.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.178-179
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• 2014

In this study, $Ni-W-Si_3N_4$ alloy composite coatings were prepared by pulse electrodeposition method using nickel sulfate bath with different contents of tungsten source, $Na_2WO_4.2H_2O$, and dispersed $Si_3N_4$ nano particles. The structure and microstructure ofcoatings was separately analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Results indicated that nano $Si_3N_4$ and W content in alloy had remarkable effect on microstructure, microhardness and scratch resistant properties. Tungsten content in Ni-W and $Ni-W-Si_3N_4$ alloy ranged from 7 to 14 at.%. Scratch test results suggest that as compared to Ni-W only, $Ni-W-Si_3N_4$ prepared from Ni/W molar ratio of 1:1.5 dispersed with 20 g/L $Si_3N_4$ has shown the best result among different samples.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.171-172
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• 2015

$Ni-W-Si_3N_4$ alloy composite coatings were prepared by pulse electro-deposition method using nickel sulfate bath with different contents of tungsten source, $Na_2WO_4.2H_2O$, and dispersed $Si_3N_4$ nano-particles. The structure and micro-structure of coatings was separately analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Results indicated that nano $Si_3N_4$ and W content in alloy had remarkable effect on micro-structure, micro-hardness and scratch resistant properties. Tungsten content in Ni-W and $Ni-W-Si_3N_4$ alloy ranged from 7 to 14 at.%. Scratch test results suggest that as compared to Ni-W only, $Ni-W-Si_3N_4$ prepared from Ni/W molar ratio of 1:1.5 dispersed with 20 g/L $Si_3N_4$ has shown the best result among different samples.

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• Journal of the Korean Electrochemical Society
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• v.12 no.3
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• pp.276-281
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• 2009

Electrochemical behaviors of $U^{3+}$ and $Gd^{3+}$ were investigated in LiCl-KCl eutectic molten salt by using various electrochemical techniques. The electrodeposition and dissolution currents for uranium show the maximum at -1.51V and -1.35V, respectively while, for gadolinium,at -2.15V and -1.9V, respectively. In case of LiCl-KCl molten salt containing both of $U^{3+}$ and $Gd^{3+}$, the peak potential of electrodeposition of gadolinium shifts to more positive potential than in the solution without $U^{3+}$. The potentials in chronopotentiometric data suddenly dropped to negative value as soon as the reduction currents were applied and became constant at the potential around which the $U^{3+}$ and $Gd^{3+}$ are electrodeposited. The results of normal pulse voltammetry (NPV) and square wave voltammetry show that those methods can be used to qualitatively analyze the elements in the melts. Especially, the differentiation of NPV result was found to be useful for the separation of the peaks of which potentials are close each other.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.9
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• pp.1663-1670
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• 2006

Single crystal Fe thin films were grown directly onto n-Si(111) substrates by pulsed electrodeposition. Cyclic Voltammogram(CV) indicated that the $Fe^{2+}/n-Si(111)$ interface shows a good diode behavior by forming a Schottky barrier. From Mott-Schottky (MS) relation, it is found that the flat-band potential of n-Si(111) substrate and equilibrium redox potential of $Fet^{2+}$ ions are -0.526V and -0.316V, respectively. The nucleation and growth kinetics at the initial reaction stages of Fe/n-Si(111) substraste was studied by current transients. Current transients measurements have indicated that the deposition process starts via instantaneous nucleation and 3D diffusion limited growth. After the more deposition, the deposition flux of Fe ions was saturated with increase of deposition time. from the as-deposited sample obtained using the potential pulse of 1.4V and 300Hz, it is found that Fe nuclei grows to three dimensional(3D) islands with the average size of about 100nm in early deposition stages. As the deposition time increases, the sizes of Fe nuclei increases progressively and by a coalescence of the nuclei, a continuous Fe films grow on the Si surface. In this case, the Fe films show a highly oriented columnar structure and x-ray diffraction patterns reveal that the phase ${\alpha}-Fe$ grows on the n-Si(111) substrates.