• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.11
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• pp.566-571
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• 2004

Pulse modulation technique provide additional controling method for electron temperature and density in rf and microwave processing plasma. Transient characteristics of electron density and temperature have been measured in pulse modulated rf inductively coupled argon plasma using simple probe circuit. Electron temperature relaxation is clearly identified in the after glow stage. Controllability of average electron temperature and density depends on the modulation frequency and duty ratio. Numerical calculation of time-dependent electron density and temperature have been performed based on the global model. It has been shown that simple langmuir probe measurement method used for continuous plasma is also applicable to time-dependent measurement of pulse modulated plasma.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1817-1819
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• 2004

From the plasma application point of view, electron temperature and density are one of the most important parameters for plasma process. But it is only available to control plasma by adjusting external factors like gas pressure and input power. In this paper, pulse-modulated plasma is generated by modulating 13.56GHz RF power with 1, 5, 10kHz pulse. And Langmuir probe technique is used to study the distribution of electron temperature and density. When modulated pulse is off, electron temperature decreases gradually in form of exponential decay. The value t of exponential decay slope is 33.619, 13.834, 10.803 in 1kHz. 5kHz. 10kHz. This implies that this method can be used to control electron temperature and density.

• Journal of the Korean institute of surface engineering
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• v.45 no.2
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• pp.53-60
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• 2012

Modulated Pulse Power (MPP) magnetron sputtering is a new high-power pulsed magnetron sputtering (HPPMS) technology which overcomes the low deposition rate problem by modulating the pulse voltage shape, amplitude, and the duration. Highly ionized magnetron sputtering can be performed without arcing because it can be controlled as multiple steps of micro pulses within one overall pulse period in the range of 500-3,000 ${\mu}s$. In this study, the various waveforms of discharge voltage and current for micro pulse sets of MPP were investigated to find the possibility of controlling the strongly ionized plasma mode. Enhanced ionization of the sputtered metal atoms was obtained by OES. Large grained columnar structure can be grown by the strongly ionized plasma mode in the AZO deposition using MPP. In the most highly ionized deposition condition, the preferred orientation of (002) plane decreased, and the resistivity, therefore, increased by the plasma damage.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.192-193
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• 2012

2차 플라즈마를 사용하지 않고도 스퍼터링된 입자의 높은 이온화율을 얻을 수 있는 고전력 마그네트론 스퍼터링 기술은 최대 $MW/cm^2$의 높은 투입 전력을 이용하지만 타겟 재료의 높은 열전도 요구때문에 실제로 사용할 수 있는 재료가 Cu를 비롯한 몇가지 금속에 제한된다. 수 백 $kW/cm^2$의 중간 전력 밀도를 가질 수 있도록 펄스를 다중 부분 세트로 제어하는 modulated pulse plasma 시스템을 구축하고 전자 온도, 밀도를 고속으로 계측할 수 있는 삼중 프로브와 고증폭 CCD를 이용하여 공정 진단을 한 결과 전자 온도는 최고 15.9 eV, 전자 밀도는 $4.25{\times}10^{12}{\sharp}/cm^3$였으며 weak ionization 조건과 strong ionization 조건에서 Ar I (811.5 nm)의 방출광 세기가 6배 증가하는 것으로 분석되었다.

• Journal of the Korean institute of surface engineering
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• v.34 no.5
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• pp.395-402
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• 2001

An induction thermal plasma system have been newly designed for advanced operation with a pulse modulated mode to control the plasma power in time domain and to create non-equilibrium effects such as fast quenching of the plasma to produce new functional materials in high rate. The system consists of MOSFET power supply with a maximum power of 50 kW with a frequency of 460 kHz, an induction plasma torch with a 10-turns coil of 80 mm diameter and 150 mm length and a vacuum chamber. The pulse modulated plasma was successfully generated at a plasma power of 30 kW and a high pressure of 100 kPa, with taking the on and off time as 10 ms, respectively. Measurements were carried out on the time-dependent spectral lines emitted from Ar species. The dynamic behavior of plasma temperature in a pulse cycle was estimated by the Boltzmann plot and the excitation temperature of Ar atom was found to be changed periodically from around 0.5 to 1.7 eV during the cycle. Two application regions of the induction thermal plasma newly generated were introduced to material processing with high rate synthesis based on non equilibrium effects, and to the finding of new arc quenching gases coming necessary for power circuit breaker, which is friendly with earth circumstance alternative to SF6 gas.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.430-430
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• 2012

Modulated pulsed power (MPP) 스퍼터링은 펄스 전압 shape, amplitude, duration의 modulation을 통해 증착율 손실을 극복하는 고출력 펄스 마그네트론 스퍼터링의 한 종류이다. Micro second 범위에서 on/off 시간을 다중 세트 형태로 자유롭게 프로그램 할 수 있어서 아킹 없이 고전류 영역의 마그네트론 동작을 할 수 있으므로, 고주파 유도 결합 플라즈마원이나 마이크로웨이브 투입 등의 부가적인 플라즈마 없이도 스퍼터링 재료의 이온화 정도를 획기적으로 높일 수 있는 장점을 가지고 있다. 본 연구에서는 $2{\times}1{\times}0.2$의 sputtering system에서 기판 캐리어를 이용해서 $400{\times}400mm$ 기판을 $272{\times}500mm$ 크기의 AZO target (Al 2 wt%)이 설치되어 있는 moving magnet cathode (MMC)을 이용하여 MPP로 증착했다. 두 종류의 micro pulse set을 하나의 macro pulse에 사용함으로서 weakly ionized plasma와 strongly ionized plasma를 만들 수 있다. 다양한 micro pulse set을 이용하여 평균 전력 2 kW에서 peak 전력을 4 kW에서 45 kW까지 상승 시킬 수 있으며, 이 때 타겟-기판 거리 80 mm에서 이온전류밀도는 $5mA/cm^2$에서 $20mA/cm^2$까지 상승했다. MPP는 같은 평균 전력에서 repetition frequency가 증가할 때, 증착 속도가 증가했으며, 같은 repetition frequency에서 macro pulse length가 증가할 때도, 증착 속도가 증가했다. 최적화된 marco, micro pulse set에서 증착 속도는 평균 전력 2 kW에서 110 nm/min이었고, 700 nm의 박막에서 비저항은 $1-2{\times}10^{-3}ohm{\cdot}cm$였다. 표면거칠기 Rrms는 약 3 nm였고, 400-700 nm 영역의 평균 투과도는 72-76%였다.

• Journal of the Korean institute of surface engineering
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• v.47 no.3
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• pp.109-115
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• 2014

High power impulse magnetron sputtering (HIPIMS), also known as the technology is called peak power density in a short period, you can get high, so high ionization sputtering rate can make. Higher ionization of sputtered species to a variety of coating materials conventional in the field of improving the characteristics and self-assisted ion thin film deposition process, which contributes to a superior being. HIPIMS at the same power, but the deposition speed is slow in comparison with DC disadvantages. Since recently as a replacement for HIPIMS modulated pulse power (MPP) has been developed. This ionization rate of the sputtered species can increase the deposition rate is lowered and at the same time to overcome the problems to be reported. The differences between the MPP and the HIPIMS is a simple single pulse with a HIPIMS whereas, MPP is 3 ms in pulse length is adjustable, with the full set of multi-pulses within the pulse period and the pulse is applied can be micro advantages. In this experiment, $In_2O_3$ : $SnO_2$ composition ratio of 9 : 1 wt% target was used, Ar : $O_2$ flow rate ratio is 4.8 to 13.0% of the rate of deposition was carried out at room temperature. Ar 40 sccm and the flow rate of $O_2$ and then fixed 2 ~ 6 sccm was compared against that. The thickness of the thin film deposition is fixed at 60 nm, when the partial pressure of oxygen at 9.1%, the specific resistance value of $4.565{\times}10^{-4}{\Omega}cm$, transmittance 86.6%, mobility $32.29cm^2/Vs$ to obtain the value.

• Proceedings of the KIEE Conference
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• 2005.10c
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• pp.223-225
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• 2005

This paper presents a novel prototype of a current source resonant inverter using insulated gate bipolar transistors for driving a streamer reactor, streamer generation technology has been recognized as one of the best methods for water treatment, disinfection, industrial wastes utilization, and so on. However, some technological difficulties related to efficient streamer production have been significant problems restricting streamer usage in the industrial plants. Introduced in this paper is a pulse density modulated high frequency inverter for a plasma generate, which is developed with the aim to improve power conversion and control characteristics of the streamer reactor by using advances in power electronic technology. The developed system implements the feedforward control-based pulse density modulation control scheme with pulse width modulation feedback control strategy to compensate temperature and other environmental influences on streamer discharge.

• Proceedings of the Korean Vacuum Society Conference
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• 1994.06a
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• pp.155-156
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• 1994

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.488-488
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• 2013

일반적으로 sputtering 방식을 이용한 박막 증착 방법은 장치가 간단하고 고품질의 박막이나 균일한 박막을 만들 수 있는 장점이 있어 널리 사용된다. 본 연구에서는 기존의 sputtering 방식에 Modulation technology를 적용하고자 한다. Modulation technology를 이용하여 전원의 pulse on 시에는 일반적인 sputter 방식으로 기판에 박막을 증착하고 pulse off 시에는 양의 전압을 인가하여 이온빔을 발생시킨 후 기판에 입사시키는 방식을 적용하여 박막 형성의 특성을 향상시키고자한다. 이는 고온의 heater 및 이온빔이나 레이저, 플라즈마 소스 등의 추가적인 에너지원의 장치가 필요 없이 고품질의 박막의 특성을 향상시키는 기대 효과가 있다. Modulated Sputtering System (MSS)에 인가되는 전압과 전류의 특성을 관찰하였으며 MSS에 인가하는 전압과 frequency, 그리고 duty cycle 변화에 따른 이온 에너지 분포를 에너지 분석기를 통해 측정하였다. 또한 Langmuir probe를 이용한 afterglow plasma 상태에서의 이온전류를 측정하였다. 그리고, MSS 이용하여 Ti 박막을 증착하였으며 박막의 특성을 분석하기 위하여 a-step, SEM, XRD, AFM을 이용하여 두께, 결정성장면, 표면 거칠기를 측정하였다. 측정 결과 기판에 입사되는 양이온의 에너지가 증가함에 따라 (002) 결정면 방향에서 (100) 결정면 방향으로 증착되고 표면 거칠기가 낮아짐을 측정하였다. 또한 Graphite 타겟을 이용한 carbon 박막을 증착하였으며 박막의 특성을 분석하기 위하여 Raman을 이용한 분석 결과 양이온의 에너지가 증가함에 따라 박막내의 sp3 함유량이 변화함을 측정하였다.