• The Journal of Advanced Prosthodontics
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• v.10 no.3
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• pp.197-204
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• 2018

PURPOSE. To determine the extent of treatment traces, the roughness depth, and the quantity of titanium nitride (TiN) removed from the surface of CAD/CAM abutments after treatment with various instruments. MATERIALS AND METHODS. Twelve TiN coated CAD/CAM abutments were investigated for an in vitro study. In the test group (9), each abutment surface was subjected twice (150 g vs. 200 g pressure) to standardized treatment in a simulated prophylaxis measure with the following instruments: acrylic scaler, titanium curette, and ultrasonic scaler with steel tip. Three abutments were used as control group. Average surface roughness (Sa) and developed interfacial area ratio (Sdr) of treated and untreated surfaces were measured with a profilometer. The extent of treatment traces were analyzed by scanning electron microscopy. RESULTS. Manipulation with ultrasonic scalers resulted in a significant increase of average surface roughness (Sa, P<.05) and developed interfacial area ratio (Sdr, P<.018). Variable contact pressure did not yield any statistically significant difference on Sa-values for all instruments (P=.8). Ultrasonic treatment resulted in pronounced surface traces and partially detachment of the TiN coating. While titanium curettes caused predominantly moderate treatment traces, no traces or detectable substance removal has been determined after manipulation with acrylic curettes. CONCLUSION. Inappropriate instruments during regular plaque control may have an adverse effect on the integrity of the TiN coating of CAD/CAM abutments. To prevent defects and an increased surface roughness at the transmucosal zone of TiN abutments, only acrylic scaling instruments can be recommended for regular maintenance care.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.8
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• pp.42-47
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• 2010

In this paper, the characteristics of contact surface damage due to fretting in a press-fitted shaft below the fretting fatigue limit are proposed by experimental methods. A series of fatigue tests and interrupted fatigue tests of small scale press-fitted specimen were carried out by using rotating bending fatigue test machine. Macroscopic and microscopic characteristics were examined using scanning electron microscope (SEM), optical microscope or profilometer. It is found that fretting fatigue cracks were initiated even under the fretting fatigue limit on the press-fitted shafts by fretting damage. The fatigue cracks of press-fitted shafts were initiated from the edge of contact surface and propagated inward in a semi-elliptical shape. Furthermore, the fretting wear rates at the contact edge are increased rapidly at the initial stage of total fatigue life. After steep increasing, the increase of wear rate is nearly constant under the load condition below the fretting fatigue limit. It is thus suggested that the fretting wear must be considered on the fatigue life evaluation because the fatigue crack nucleation and propagation process is strongly related to the evolution of surface profile by fretting wear in the press-fitted structures.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.204-204
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• 1999

The plasma source ion implantation(PSII) technique which is a method using high negative voltage pulse in plasma system has the potential to change the surface properties of polymer. PSII technique increase the surface free energy by introducing polar functional groups on the surface so that it improves reactivity, hydrophilicity, adhension, biocompatability, etc. However, the mobility of polymer chains enables the modified surface layers to adapt their composition to interfacial force. This hydrophobic recovery interrupts the stability of modified surfaces to keep for the long time. In this study, poly(methyl methacrylate)(PMMA), poly(2-hydroxyethyl methacrylate)(PHEMA), and polu(2-hydroxypropyl methacylate)(PHPMA) for contact lens application, were modified to improve the wettability with PSII technique and were investigated the surface stabilities. Polymer film was prepared with solution casting(3 wt.% solution) and was annealed at 11$0^{\circ}C$ under vacuum oven to remove solvent completely and to eliminate physical ageing. The thickness of the film measured by scanning electron microscopy (SEM) and surface profilometer was about 10${\mu}{\textrm}{m}$. Polymers were treated with different kinds of gases, pulse frequency, pulse with, pulse voltage, and treatment time. Even though PMMA, PHEMA, and PHPMA have similar repeat unit structure, the optimal treatment conditions and the tendency to hydrophobic recovery were different. PHPMA, more hydrophilic polymer than PMMA and PHEMA showd better wettability and stability after mild treatment. Surface tensions were obtained by water and diiodomethane contact angle measurements to monitor the relation between hydrophobic recovery and polymer structure. Different ion species in plasma change the polar component and dispersion component of polymer surface. For better wettability surface, the increase of polar component was a dominant factor. We also characterized modified polymer surfaces using x-ray photoelectron spectroscopy(XPS), secondary ion mass spectrometry(SIMS), Fourier Transform infrared spectroscopy(FT-IR), and SEM.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.111-111
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• 1999

반도체 소자의 고집적화 및 고속화에 따라 다층 금속배선에서의 RC 지연이 전체 지연의 주된 요소로 되고 있다. 이런 RC 진연을 줄이기 위해서 현재 다층 금속배선의 층간 절연막으로 사용하고 있는 SiO2 박막(k~3.9)을 보다 낮은 유전상수(low-k)를 가지는 물질로 대체할 것이 요구된다. 층간 절연막으로서 가져야 할 가장 중요한 것은 낮은 유전상수와 높은 열적안정성($\geq$45$0^{\circ}C$)이다. 본 연구에서는 Toluene을 precursor로 사용한 PECVD방법으로 low-k 유사중합체 유기박막을 성장시켰으며 부동한 온도에서 성장된 박막의 특성을 비교하여 증착온도가 박막의 특성에 미치는 영향에 대하여 조사하였다. 유사중합체 유기박막은 platinum(Pt)기판과 silicon 기판위에 같이 증착되었다. Precursor는 4$0^{\circ}C$로 유지된 bubbler에 담겨지고 증발된 precursor molecules는 Argon(Ar:99.999%) carrier 가스에 의해 process reactor 내부로 유입된다. Plasma는 RF(13.56MHz generator로 연결된 susceptor 주위에 발생시켰다. Silicon 기판위에 증착한 시편으로 Fourier transform infrared (FTIR) spectra 및 열적 안정성을 측정하였고, Pt 기판위에 증착한 시편으로 Al/유기박막/Pt 구조의 capacitor를 만들어 열적안정성을 측정하였고, Pt 기판위에 증착한 시편으로는 Al/유기박막/Pt 구조의 capacitor를 만들어 K값 및 절연성을 측정하였다. Capacitance는 1MHz 주파수에서 측정하였다. 열적안정성은 30분동안 Ar 분위기에서 annealing하기 전후의 증착막의 두께의 변화를 측정함으로써 조사하였으며 유기박막의 두께는 surface profilometer로 측정하였다. 증착온도가 45$^{\circ}C$에서 15$0^{\circ}C$, 25$0^{\circ}C$로 높아짐에 따라 k값은 높아졌지만 대신 열적안정성은 좋아졌다. plasma power 30W인 경우 45$^{\circ}C$에서 증착했을 때 유전상수는 2.80으로 낮았지만 40$0^{\circ}C$에서 30분 동안 열처리한 후 두께가 49% 감소하였다. 그러나 25$0^{\circ}C$에서 증착했을 때 유전상수는 3.10으로 좀 높아졌지만 열적으로는 40$0^{\circ}C$까지 안정하였으며 45$0^{\circ}C$에서도 두께의 감소는 8%에 불과했다.

• The Journal of Advanced Prosthodontics
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• v.12 no.1
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• pp.22-32
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• 2020

PURPOSE. The aim of this study was to evaluate the microshear bond strength (µSBS) of four computer-aided design/computer-aided manufacturing (CAD/CAM) blocks repaired with composite resin using three different surface treatment protocols. MATERIALS AND METHODS. Four different CAD/CAM blocks were used in this study: (1) flexible hybrid ceramic (FHC), (2) resin nanoceramic (RNC), (c) polymer infiltrated ceramic network (PICN) and (4) feldspar ceramic (FC). All groups were further divided into four subgroups according to surface treatment: control, hydrofluoric acid etching (HF), air-borne particle abrasion with aluminum oxide (AlO), and tribochemical silica coating (TSC). After surface treatments, silane was applied to half of the specimens. Then, a silane-containing universal adhesive was applied, and specimens were repaired with a composite, Next, µSBS test was performed. Additional specimens were examined with a contact profilometer and scanning electron microscopy. The data were analyzed with ANOVA and Tukey tests. RESULTS. The findings revealed that silane application yielded higher µSBS values (P<.05). All surface treatments were showed a significant increase in µSBS values compared to the control (P<.05). For FHC and RNC, the most influential treatments were AlO and TSC (P<.05). CONCLUSION. Surface treatment is mandatory when the silane is not preferred, but the best bond strength values were obtained with the combination of surface treatment and silane application. HF provides improved bond strength when the ceramic content of material increases, whereas AlO and TSC gives improved bond strength when the composite content of material increases.

• Restorative Dentistry and Endodontics
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• v.19 no.2
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• pp.513-533
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• 1994

The smooth surface after polishing of composite resin contributes to the patient's comfort, and appearance and longevity of the restoration. This study was performed for the quantitative analysis of the effects of the various finishing and polishing instruments on the surface roughness and reflectivity of the microfill, and hybrid composite resins. Cylindrical specimens 2mm thick and 10mm in diameter of Silux Plus, Durafill VS ; Z100, Prisma TPH, Brilliant, and Herculite XR composite resin were polymerized under the matrix strip. 18 specimens for each composite resin materials were divided into 6 groups ; 5 experimental groups were abraded with # 600 sand paper to remove resin-rich layer, except control. Thereafter, using diamond bur(Mani Dia-Burs), carbide bur(E. T. carbide set 4159), rubber point(Composite polishing kit), aluminum-oxide disk(Sof-Lex disk), polishing paste(Enhance system) ; each specimen was polished to its best achievable surface according to manufacturer's directions. Final polished surfaces were evaluated for the surface roughness with profilometer(${\alpha}$-step 200, Tencor instruments, USA) and for the reflectivity with image analyser(Omniment Image Analyser, Buehler, USA). The results were as follows. 1. Polishing paste or aluminum-oxide disk finish in the microfill, and hybrid composite resins was as smooth as matrix strip finish on the surface roughness test. 2. Polishing paste or aluminum-oxide disk finish in the microfill ; polishing paste finish in the hybrid composite resins was as reflective as matrix strip finish on the refectivity test. 3. For the polishing paste, there were no significant differences between the composite resin materials on the surface roughness and refectivity tests. 4. For the aluminum-oxide disk, the best result was obtained with the microfill composite resin on the surface roughness and reflectivity test. 5. Diamond bur, carbide bur, and rubber point were inappropriate for the final polishing instruments.

• Tunnel and Underground Space
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• v.22 no.6
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• pp.438-448
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• 2012

Applicability of the digital photogrammetry technique for measurement of rock joint roughness is addressed in this study using the DSLR camera. Measurements of roughness were performed for two rock joint specimens using the laser profiler and the digital photogrammetry technique. The statistical roughness parameters were estimated for two dimensional roughness profiles constructed from each method. Obtained results showed that the statistical roughness parameters estimated from the digital photogrammetry technique were lower than that based on the laser profilometer, even though a high degree of correlation might exist between them. The effects of camera direction on roughness measurements were found to negligible in practice. The digital photogrammetry could be a cost effective method to measure the roughness of rock joints with various scale at the fields.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.77-77
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• 2011

These days, a growing demand for memory device is filled up with the flash memory and the dynamic random access memory (DRAM). Although DRAM is a reasonable solution for current demand, the universal novel memory with high density, high speed and nonvolatility, needs to be developed. Among various new memories, the magnetic random access memory (MRAM) device is considered as one of good candidate memories because of excellent features including high density, high speed, low operating power and nonvolatility. The etching of MTJ stack which is composed of magnetic materials and insulator such as MgO is one of the vital process for MRAM. Recently, MgO has attracted great interest in the MTJ stack as tunneling barrier layer for its high tunneling magnetoresistance values. For the successful realization of high density MRAM, the etching process of MgO thin films should be investigated. Until now, there were some works devoted to the investigations on etch characteristics of MgO thin films. Initially, ion milling was applied to the etching of MgO thin films. However, ion milling has many disadvantages such as sidewall redeposition and etching damage. High density plasma etching containing the magnetically enhanced reactive ion etching and high density reactive ion etching have been employed for the improvement of etching process. In this work, inductively coupled plasma reactive ion etching (ICPRIE) system was adopted for the improvement of etching process using MgO thin films and etching gas mixes of $CH_4$/Ar and $CH_4$/$O_2$/Ar have been employed. The etch rates are measured by a surface profilometer and etch profiles are observed using field emission scanning emission microscopy (FESEM). The effects of gas concentration and etch parameters such as coil rf power, dc-bias voltage to substrate, and gas pressure on etch characteristics will be systematically explored.

• The Journal of Advanced Prosthodontics
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• v.6 no.6
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• pp.462-467
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• 2014

PURPOSE. This study investigated the influence of surface conditioning procedures and repeated firings on monoclinic content and strength of zirconia before cementation. MATERIALS AND METHODS. Sintered bar-shaped zirconia specimens were subjected to no surface treatment (control), air abrasion, or grinding (n=21). Their roughness was evaluated using a profilometer, and microscope analysis was performed on one specimen of each group. Then, 2 or 10 repeated firings (n=10) were executed, the monoclinic content of specimens was analyzed by X-ray diffraction, and a three-point flexural strength test was performed. Surface roughness values were compared using one-way analysis of variance (ANOVA) and Tukey honestly significant difference (HSD) tests, the monoclinic content values were tested using Kruskal-Wallis and Mann-Whitney U tests, and the flexural strength values were tested using two-way ANOVA and Tukey HSD tests (P=.05). Spearman's correlation test was performed to define relationships among measured parameters. RESULTS. Surface-treated specimens were rougher than untreated specimens and had a higher monoclinic content (P<.005), and the relationship between roughness and monoclinic content was significant (P<.000). Neither surface treatment nor firing significantly affected the flexural strength, but Weibull analysis showed that for the air-abraded samples the characteristic strength was significantly lower after the $10^{th}$ firing than after the $2^{nd}$ firing. CONCLUSION. After firing, a negligible amount of monoclinic content remained on the zirconia surfaces, and rougher surfaces had higher monoclinic contents than untreated surfaces. Multiple firings could be performed if necessary, but the fracture probability could increase after multiple firings for rougher surfaces.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.472-472
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• 2011

The capacitive coupled plasma (CCP) has been extensively used in the semiconductor industry because it has not only good uniformity, but also low electron temperature. But CCP source has some problems, such as difficulty in varying the ion bombardment energy separately, low plasma density, and high processing pressure, etc. In this reason, dual frequency CCP has been investigated with a separate substrate biasing to control the plasma parameters and to obtain high etch rate with high etch selectivity. Especially, in this study, we studied on the etching of $SiO_2$ by using the pulse-time modulation in the dual-frequency CCP source composed of 60 MHz/ 2 MHz rf power. By using the combination of high /low rf powers, the differences in the gas dissociation, plasma density, and etch characteristics were investigated. Also, as the size of the semiconductor device is decreased to nano-scale, the etching of contact hole which has nano-scale higher aspect ratio is required. For the nano-scale contact hole etching by using continuous plasma, several etch problems such as bowing, sidewall taper, twist, mask faceting, erosion, distortions etc. occurs. To resolve these problems, etching in low process pressure, more sidewall passivation by using fluorocarbon-based plasma with high carbon ratio, low temperature processing, charge effect breaking, power modulation are needed. Therefore, in this study, to resolve these problems, we used the pulse-time modulated dual-frequency CCP system. Pulse plasma is generated by periodical turning the RF power On and Off state. We measured the etch rate, etch selectivity and etch profile by using a step profilometer and SEM. Also the X-ray photoelectron spectroscopic analysis on the surfaces etched by different duty ratio conditions correlate with the results above.