• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 한국포장학회지
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• 제27권3호
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• pp.203-210
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• 2021

With the development of package printing technology, the package has expanded from the basic function of protecting products to the marketing function through package design. Color, the visual element that composes the package design, is delivered to the consumer most quickly and effectively. As color marketing of these package designs expands, accurate color reproduction that the product wants to express is becoming more important. The color of an object is transmitted by absorption and scattering of light. Spectral reflectance refers to the intensity of light reflected by an object at different wavelengths by the spectral effect. As a result, the color of the object is expressed in various colors. Packaged printing inks have their own absorption and scattering coefficients, and the Kubelka-Munk model for color reproduction and prediction defines the relationship between these correlation coefficients through reflectance. In the Kubelka-Munk model for color reproduction and prediction, the relationship between the absorption and scattering coefficients (K/S) of printed material is predicted as the sum of the K/S values according to the mixing ratio of all color ink used. In this study, the reflectance of the measured print is reversely calculated at the mixing ratio of print ink using the Kubelka-Munk model. Through this, the relationship value of the ink-specific absorption/scattering coefficient constituting the final printed material is predicted. Delta E is derived through the predicted reflectance, and the similarity between the measured value and the predicted value is confirmed.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2001년도 정기학술대회
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• pp.277-278
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• 2001

The successful operation of a product In service depends upon the effective provision of logistic support in order to achieve and maintain the required levels of performance and customer satisfaction. Logistic support encompasses the activities and facilities required to maintain a product (hardware and software) in service. Logistic support covers maintenance, manpower and personnel, training, spares, technical documentation and packaging handling, storage and transportation and support facilities.The cost of logistic support is often a major contributor to the Life Cycle Cost (LCC) of a product and increasingly customers are making purchase decisions based on lifecycle cost rather than initial purchase price alone. Logistic support considerations can therefore have a major impact on product sales by ensuring that the product can be easily maintained at a reasonable cost and that all the necessary facilities have been provided to fully support the product in the field so that it meets the required availability. Quantification of support costs allows the manufacturer to estimate the support cost elements and evaluate possible warranty costs. This reduces risk and allows support costs to be set at competitive rates.Integrated Logistic Support (ILS) is a management method by which all the logistic support services required by a customer can be brought together in a structured way and In harmony with a product. In essence the application of ILS:- causes logistic support considerations to be integrated into product design;- develops logistic support arrangements that are consistently related to the design and to each other;- provides the necessary logistic support at the beginning and during customer use at optimum cost.The method by which ILS achieves much of the above is through the application of Logistic Support Analysis (LSA). This is a series of support analysis tasks that are performed throughout the design process in order to ensure that the product can be supported efficiently In accordance with the requirements of the customer.The successful application of ILS will result in a number of customer and supplier benefits. These should include some or all of the following:- greater product uptime;- fewer product modifications due to supportability deficiencies and hence less supplier rework;- better adherence to production schedules in process plants through reduced maintenance, better support;- lower supplier product costs;- Bower customer support costs;- better visibility of support costs;- reduced product LCC;- a better and more saleable product;- Improved safety;- increased overall customer satisfaction;- increased product purchases;- potential for purchase or upgrade of the product sooner through customer savings on support of current product.ILS should be an integral part of the total management process with an on-going improvement activity using monitoring of achieved performance to tailor existing support and influence future design activities. For many years, ILS was predominantly applied to military procurement, primarily using standards generated by the US Government Department of Defense (DoD). The military standards refer to specialized government infrastructures and are too complex for commercial application. The methods and benefits of ILS, however, have potential for much wider application in commercial and civilian use. The concept of ILS is simple and depends on a structured procedure that assures that logistic aspects are fully considered throughout the design and development phases of a product, in close cooperation with the designers. The ability to effectively support the product is given equal weight to performance and is fully considered in relation to its cost.The application of ILS provides improvements in availability, maintenance support and longterm 3ogistic cost savings. Logistic costs are significant through the life of a system and can often amount to many times the initial purchase cost of the system.This study provides guidance on the minimum activities necessary to Implement effective ILS for a wide range of commercial suppliers. The guide supplements IEC60106-4, Guide on maintainability of equipment Part 4: Section Eight maintenance and maintenance support planning, which emphasizes the maintenance aspects of the support requirements and refers to other existing standards where appropriate. The use of Reliability and Maintainability studies is also mentioned in this study, as R&M is an important interface area to ILS.

• 한국콘텐츠학회논문지
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• 제16권1호
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• pp.42-51
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• 2016

오늘날 유통구조의 변화는 오프라인에서 온라인으로 급격하게 수요가 변화해 가고 있다. 이러한 현상은 상품을 편리하게 구입하고자 하는 소비자의 심리가 반영되어 있다고 할 수 있다. 농산물 역시 내용물을 보호하려는 안전성과 소비자들에게 신뢰를 줄 수 있는 브랜드 및 디자인이 어느때보다 중요하게 인식되어지고 있다. 특히, 딸기 과채류는 다른 과채류에 비해 껍질이 얇아서 약한 충격과 흔들림에도 상품의 품질이 떨어지기 때문에 패키지의 지기구조나 소재에 안정성 영향을 많이 받는다. 또한, 직거래 유통이 많은 과채류다보니 생산농가의 열약한 환경 때문에 패키지디자인이 다른 상품에 비해 경쟁력이 떨어지는 것이 현실이다. 즉, 딸기 수요가 날로 증가하는데 비해 딸기패키지는 생산자와 소비자 욕구에 충족하지 못한다는 점이다. 딸기판매에 경쟁력 강화를 위해서는 패키지개발의 기초연구가 시급한 실정이다. 패키지요소(형태, 소재, 디자인) 조사 분석을 통하여 패키지의 문제점을 파악하고, IPA MAP(중요도, 만족도)분석을 통하여 생산자와 소비지가 추구하는 개선점을 파악하고자 한다.

• 실천공학교육논문지
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• 제15권1호
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• pp.209-221
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• 2023

반도체 제조 공정에서 사용되는 제품의 외관 검사 및 포장 단계에서 정전기에 의해 particle이 제품 자체나 운반용 도구 등에 흡착되는 문제가 발생한다. 본 연구는 실용 트리즈 기법을 활용하여 제품에 particle이 흡착되는 문제를 개선할 수 있는 방법론을 제시한다. 제시한 실용 트리즈 기반의 방법론을 적용하여 문제를 정의하고, 제품 대기 시간으로 인해 발생하는 모순을 도출하였다. 도출된 모순 중 물리적 모순을 설정하고 '공간분리'의 개념을 적용하여 '이오나이저 설치' 및 '작업실 Layout 개선'이라는 해결방안을 도출하였다. 실용 트리즈 적용을 통해 도출한 '이오나이저 설치' 및 '작업실 Layout 개선'을 적용하여 실험한 결과, 제품이 대기하는 시간에서 발생되는 particle 흡착 문제를 해결할 수 있음을 확인하였다. 본 연구를 통해, 제조현장에서 근무하는 작업자, 설비 엔지니어, 기술 엔지니어들이 실용 트리즈 기법을 활용하여 창의적 사고, 발상의 전환을 통해 직면한 문제를 효과적으로 해결하고 혁신적인 기술개발 및 생산성 향상에 기여할 수 있을 것이다.

• 한국수산과학회지
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• 제39권2호
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• pp.85-93
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• 2006

This study was conducted to evaluate the optimal processing conditions of smoke-dried powdered oysters and to determine their shelf-life during storage for development of a natural oyster flavoring substance. The optimal conditions for processing of smoke-dried oyster powder with freshy oyster were as follows. Raw shelled oysters were rinsed with 3% saline solution, drained, boiled for 10 minutes at $98^{\circ}C$, and then smoked for 1 hour at $50^{\circ}C$, followed by drying for 4 hours at $80^{\circ}C$ Smoke-dried oyster powder with oyster scraps were prepared as flavoring material. The smoked oyster scraps were submerged in oyster sauce far 10 minutes at room temperature and then dried with hot air for 5 hours at $50^{\circ}C$. The smoke-dried oysters and smoke-dried oyster scraps were then pulverized to 50 mesh and packed in tea bags or vacuum-packed in laminated plastic film bags (PE/PVDC/CPP, $12{\mu}m/15{\mu}m/50{\mu}m$). Compared to non smoke-dried powdered oysters, the smoking and dipping in oyster sauce enhanced the flavor and prevented lipid oxidation of the smoke-dried powdered oyster product. Shelf-life tests indicated that the vacuum-packaging method preserved the quality of smoke-dried powdered oysters stored for 150 days at room temperature.

• 한국산학기술학회논문지
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• 제15권11호
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• pp.6472-6477
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• 2014

본 연구는 최근 영역을 넓히고 있는 일러스트 작가의 아트마케팅 트랜드를 살펴보고 색조화장품의 디자인 컨셉을 제안하고자 한다. 아트마케팅은 문화마케팅의 한 종류로 전시, 공연, 기타 예술 활동을 통한 마케팅을 의미한다. 아트와 생활의 경계가 모호해 지고 아트적인 모티브가 제품 속으로 녹아들고 아트적 속성이 다시 캔버스에 반영될 수 있는 자유로운 감성 표현이 주목받고 있다. 일러스트 작가의 작품들이 캔버스가 아닌 생활속의 아이템으로 영역을 넓히고 있는 것이다. 본 논문에서는 아트마케팅을 반영한 색조화장품 디자인을 제안하였다. 디자인 컨셉을 제안한 주요 타켓층은 20대 초중반의 젊은층으로 그들은 트랜드 지향적이며 개성이 강하고 스스로 인정받고 싶어하는 경향이 있다. 색조화장품 패키지 디자인에 디자인 컨셉을 강조하기 위하여 현란하고 강렬한 색상조합으로 타겟 계층의 진취적인 이미지를 반영하였다. 아트적인 무드가 생활속에 파고 들면서 우리 생활에 문화적 가치와 의미를 제공하고 있음을 알 수 있다.

• 한국산학기술학회논문지
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• 제11권1호
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• pp.1-6
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• 2010

본 연구에서는 성형해석 및 실험적 방법을 통하여 페트 용기의 두께 편차를 최소화하기 위한 프리폼 최적화 설계를 수행하였다. 사출성형과정을 정확하게 묘사하기 위하여 3차원 모델을 이용하여 충진, 보압 및 냉각해석을 통하여 최적의 프리폼 설계변수를 설정하였으며, 이 결과를 이용하여 블로우 성형해석을 수행하였다. 성형해석결과를 평가하기 위한 사출성형 및 블로우 성형실험을 수행하였으며, 실험결과와 해석결과는 정성적으로 일치하는 것을 확인하였다. 이러한 실험결과 데이타를 설계에 반영함으로서 최적의 프리폼 형상을 얻을 수가 있었다.

• 복식문화연구
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• 제30권1호
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• pp.102-120
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• 2022

With the growing importance of ESG as a must-have business strategy, this study attempted to analyze the current state of ESG practices in the Korean fashion businesses. The ESG cases of fashion business were collected from news articles searched on the largest Korean internet portal by November 2021 from October 2020 when the number of articles began to increase meaningfully. Three hundred ninety one ESG cases of 112 fashion manufacturing brands and 332 ESG cases of 49 retail brands were analyzed. Casual and outdoor/sportswear brands among fashion manufacturers were most active in ESG practices, and various online and offline retailers were practicing ESG. Approximately one-third of the fashion brands were positioned as eco-friendly concept. While environmental practices were the most practiced ESG, governance was the least practiced. Among environmental practices, fashion manufacturing businesses were most active in eco-friendly product development, while retail businesses were in eco-friendly campaign-event-service and eco-friendly packaging. The most active social practice was the contribution to communities, followed by retail businesses' sharing growth with partner businesses. Governance practices were focused on the structure and operation of the board. Various ESG collaborations with various partners were also observed. The research result is meaningful verifying and diagnosing the ESG practices of the Korean fashion businesses.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).