• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.1
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• pp.154-163
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• 1997

Thermally-induced deformation in SMC(Sheet Molding Compound) products is analyzed using three dimensional finite element method. Planar fiber orientation, which causes the anisotropic material properties, is calculated through the flow analysis during the compression stage of the mold. Also curing process is analyzed to predict temperature profile which has significant effects on warpage of SMC products. Through the developed procedure, effects of various process conditions such as charge location, mold temperature, fiber contents, and fiber orientations on deformation of final products are studied. and processing strategies are proposed to reduce the warpage and the shrinkage.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.66-68
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• 2004

Induction heating is a process that is accompanied with magnetic and thermal situation. When the high-frequency current flows in the coil, induced eddy current generates heat to conductor. To simulate an induction heating process, the finite element analysis program was developed. A coupling method between the magnetic and thermal routines was developed. In the process of magnetic analysis and thermal analysis, magnetic material properties and thermal material properties depending on temperature are taken into consideration. In this paper, to predict the angular deformation, temperature difference and the shape of heat affected zone were discussed. Also appropriate coil shape for maximum angular deformation were proposed.

• Transactions of Materials Processing
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• v.5 no.4
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• pp.297-304
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• 1996

A process model is formulated considering the effect of crystallographic texture developed in forming process. The deformation induced plastic anisotropy can be predicted by capturing the evolution of texture during large deformation in the polycrystalline aggregate. The anisotropic stiffness matrix for the aggregate is derived and implemented in Eulerian finite element code using a Consistent Penalty method. As an application the evolution of texture in rolling drawing and extrusion processes are simulated. The numerical results show good agreements with report-ed experimental textures.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.4
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• pp.169-176
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• 2018

Removal of angular deformation induced during the welding of butt joints in thick steel plates needs expert skill and is costly. To reduce deformation, proper joint designs are studied with a prediction of deformation prior to welding. However, as the thickness of a plate increases, a predictive analysis of the welding process is more difficult, especially if there is an increase in the number of welding passes in the joint. In this study, a numerical model with the finite element method (FEM) was developed to analyze the angular deformation in the multi-pass welding of butt joints of plates made of AH32 steel that had a thickness of up to 100 mm. A series of numerical simulations were then performed based on the developed model to predict the deformations for thick plates. With the results obtained by the analyses, this study suggested optimal X-shape grooves for the butt joints of thick plates to minimize the angular deformation. As the thickness of the plate increased to 100 mm, the ratio of the depth of the front-side groove to that of the back-side groove should be gradually increased to nearly 1:3.

• Geomechanics and Engineering
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• v.11 no.1
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• pp.117-139
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• 2016

Previous studies for soil movements induced by tunneling have primarily focused on the free soil displacements. However, the stiffness of existing structures is expected to alter tunneling-induced ground movements, the sheltering influences for underground structures should be included. Furthermore, minimal attention has been given to the settings for the shield machine's operation parameters during the process of tunnels crossing above and below existing tunnels. Based on the Shanghai railway project, the soil movements induced by an earth pressure balance (EPB) shield considering the sheltering effects of existing tunnels are presented by the simplified theoretical method, the three-dimensional finite element (3D FE) simulation method, and the in-situ monitoring method. The deformation prediction of existing tunnels during complex traversing process is also presented. In addition, the deformation controlling safety measurements are carried out simultaneously to obtain the settings for the shield propulsion parameters, including earth pressure for cutting open, synchronized grouting, propulsion speed, and cutter head torque. It appears that the sheltering effects of underground structures have a great influence on ground movements caused by tunneling. The error obtained by the previous simplified methods based on the free soil displacements cannot be dismissed when encountering many existing structures.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.7
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• pp.948-954
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• 2004

Induction heating is a process that is accompanied with magnetic and thermal situation. When the high-frequency current flows in the coil, induced eddy current generates heat to conductor. To simulate an induction and induction heating process, the finite element analysis program was developed. A coupling method between the magnetic and thermal routines was developed. In the process of magnetic analysis and thermal analysis, magnetic material properties and thermal material properties depending on temperature are taken into consideration. In this paper, to predict the angular deformation, temperature difference and the shape of heat affected zone were discussed. Also appropriate coil shape and other process variables for maximum angular deformation were proposed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.287-290
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• 2005

The shearing and punching processes are analyzed with the finite element method using an isotropic material model. The experimental result in the punching process shows that final radiuses of sheet metal according to the rolling direction and transverse direction are different because of the material anisotropy. The material anisotropy is induced by complicated large deformation in the polycrystalline aggregate. The contact region between the punch and sheet metal experiences severe deformation such as shear, compression and tension in the punching process. In this paper, the analysis of punching process for Al 1100 is performed with the ABAQUS Standard. The analysis of texture development and evolution is carried out based on the deformation history in the punching process. The deformation histories are extracted by UMAT in the ABAQUS Standard. The torture development is investigated with the pole figure and yield surface during the punching process.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.34-37
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• 2003

Cold forging has several advantages as compared with conventional forming by cutting process. In this study, the elastic deformations of straight bevel gear and die induced by cold forging process are investigated to use 3D-Scanner. So we could estimate the total elastic deformation as comparing between forged bevel gears and die. And finite element analysis has been performed to predict the elastic deformation, each of cold forged bevel gear and die. The predicted values are compared with the experimental values and as a result they are well agreed with experimental data.