• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.50-53
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• 2023

In this study, the photolithography process was chosen to reduce the aspect ratio of the cross-section of a high-temperature superconducting (HTS) tape by dividing the superconducting layer of the tape. Reducing the aspect ratio decreases the magnetization losses in the second-generation HTS tapes generated by AC magnetic fields. The HTS tape used in the experiment has a thin silver (Ag) layer of about 2 ㎛ on top of the REBCO superconducting layer and no additional stabilizer layer. A dry film resist (DFR) was laminated on top of the HTS tape by a lamination method for the segmentation. Exposure to a 395 nm UV lamp on a patterned mask cures the DFR. Dipping with a 1% Na₂CO₃ solution was followed to develop the uncured film side and to obtain the required pattern. The silver and superconducting layers of the REBCO films were cleaned with an acid solution after the etching. Finally, the segmented HTS tape was completed by stripping the DFR film with acetone.

• Journal of the Korean Magnetics Society
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• v.6 no.4
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• pp.251-257
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• 1996

A coercivity of barium ferrite (BaM) tape was found to be higher than the coercivity of BaM powder, This difference is in the range of 50 Oe to 600 Oe, which depends on substituted cations. physical properties of powder, and preparation conditions of the tape. The coercivity difference is attributed to both particle stacking and adsorption of organic solvent on particle surface. Regardless of substituted cations, the coercivity of longitudinally oriented BaFe tape was higher than that of BaM powder by a range of 100 Oe to 120 Oe, which is caused by particle stacking' During the active adsorption process on preparation of magnetic paint, where MEK (methyl ethyl ketone), TOL (toluene) and CHO (cyclohexanone) were used, chemisorption of solvents on the surface of substituted BaFe particle occurred to form polymeric compounds surrounding the particle. An increase in coercivity, caused by the solvent adsorption, was significant for Co-substutited BaM tape. Among these solvents CHO was the most effective one in increasing the coercivity of the Co-Ti substituted BaM tape.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Physical Therapy Korea
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• v.20 no.3
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• pp.74-80
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• 2013

The purpose of this study was to determine the reliability of distance measurements from the medial border of the scapula to the spinous process of the thoracic vertebrae when obtained using tape and photography measurements. The study included 20 healthy subjects (10 males, 10 females); for a total of 40 scapula measurements. The distance measurements made using tape or photography methods were conducted with the subject in a standing position. Repeated tape and photography measurements were conducted in two sessions on different days by two examiners to assess the inter-rater and intra-rater reliability of the two methods. The reliability of scapular distance measured using tape and photography methods was tested using intraclass correlation coefficients (ICC(3,1)) and the standard error of measurement (SEM). The inter-rater reliability of the tape measurement method was excellent (ICC=.77) and the intra-rater reliability was fair to good (ICC=.74). The inter-rater and intra-rater reliabilities of the photography measurement method were excellent (ICC=.76 and .76 respectively). Our results suggest that photography measurement is an objective and qualitative measurement tool for scapular distance measurements.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.5 s.182
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• pp.177-183
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• 2006

A tape feeder is an important feeding device to supply micro-chips such as 1005 and 0603 components to PCB in SMT process. Traditionally, tape feeding methods using sprocket wheel mechanism has been used for the pickup system of chip-mounters. However, there is growing needs for new feeding mechanism with high accuracy and confidence as electric components are getting much smaller. Thus, recently, a tape feeder using cam-slider mechanism is developed to meet such requirements. The major advantages of developed system are; significantly reduced indexing and backlash errors, slim and compact design, and improved repetitive capacity compared to existing system. In this paper, the performance evaluation criteria for the developed tape feeder are suggested. Stability against induced vibration, positioning accuracy, cycle time, durability and supply error rate are estimated using developed self testers. As a result, the excellence of developed tape feeding mechanism is validated using the effective rating methods.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.111-113
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• 2002

We jointed BSCCO multi-filament tapes and evaluated their electrical properties. In the process, two superconductive-joint methods were used; the two multi-filament tapes were directly connected each other(MM joint), and were connected through the single-filament tape inserted between them(MSM joint). It was observed that critical current ratio and n value were 25-29% and 2.5-2.8 for MM jointed tape, and 34-53% and 3.7-4.2 for MSM Jointed tape, respectively. The higher electrical properties for MSM tape is considered to be due to that the presence of single core results in better interconnections of multi-filaments from the two tapes.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.784-787
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• 2003

In this study, water jet etching of aqueous green tape was attempted for processing barrier rib of plasma display panel. This process combines 1) chemical etching between water and aqueous based binder in the tape and 2) mechanical erosion by water jet. Effects of etching parameters such as pressure, temperature and aqueous binder content on the morphology of barrier ribs formed were investigated. The results demonstrated a possibility of processing barrier ribs by water jet etching.

• Journal of the Korean Ceramic Society
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• v.35 no.2
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• pp.137-144
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• 1998

High-temperature superconducting joints between 61 filaments of Bi-2223 tapes were fabricated by chem-ical corrosion and repeated thermomechanical process. The silver sheath of the superconducting tape was chemically removed using chemical etchant(NH4OH:H2O2=1:1) from one side of each tape without altering the form of lap joint. The joined region was formed by uniaxial pressing and a series of thermomechanical process and then subjected to properties measurement and microstructural analysis. The critical current(Ic) variation and I-V characteristics along the joint were mesured with several configuration of proble points. Ic value of the transition region of the joint inthe multifilament tape which limit the total current carring capacity of the superconducting tape was higher than that of monofilament tape. But the transition ex-ponent n-value of the multi-filament tape was lower than that of monofilament wire due to the interaction of the individual superconducting core of the multi-filament. The critical current through the joint area was improved by respeated press and reaction annealing treatment.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.3
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• pp.17-21
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• 2004

Tape-wrapped structures have been generally used in nozzle parts of guided missiles. A continuous band of woven composite material is wrapped around a mandrel that is designed to produce real products. After going through a vacuum bagging process, this woven composite material is cured in a high-pressure autoclave or hydroclave. However, tape-wrapped structures are difficult to analyze because of its large thickness and inclined lay-up. The present study investigates the method of analysis and failure prediction of tape-wrapped structures. The four-point bending test and its finite element analysis were performed to study how to model tape-wrapped structures and investigate their failure characteristics.