• Journal of information and communication convergence engineering
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• v.1 no.2
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• pp.63-66
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• 2003

High $T_c$ superconducting lines will be applied as key materials in the areas of power transmission line; magnetic levitation of vehicle; magnetic separation; magnetic energy storage and marine propulsion. A combination method of electrophoresis deposition and zone-melting for preparation of YBaCuO tape is proposed. The submicron particle powder of YBaCuO made by sol-gel method is used in the electrophoresis process. A 40∼50 ${\mu}\textrm{m}$ thickness of YBaCuO film on Ag plate could be deposited in about three minutes. After deposition the film is rolled and heat treated in order to increase the density and the adhesion of the film to the Ag plate. Silver(Ag) and lead oxide(PbO) were added in the YBaCuO powder in order to reduce its melting point. The YBaCuO coating with controlled Ag and PbO contents was preliminarily zone-melted at about $945^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.2
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• pp.81-86
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• 2015

This study investigated electromagnetic interference (EMI) shielding effectiveness (SE) of hybrid conductive fabrics. The coaxial transmission line method was used to measure the EMI Shielding effectiveness of the conductive fabrics. We designed and constructed a measuring system, consisting of a network analyzer and a device that serves as a sample holder and at the same time as a transmission medium of incident electromagnetic waves. The measurements of SE were carried out in a frequency range from 100 MHz to 2 GHz. The results of the EMI shielding experiments showed that the maximum electromagnetic shielding effectiveness (EMSE) values of sandwich type C/A/C (carbon fiber sheet/aluminum foil tape/carbon fiber sheet) and C/Ni/C (carbon fiber sheet/magnetic shielding foil/carbon fiber sheet) samples were 55 dB and 113 dB, respectively, at a frequency of 1.9 GHz.

• Progress in Superconductivity
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• v.4 no.2
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• pp.176-179
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• 2003

A lot of efforts have been focused on the optimization of PIT parameters for Bi-2223/Ag wire. Bi-2223 superconducting wires with 55 filaments were fabricated by stacking, drawing process. Before rolling process, round wires were pre -annealed at 760 - 820 $^{\circ}C$ and low oxygen partial pressure. We confirmed that pre-annealing step was to transform Bi-2212 orthorhombic structure from Bi-2212 tetragonal structure and to reduce the formation of second phases. However Bi-2223 phases also were formed at higher than 76$0^{\circ}C$ of pre-annealing temperature. The engineering critical current densities (Je) of Bi-22231Ag tapes were sintered at low oxygen partial pressure were higher than t hat of the wires sintered at air. We could achieve 6500 A/${cm}^2$ of Je for the tape that was initially kept at slightly higher temperature than that of normal heat treatment.

• Physical Therapy Korea
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• v.14 no.4
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• pp.58-65
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• 2007

The purpose of this study was to investigate the effects of serratus anterior strengthening exercises on scapular position and Visual Analog Scale (VAS) pain measurements taken at the resting position in young adults with adducted scapular. The exercise program included stretching of the scapular retractor and strengthening of the serratus anterior muscle. We measured the distance from the midline of the thorax to the vertebral border of the scapular with a tape line (Superior Kibler), and the distance from the 7th cervical spinous process to the acromial angle with 3-dimension motion analysis system, to compare the resting scapular position before and after exercise. Fifteen subjects with adducted scapular were recruited to compare the resting scapular position and VAS. The distance from 7th cervical spine process to acromial angle of the scapular and VAS decreased significantly (p<.01) after exercise, while the distance from the midline of the thorax to vertebral border of the scapular increased (p<.05). The conclusion is that the serratus anterior exercise program altered the resting scapular position and decreased VAS.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.1 s.256
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• pp.77-88
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• 2007

Axiomatic Design has been developed as a general design framework during past two decades and TRIZ has been developed for a design tool over 50 years. Axiomatic design is quite excellent in that design should be decoupled. When a design matrix is established, the characteristics of the design are identified according to the coupling properties. If the design is coupled, a decoupling process should be found. However, axiomatic design does not specifically indicate how to decouple a coupled design. In this research, the coupling manner is classified into six patterns. Each pattern could be solved by an appropriate TRIZ module. A table, which matches the coupling pattern and a TRIZ module, is proposed for effective application of the two design theories. The decoupling ideas are proposed by using TRIZ modules. When the number of decoupled designs is more than one, the engineer should select the final idea. The proposed method is applied to practical cases such as a tape feeder and a beam adjuster of the laser marker.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.111-114
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• 2003

In order to improve the surface uniformity and the conduction properties of the fabricated YBCO thick films, a system that applies alternating field vertically to the EPD field has been developed for the first time and applied to the electrophoretic deposition process. The applied alternating electric field caused a force to be exerted on each YBCO particle and resulted in a shaking of the particle in the direction of applied electric field, accomplishing a uniform particle orientation. The usual commercial electrical power was used for the vertically applied alternating voltage and the induced electric field was 25-120 V/cm at 60Hz. The thick film fabricated by the method developed in this paper showed better surface uniformity without crack and porosity and improved film characteristics such as critical temperature ($T_{c,zero}$ : 90 K) and critical current density ($2354\;A/cm^2$). Therefore, it is expected that the shaky-aligned electrophoretic deposition method can be used to fabricate superconductor films through a simpler process and at less expense.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.04a
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• pp.185-188
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• 2007

The main objective of this research effort was to develope the performance of C/SiC composites manufactured by LSI (Liquid Silicon Infiltration) method for solid and liquid rocket propulsion system and ensure the performance analysis technique. The various carbon preform were manufactured by filament winding, tape rolling, involute layup and stack molding process. For the best performance of thermal and mechanical properties, many process conditions were tested and selected by varying preform, the content of SiC, temperature, impregnation resin and chemical vapour reaction. In conclusion, the high performance and reliability of C/SiC composite were proved for solid and liquid rocket propulsion system. And the performance analysis technique related to mathematical ablation model was originated.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.7
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• pp.481-485
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• 2003

Amorphous silicon (a-Si:H) based TFT process has been studied at the maximum temperature of 15$0^{\circ}C$ with 25${\mu}{\textrm}{m}$ thick flexible and adhesive tape type polyimide foil substrate, which has benefit on handling a rugged, flexible plastic substrate trough sticking simply it to glass. This paper summarize the process procedure of the TFT on the plastic substrate and shows its electrical characteristics in comparison with glass substrate using primarily the ON/OFF current ratio and the field effect mobility as the quality criterion. The a-SiN:H coating layer played an important role in decreasing surface roughness of plastic substrate, so leakage current of TFT was decreased and mobility was increased. The results show that high quality a-Si:H TFTs can be fabricated on the plastic substrates through coating a rough plastic surface with a-SiN:H.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• Korean Journal of Metals and Materials
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• v.48 no.2
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• pp.180-186
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• 2010

For the application of field emission display (FED), it is essential to develop a carbon nanotube (CNT) cathode with high emission current density. In this study, we developed and demonstrated a post-heat treatment (PHT) process to improve field emission properties of CNT cathodes. Since the PHT is intended to burn out organic materials covering the CNTs, the PHT was carried out by heating samples at a high temperature in an atmosphere. The PHT process is applied for samples processed by surface treatment with an adhesive tape. Compared to samples prior to the PHT, samples after the PHT at $360^{\circ}C$ showed about 17% improvement in emission current density. The major reason for the increased current density is mainly the increased aspect ratio of the CNTs because of the removal of the adhesive organic residues covering the CNTs, which were attached on the CNT surfaces during the surface treatment using the adhesive taping method.