• 제목/요약/키워드: Process tape

검색결과 319건 처리시간 0.032초

리페어 FPC 본더 개발 (Development of Repair FPC Bonder)

  • 안정우;서지원
    • 반도체디스플레이기술학회지
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    • 제4권4호
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    • pp.27-31
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    • 2005
  • This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

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Sintering of LTCC Tape on Alumina Substrates for Multilayered Structure

  • Kim, Hyo-Tae;Nam, Myung-Hwa;Chun, Byung-Joon;Kim, Jong-Hee
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.908-909
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    • 2006
  • The HTCC based multilayer structure plasma head unit have some difficulties in fabrication due to complicated post-processes, such as heat treatment at reduced atmosphere, re-bonding of each layer, and silver metallization. On the other hand, LTCC based technology provides relatively simple process for multilayer plasma unit except weak mechanical properties. To overcome this problem a combined scheme using both LTCC and HTCC technology has been developed in our group, recently. In this work, we report the structural design, materials selection, joining of LTCC with HTCC substrate, and co-firing process for the fabrication of multilayered atmospheric plasma head unit.

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M10CN 교환기의 집중과금처리방식 (CAMA) 구현 (Implementation of CAMA for M10cn switch)

  • 최윤수;김동훈;정성문;이명재
    • 전자공학회논문지S
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    • 제35S권4호
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    • pp.30-39
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    • 1998
  • Currently, LAMA(Local Automatic Message Accounting) is a billing mechanism which is being used for billing process, in which billing dat is written on MT(Magnetic Tape), collected at each regional billing center and then processed once a month. However, in order to prepare further development of telecommunication network and future new services, computerization of billing process and new daily billing processing system are urgently needed. Therefore Korea Telecom had developed a CAMA (Centralized Automatic Message Accounting) system for M10CN switch. In the CAMA system, billing data generated in switches is transfered on-line using approproate protocols and various transmission media and immediately processed. The CAMA system for M10CN switch consists of three parts such as ED (Extraction Device), TD(Transmission Device) and HC(Host Collector). The system also has redundancy to maintain continuance and confidence of system operation.

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Coated Conductor 에서의 복제방법의 가능성 (Feasibility of the replication method for coated conductors)

  • 임선미;유재은;염도준
    • 한국초전도ㆍ저온공학회논문지
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    • 제8권3호
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    • pp.27-31
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    • 2006
  • We propose a replication method to solve the problem of large percent failure in texturing processes of coated conductors. This problem is due to the individual texturing process for each coated conductor that is very long tape having no single defect spot. We tested two different methods of replication process that are based on a well-textured Ni template. First method has structure of Ni/BaO/STO/$CeO_2$/SmBCO/Ag. So BaO layer is dissolved in water that we can separate STO/$CeO_2$/SmBCO/Ag layers. In this processing, the property of STO is conserved but the superconductivity of SmBCO is deteriorated. So we can consider another method. Second method has structure of template(STO)/BaO/STO/Pt/STO. After dissolving BaO then we deposited YBCO. The result of these experiments showed the feasibility of replication.

열 공압 방식을 이용한 다이 이젝터의 개발 (Development of a Die Ejector Using Thermopneumatic System)

  • 윤정환;정안목;이학준
    • 반도체디스플레이기술학회지
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    • 제22권3호
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    • pp.1-7
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    • 2023
  • Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

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A study on design process of HTS bulk magnet synchronous motors

  • Jaheum Koo;JuKyung Cha;Jonghoon Yoon;Seungyong Hahn
    • 한국초전도ㆍ저온공학회논문지
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    • 제26권1호
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    • pp.1-4
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    • 2024
  • This study explores the use of a bulk type high-temperature superconductors (HTS) as trapped field magnets in synchronous motors. A HTS bulk is examined for its ability to generate powerful magnetic fields over a permanent magnet and to eliminate the need for a direct power supply connection compared to a tape form of HTS. A 150 kW interior-mounted bulk-type superconducting synchronous motor is designed and analyzed. The A-H formulation is used to numerical analysis. The results show superior electrical performance and weight reduction when comparing the designed model with the conventional permanent magnet synchronous motor of the same topology. This study presents HTS bulk synchronous motor's overall design process and highlights its potential in achieving relatively high power density than conventional permanent magnet synchronous motor.

RABiTS 위에 PLD 방법으로 증착된 YBCO 초전도 박막 선재의 제조 (Manufacturing of YBCO coated conductor deposited on RABiTS by pulsed laser deposition method)

  • 고락길;;정준기;하홍수;김호섭;송규정;박찬;문승현;유상임;김영철
    • Progress in Superconductivity
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    • 제6권1호
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    • pp.74-78
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    • 2004
  • YBCO coated conductor is one of the most promising materials as a new generations wire especially for practical power applications. In this work, $YBa_2$$Cu_3$$O_{7}$ -$\delta$/(YBCO) coated conductors (CC) were deposited by pulsed laser deposition (PLD) from buffer layers to superconducting layer on hi-axially textured metal tape. The oxide multilayer buffered substrate of architectures of $CeO_2$/$YSZ/Y_2$$O_3$ was fabricated by PLD at steady status. Then YBCO layer was deposited on RABiTS substrate by stationary and reel-to-reel (R2R) continuous process and we compared with deposition conditions of both processes. The degree of texture of each layer was investigated using X-ray diffraction including $\theta$-2$\theta$ scans, $\omega$-scans and $\Phi$-scans analysis. Their surface morphology was observed by scanning electron microscopy (SEM). The FWHM of the X-ray $\Phi$-scans and $\Phi$-scans indicated that YBCO and buffer layers closely replicate the in-plane and out-of-plane texture of metal tape. Critical current (Ic) at 77 K, self-field of 75.8 A/cm-width, critical temperature (Tc) of 85 K, and critical current density (Ic) of 3.7 MA/$\textrm{cm}^2$ were measured from coated conductor deposited by stationary process. And coated conductor deposited by R2R continuous process had Ic of 57.5 A/cm-width, Tc of 86.5 K and Jc of 2.0 MA/$\textrm{cm}^2$. The film also exhibits a homogeneous and dense surface morphology.

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혈액투석실 간호사의 실무적응과정에 대한 근거이론적 접근 (A Grounded Theory-Based Approach to Practice Adaptation Process of Hemodialysis Unit Nurses)

  • 박의정;김영혜
    • 간호행정학회지
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    • 제19권1호
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    • pp.128-134
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    • 2013
  • Purpose: The purpose of this study was to generate a grounded substantive theory for the practice adaptation process of hemodialysis unit nurses. Methods: Participants in this study were 10 nurses working in one of two hemodialysis units. Data were collected through tape recorded in-depth interviews done between December, 2011 and February, 2012. Data were analyzed using grounded theory methodology. Results: From the participants' statements, 43 concepts, 18 subcategories and 10 categories were extracted through the open cording process. The 10 categories were: "Burden", "Role conflict", "Fearful", "Conflict of emotion", "Lack systematic job training", "Lack support system", "Compassion", "Rapport created", "Sense of duty", and "Growth". The core category was discovered to be 'recognized growth'. Phenomenon was identified as 'burnout' and this series of processes was categorized as having three stages: 'conflict', 'acceptance', 'growth'. Conclusion: The results of this study provide useful information about the needs of Hemodialysis Unit Nurses during the practice adaptation process based on their stages and types of practice adaptation. Finally, this study contributes data for the development of intervention programs that support the Hemodialysis Unit Nurses' practice adaptation.

산화물 전구체 MOD공정에 의한 YBCO coated conductor제조 (Fabrication of YBCO coated conductor using oxide precursor-based MOD processing)

  • 김영국;유재무;고재웅;정국채;김영준;한봉수
    • 한국초전도ㆍ저온공학회논문지
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    • 제7권1호
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    • pp.5-8
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    • 2005
  • MOD Process using metal acetates or trifluoroacetates has been considered to be a strong candidate for a low cost fabrication process for coated conductor with high $J_e$. Recently, an economical MOI) process has been developed for coated conductor with high $J_c$ using low cost starting materials such as YBCO powders. YBCO thin films prepared by single coating on LAO substrate with this modified oxide-precursor solution gives transport $I_c$ of 100A/cm-w and the $J_c$ value of $2.9MA/cm^{2}$ (77K, Self-field). The YBCO coated conductor prepared by single coating with $CeO_2/IBAD-YSZ/SS$ tape gives transport $I_c$ of 50A/cm-w in 2cm. Characterization with XRD, SEM shows that the YBCO layers were epitaxially grown and exhibit well-developed dense micro-structures. This newly developed oxide-precursor based MOD process will provide a low cost route to coated conductor with high $J_c$.

휴대폰 글라스 보호필름 자동 박리장치 개발에 관한 연구 (A Study on the Development of an Automatic Strip Machine for Removing Mobile Phone Glass Protective Films)

  • 최왕국;허장욱;김동욱
    • 한국기계가공학회지
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    • 제15권6호
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    • pp.9-15
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    • 2016
  • Due to material-specific vulnerabilities, the surfaces of the liquid crystal glasses used in mobile phones can crack easily, with even the smallest cracks undergoing propagation. To protect the glass surfaces, films are attached to the surfaces during the mobile phone production process. However, after machining the liquid crystal, removal of the film on the liquid crystal surface using chemical and mechanical methods is required. In this research, a peeling apparatus was developed for removing the films attached to liquid crystal surfaces during the production process. Mechanical attachment and design automation through experimentation and finite element modelling were performed to confirm the validity of the design.