• Title/Summary/Keyword: Process tape

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Resistance Spot Welding Characteristics of Mg Alloy Using Process Tape (Process Tape를 사용한 마그네슘 합금의 저항 점 용접 특성)

  • Choi, Dong-Soon;Kim, Dong-Cheol;Kang, Moon-Jin
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.49-53
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    • 2013
  • Recently, studies about application of magnesium alloy sheet to automotive bodies are on the increase. For application to automotive bodies, researches about characteristics of resistance spot welding of magnesium alloy sheet are essential. Electrode life of resistance spot welding of magnesium alloy is very short due to sticking of magnesium alloy to copper alloy electrode. To increase electrode life, most effective method is inserting cover plate between electrode and magnesium sheet. But application of cover plate to actual process is difficult and decreases welding productivity. Process tape supplied automatically as cover plate can minimize lose of productivity and increase welding quality. In this study, resistance spot welding of magnesium alloy is carried out with applying process tape. Acceptable welding current region according to electrode force and welding time is determined.

Analysis of Reel Tape Packing process conditions using DOE (실험계획법을 이용한 Reel Tape Packaging 공정조건 분석)

  • Kim, Jae Kyung;Na, Seung Jun;Kwon, Jun Hwan;Jeon, Euy Sik
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.2
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    • pp.105-109
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    • 2020
  • Today's placement machines can pick and place thousands of components per hour with a very high degree of accuracy. The packaged semiconductor chips are inserted into a carrier at regular intervals, covered with a tape to protect the chips from external impact, and supplied in a roll form. These packaging processes also progress rapidly in a consistent direction, affecting the peelback strength between the cover tape and carrier depending on the main process conditions. In this paper, we analyzed the main process variables that affect peelback strength in the reel tape packaging process for packaging semiconductor chips. The main effects and interactions were analyzed. The peelback strength range required in the packaging process was set as the nominal the best characteristics, and the optimum process condition satisfying this was derived.

Preparation of PZI Tapes by Solvent Washing Dry Method (용매세척건조법에 의한 PZT 테입 제조)

  • 신효순;윤석진;김현재
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.300-303
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    • 1999
  • For the fast dry of the aqueous tape, the process which water was replaced by organic solvent was proposed. So-called, it was the solvent washing dry, Three organic solvents (methanol, ethanol, and acetone) were selected for the washing solvent. The weight loss of the washed tapes was measured to evaluate the dry rate of the tapes and dried tapes were examined the generation of the cracks with the variations of the organic solvent and the washing time. Methanol, ethanol, and acetone were all available organic solvents for this method. The tapes washed in methanol, ethanol, and acetone were dried rapidly for twenty minutes. After thirty minutes, the weight losses were not any more. The solvent of the lower surface tension can decreases the crack of dried tape. If solvent substitutes water completely, though it was fast dried, crack can be eliminated. The tape casting system was designed for the solvent washing dry and prepared. An homogeneous tape was established by continuous tape casting process.

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Development of Magentic Wedges for Inductions Motors via Tape Casting Process (Tape-Casting법을 이용한 고효율 유도 전동기용 자성웨지의 제조기술 개발)

  • Lee, Yong-Ho
    • Proceedings of the KIEE Conference
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    • 1999.11b
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    • pp.446-449
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    • 1999
  • 본 연구에서는 기존의 자성 웨지의 제조공정을 대체하여 제조 공정이 단순하고, 그의 정밀성이 우수한 tape casting-lamination법에 의한 자성 웨지의 제조 공정의 적용 가능성에 대한 연구를 수행하였다. 철 분말과 에폭시 slurry는 우수한 tape casting 특성을 보여주었으며, 이렇게 얻어진 green tape과 유리 섬유를 적층하여 자성 웨지를 얻었다. 이러한 과정을 거쳐서 얻어진 제품의 품질 특성을 평가한 결과, 기존의 제조 공정으로 얻어진 제품에 비하여 품질의 균일성이 우수하며, 제조 공정을 혁신적으로 단축하는 것이 가능한 것을 보여주고 있다.

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Development of Shading Tape for Manufacturing of Touch Panel Display with High Screen-to-Body Ratio (기기 면적 대비 높은 화면 비율을 갖는 터치 패널 디스플레이 제조를 위한 차광 테이프의 개발)

  • Kim, Ki-Chul
    • Journal of Convergence for Information Technology
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    • v.7 no.4
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    • pp.75-81
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    • 2017
  • The design trend of information technology is quickly changed with the times. The design trend of information display is a bezel-less display, recently. The bezel-less display or edge-less display is a new trend of mobile phone display. In this study, the shading tape was manufactured for assembling process of touch panel display with the high screen-to-body ratio so-called bezel-less display. The shading tape was fabricated on PET film with the UV curable acrylic pressure sensitive adhesive(PSA) by roll-to-roll process. The UV curable PSA was synthesized with the eco-friendly toluene-less manufacturing method. The adhesive power of manufactured shading tape was investigated by motorized tensile testing machine. The thixotropic, maintaining property of cutting shape, was characterized by field emission scanning electron microscope. As results, the shading tape exhibits high adhesive power and good thixotropic performance suitable for assembly process of touch panel display. The functional shading tape will be expected to improve productivity of assembly process of touch panel display.

A study of joining method of BSCCO(2223) tape (Bi-2223초전도 선재의 접합공정 연구)

  • 김정호;김태우;주진호;서수정
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 1999.02a
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    • pp.18-21
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    • 1999
  • The effects of joining process such as contact method, shape of joined area and pressure on the properties of Bi-2223 superconducting tape have been optimized. In the process tapes were etched to expose the superconductor core in the shape of 'ㅁ' and 'ㄷ'. The exposed cores of the two tapes were brought into contact, uniaxially pressed and sintered. Subsequently, the current capacity of the joined tape was measured as a function of uniaxial pressure. It was observed that the current capacity was significantly dependent on uniaxial pressure. The joined tape, fabricated with a pressure of 1,600 MPa, showed the highest value of current capacity(90%) of highest value of current capacity is resulted from improvements in core density, contacting area and grain alignment, etc. In addition the effect of processing variables on microstructural evolution and mechanical property of joined tape will be presented.

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A Study on Effect of Process Parameters and Development of Prediction Model for Prepolymer Mass Production (대용량 프리폴리머 중합공정의 영향인자 평가 및 예측모델 개발에 관한 연구)

  • Ha, Kyong-Ho;Kang, Dae-Min
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.2
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    • pp.81-88
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    • 2014
  • Synthetic products such as casting tape and splints are rapidly replacing conventional plaster casts to treat orthopedic patients. Most synthetic products are produced through a polymerization process with related chemical agents. In this study, the effect of the process parameters on the residual NCO content within a prepolymer for casting tape and the hardening temperature for casting tape were experimentally evaluated. In order to verify the effects of the process parameters, an experimental method was adopted. From an S/N ratio analysis, optimal parameter combinations were determined to produce a pre-polymer with a suitable residual NCO content and alower hardening temperature. Prediction models for the NCO content and the hardening temperature were developed and confirmed.

A Study of Joining Method of BSCCO(2223) Tape (BSCCO(2223) 초전도 선재의 접합공정 연구)

  • 김정호;김중석;김태우;지붕기;주진호;나완수
    • Progress in Superconductivity and Cryogenics
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    • v.1 no.2
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    • pp.1-7
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    • 1999
  • we evaluated the effects of joining process such as contact method. shape of joined area and pressure on the electrical and mechanical properties of Bi-2223 superconducting tape, Specifically. the current capacity of the jointed tape was measured as a function of uniaxial pressure. and the thermal shock, bonding strength and the thermal of the tape were evaluated and correlated to the microstructural evolution. It was observed that the current capacity was significanrly dependent on the uniaxial pressure The jointed tape, fabricated with a pressure of 1,000-1,600 Mpa. showed the highest value of current capacity results from improvements in core density, contacting area and grain alignment, ect. In addition, the strength of jointed tape was measured to be 86 Mpa, which is about 88% of the unjoined ape's strength. The irreversible strain($\varepsilon$irrev) for the jointed tape was measured to be 0.1%, smaller than that of unjoined tape ($\varepsilon$irrev= 0.3%). The decrease in the strength and irreversible strain for jointed tape is believed to be due to the irregular geometry/morphology of the transition area of the tape.

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Fabrication and performance of 100 m Class Bi-2223 High Temperature Superconducting Tape (100 m급 Bi-2223 고온초전도 선재 제조 및 특성)

  • 하홍수;오상수;하동우;장현만;이남진;류강식;이준석
    • Progress in Superconductivity and Cryogenics
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    • v.1 no.2
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    • pp.15-19
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    • 1999
  • For large scale applications of high temperature superconductor (HTS) such as transmission cables, motors and generators, long length of flexible HTS conductor is required. Currently, Bi-2223 HTS tape is capable of being fabricated in longer than 100 m length by industrial processes. In this study, we fabricated 100 m 19 filamentary Bi-2223 ($Bi_{1.8}Pb_{0.4}Sr_2Ca_2O_{10+x}$) HTS tape by PIT (Power in Tube) process. Critical current(IC) of this long length tape was measured 18.5 A at 77K, self field. Critical current of 100 m length tape was mainly resulted from the increase of inhomogeneity in oxide from the increase of inhomogeneity in oxide layer. Engineering critical current (Je=Ic/total tape cross-section area) that is important factor for practical applications and fabrication cost was measured 2.2 kA/cm2.

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