• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.13 no.6
• /
• pp.139-144
• /
• 2014

As a result of a mismatch of the residual stress between both sides of the silicon wafer, which warps and distorts during the patterning process. The accuracy of the warpage measurement is related to the calibration. A CCD camera was used for the calibration. Performing optimization of the error function constructed with phase values measured at each pixel on the CCD camera, the coordinates of each light source can be precisely determined. Measurement results after calibration was performed to determine the warpage of the silicon wafer demonstrate that the maximum discrepancy is $5.6{\mu}m$ with a standard deviation of $1.5{\mu}m$ in comparison with the test results obtained by using a Form TalySurf instrument.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1995.03a
• /
• pp.1-8
• /
• 1995

This paper proposed a simple method for measuring surface roughness of ground surface. utilizing non-contact in-process measuring system using the diode laser. The measurement system is consisted of a laser unit with a diode laser and a cylindrical lens a detecting unit with polygon mirror and CCD array sensor. and a signal processing unit with a computer and device. During operation, this measuring system can provide information on surface roughness in the measuring distance with a single sampling and simultanilusly monitor the state of the grind wheel. The experimental results, showed that the increase of the feed rate and the dressing speed an caused increase in the surface roughness and when the surface roughness is 4Rmax-10Rmax, the cutting speed is 1653m/min-1665m/min. the feed rate is 0.2m/min-0.9m/min, the dressing speed is 0.2mm/rev-0.4mm/rev, the stylus method and the in-process method can be obtained the same results. thus under limited working conditions. using the proposed system. the surface roughness of the ground surface during cylindrical grinding can be obtained through the in-process measurement method using the diode laser.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.12 no.2
• /
• pp.107-113
• /
• 2013

When the main spindle of high precision machine tools are run many hours, heat is generated in bearing parts of the inside of the spindle. Also, headstock is appeared distortion by inside and outside temperature difference of a machine. This paper studies method to measure behavior of machine tool about these thermal effects. In addition, it estimates measurement uncertainty factors which can be appeared in thermal effects measurement. Finding the factor of thermal affect measurement is important for estimation of measurement uncertainty. This paper measures thermal effects of high precision machine tools and evaluates the important factors of uncertainty.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.41 no.2
• /
• pp.65-73
• /
• 2018

The dynamic capabilities of sensing market signals, creating new opportunities and reconfiguring resources and capabilities to new opportunities in a rapidly changing economic environment determines the competitiveness of the enterprise to create added value and survival. This study conceptualized a two-stage performance measurement framework based on the casual model of resource (input)-process-performance (output). We have developed a 'Process capability index' that reflect the dynamic capabilities factors as a key intermediary product linking resource inputs and performance outputs in enterprise performance measurement. The process capability index consists of four elements : manpower (level of human resource), operation productivity, structure and risk management. The DEA (Data Envelopment Analysis) model was applied to the developed performance indicators to analyze the branch office performance of a telecom company. Process capability efficiency (stage 1) uses resource inputs to reach a certain level of process capabilities. In performance result efficiency (stage 2), the process capabilities are used to generate sales revenues and subscribers. The two-stage DEA model derives intermediate output values that optimize the individual stages simultaneously. Some branch offices in the telecom company have focused on process capability efficiency or some other branch offices focused on performance result efficiency. Positioning map using two-stage efficiency decomposition and benchmarking can help identify the sources of inefficiencies and visualize strategic directions for performance optimization. Applications of two-stage DEA in conjunction with the case study that are meaningfully used in performance measurement areas have been scarce. In particular, this paper has the contribution to present a new performance measurement model considering the organization theory, the dynamic capabilities.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.2
• /
• pp.51-58
• /
• 2015

In this study, we developed an automated non-contact thickness measurement machine that continuously and precisely measures the thickness and warp of a PCB product using a laser sensor. The system contains a measurement part to measure the thickness in real time automatically according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The measurement machine was utilized to evaluate the performance at each step to minimize measurement error. At the zero setting for the initial setup, the standard deviation of the 216 samples was determined to be $5.52{\mu}m$. A measurement error of 0.5mm and 1.0mm as a standard sample in the measurement accuracy assessment was found to be 2.48% and 2.28%, respectively. In the factory acceptance test, the standard deviation of 1.461mm PCB was measured as $28.99{\mu}m$, with a $C_{pk}$ of 1.2. The automatic thickness measurement machine developed in this study can contribute to productivity and quality improvement in the mass production process.

• Journal of Electrical Engineering and Technology
• /
• v.9 no.4
• /
• pp.1309-1314
• /
• 2014

The measurement of stator core loss for an induction motor at each manufacturing process is carried out in this paper. Iron loss in the stator core of induction motor changes after each manufacturing process due to the mechanical stress, which can cause the deterioration of the magnetic performances. This paper proposes a new iron loss measuring system of the stator core in an induction motor, which can be applied to the case when the distribution of magnetic flux density is not uniform along the magnetic flux path. In the system, the iron loss is calculated based on the induced voltage of the B-search coil and exciting current.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2001.04a
• /
• pp.119-124
• /
• 2001

In this study, a vision system with image processing method have been introduced to find the edge radius of curvature. It was applied to inspect the edge quality of the deburring process product with brush grinding. Size of data was found to be critical in calculating the radius of curvature. Results using laser measurement system were compared.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.4
• /
• pp.151-159
• /
• 2015

In this study, we developed an automated contact-type thickness measurement machine that continuously and precisely measures the thickness of a PCB module product using multi-LVDT sensors. The system contains a measurement part to automatically measure the thickness in real time according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The sensors were calibrated before assembly in the measuring machine, and precision and accuracy performance tests were also performed to reduce uncertainty errors in the measurement machine. In the calibration test, the precision errors of the LVDT sensor were determined to be $1-3{\mu}m$ as 0.1% at the measuring range. A measurement error of 0.8 mm and 1.0 mm thickness test standards were found to be $1{\mu}m$ and $4{\mu}m$, and the standard deviations of two 1.0 mm products were measured as $14{\mu}m$ and $8{\mu}m$, respectively. In the measurement system analysis, the accuracies of test PCB standards were found to be $2{\mu}m$ and $3{\mu}m$, respectively. From the results of gage repeatability and reproducibility (R & R) crossed, we found that the machine is suitable for the measurement and process control in the mass production line as 7.92% of total gage R & R and in seven distinct categories. The maximum operating speed was limited at 13 pcs/min, showing a value good enough to measure.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1003-1006
• /
• 2004

In this paper have developed a system for monitoring and processing the real time sensor data in remote site through network. For realizing this system, measurement equipment and protocol are used to transmit the measurement data to remote server and to process measurement data. In server part, the received data from remote site sensor is converted to text or graphic charts for user. The measurement device in sensor part receives the sensor data form sensor and store the received data to its internal memory for transmitting data to server part through Internet. Also the measurement device can receive data form server. The temperature sensor is connected to the measurement device located in laboratory and the measurement device measures temperature of laboratory which can be confirmed by user through Internet. We have developed a server programworking on the Linux to store measurement data from measurement device to server memory. The program is use for SNMP(Simple Network Management Protocol) to exchange data with measurement device. Also the program changes the measurement data into text and graphic charts for user display. The program is use apache PHP program for user display and inquiry. The real time temperature measurement system can be apply for many parts of industry and living.

• Journal of the Korea Safety Management & Science
• /
• v.11 no.2
• /
• pp.117-126
• /
• 2009

We develop methods for propagating and analyzing EPCI(Extended Process Capability Index) by using the error type that classifies into accuracy and precision. EPCI developed in this study can be applied to the three combined processes that consist of production, measurement and calibration. Little calibration work discusses while a great deal has been studied about SPC(Statistical Process Contol) and MSA(Measurement System Analysis). EPCI can be decomposed into three indexes such as PPCI(Production Process Capability Index), PPPI(Production Process Performance Index), MPCI(Measurement PCD, and CPCI(Calibration PCI). These indexs based on the type of error classification can be used with various statistical techniques and principles such as SPC control charts, ANOVA(Analysis of Variance), MSA Gage R&R, Additivity-of-Variance, and RSSM(Root Sum of Square Method). As the method proposed is simple, any engineer in charge of SPC. MSA and calibration can use efficientily in industries. Numerical examples are presentsed. We recommed that the indexes can be used in conjunction with evaluation criteria.