• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.4
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• pp.411-417
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• 2012

A Coarse-Fine Time-to-Digital Converter (TDC) using the single time amplifier is proposed. A vernier delay line is used to overcome process dependency and the 2-stage time amplifier is designed to have high resolution by increasing the gain of the time amplifier. Single time amplifier architecture reduces the silicon area of the TDC and alleviates mismatch effect between time amplifiers. The proposed TDC is implemented in $0.18{\mu}m$ CMOS process with the supply voltage of 1.8 V. The measured results show that the resolution of the TDC is 0.73 ps with 10-bit digital output, although highend process is not applied. The single time amplifier architecture reduces 13% of chip area compared to previous work. By reducing the supply voltage, the linearity of the TDC is enhanced and the resolution is decreased to 1.45 ps.

• Transactions of Materials Processing
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• v.11 no.2
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• pp.155-164
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• 2002

One of the important steps on semi-solid forming Is the reheating process of raw materials to the semi-solid state. This Process is not only necessary to achieve the required SSM billet state, but also to contro1 the microstructure of the billet. In reheating process, the globule size is determined by the holding time of last heating stage. Therefore, some experiments to investigate the relationship between the mechanical properties and the holding time in the last heating stage was performed. The alloys used in this experiment were 357, 319 and A390 alloys. The experiments of reheating were performed by using an Induction heating system with the capacity of 50kw. This paper shows the evolution of the microstructure according to the holding time of last reheating stage. Furthermore, to evaluate the effect of globule size controlled by holding time in last heating stage uniaxial tension test was performed. The strain-stress curves were plotted according to the holding time.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.530-535
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• 1999

In recently, annealing process of cold rolled sheet tend to change to continuous annealing process for improving quality, saving yield. In the meantime as demand for various kind and small lot of products has been increasing, batch annealing has been appreciated for its small restriction for the operation. So, we tested on the effect for the proper heating temperatures, heating time of cycle, cooling time and total cycle time in this annealing process of hi tensile strength steel for automobile. As a result of several investigation. we confirmed for the following characteristics; In this process, we knew that 68$0^{\circ}C$ is suitable for this heating temp. cycle heating time of 38 Hr, cooling time of 31 Hr and total cycle time of 70 Hr. Still more, we could know that it is proper for cold rolling before annealing to be managed by 7 pass because of the act on high pressure.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.45-50
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• 2007

The present study is devoted to investigate the transient flow and to estimate the filling time fur underfill process by using the numerical model established on the fluid momentum equation. For optimization of the design and selection of process parameters, this study extensively presents an estimation of the filling time in the view points of some important factors related to underfill materials and flip-chip geometry. From the results, we conclude that the filling time changes with respect to the under fill materials because of different viscosity, surface tension coefficient and contact angle. It reveals that, as the gap height increases, the filling time decreases substantially, and goes to the saturated values.

• The Journal of Industrial Distribution & Business
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• v.9 no.8
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• pp.35-40
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• 2018

Purpose - The purpose of this study is to conduct a monitoring study on the learning process of e-learning contents. This study has two research objectives. First, by conducting monitoring research on the learning process, we aim to explore the implications for content development that reflects future student needs. Second, we want to collect empirical basic data on the estimation of appropriate amount of learning. Research design, data, and methodology - This study is a case study of learner's learning process in e-learning. After completion of the study, an in-depth interview was made after conducting a test to measure the total amount of cognitive load and the level of engagement that occurred during the learning process. The tool used to measure cognitive load is NASA-TLX, a subjective cognitive load measurement method. In the monitoring process, we observe external phenomena such as page movement and mouse movement path, and identify cognitive activities such as Think-Aloud technique. Results - In the total of three research subjects, the two courses showed excess learning time compared to the learning time, and one course showed less learning time than the learning time. This gives the following implications for content development. First, it is necessary to consider the importance of selecting the target and contents level according to the level of the subject. Second, it is necessary to design the learner participation activity that meets the learning goal level and to calculate the appropriate time accordingly. Third, it is necessary to design appropriate learning support strategy according to the learning task. This should be considered in designing lessons. Fourth, it is necessary to revitalize contents design centered on learning activities such as simulation. Conclusions - The implications of the examination system are as follows. First, it can be confirmed that there is difficulty in calculating the amount of learning centered on learning time and securing objective objectivity. Second, it can be seen that there are various variables affecting the actual learning time in addition to the content amount. Third, there is a need for reviewing the system of examination of learning amount centered on 'learning time'.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.199-202
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• 1999

Many processing times for fabricating complex shaped parts by near net shape process such as thixoforming or semi-solid forming, are required due to the time for die design, induction heating and forming process. Therefore, for the thixoforming process, multi-capacity induction heating process is very important due to the reduction of the processing time and cost. It is indispensable to adopt a power-time heating pattern which manages to conciliate complete eutectic melting at the core with limited overheating at the periphery. The total reheating time is thus dependent on billet diameter; in inches$(pm20%)$. Typically, high frequency is used for the rapid reheating of the billet to the eutectic temperature range and low frequency for the remelting of the desired fraction of liquid and for the radial homogeneization of the liquid fraction. So in this study, the multi-capacity induction heating conditions of ALTHIX 86s alloy to reduce the processing time and cost would be proposed. The suitability of multi-capacity induction heating conditions would be verified through the comparison to Garat's data.

• Design & Manufacturing
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• v.16 no.1
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• pp.21-26
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• 2022

In the CNC machining process, problems such as lowering of machine operation rate, setting errors, and machining precision occur due to the increase in setting time and preparation time. These machining errors cause delays in delivery and increase in cost due to an increase in the number of mounting and dismounting of the workpiece, an increase in measurement and reprocessing time, and an increase in the finishing time in the assembly process. Therefore, in this study, by automating the setting of the work piece using OMV (On Machine Verification), which is a meteorological measurement system, the preparation time for machining the work piece and the setting accuracy were improved, the rework rate was reduced, and the mold manufacturing process was shortened. Through the advancement, standardzation, and automation of the mold part manufacturing process, we have improved productivity by minimizing low-value-added repetitive tasks. In addition, the measurement time was reduced by more than 50% and the machining measurement rate was improved by more than 20%, eliminating repetitive work for correcting machining defects, and reducing the work preparation time by more than 15% through automatic setting.

• International Journal of Quality Innovation
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• v.9 no.3
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• pp.71-91
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• 2008

The definition of cycle time is the time from the wafer start to the wafer output. It usually takes one or two months to get the product since customer decides to produce it. The cycle time is a critical factor for customer satisfaction because it represents the response time to the market. Long cycle time reflects the ineffective investment for the capital. The cycle time is very important for foundry because long cycle time will cause customer unsatisfied and the order loss. Consequently, all of the foundries put lots of human source in the cycle time improvement. Usually, we make decisions based on the experience in the cycle time management. We have no mechanism or theory for cycle time management. We do work-in-process (WIP) management based on turn rate and standard WIP (STD WIP) set by experiences. But the experience didn't mean the optimal solution, when the situation changed, the cycle time or the standard WIP will also be changed. The experience will not always be applicable. If we only have the experience and no mechanism, management will not be work out. After interview several foundry fab managers, all of the fab can't reflect the situation. That is, all of them will have an impact period after product mix or utilization varied. In this study, we want to develop a formula for standard WIP and use statistical process control (SPC) concept to set WIP upper/lower limit level. When WIP exceed the limit level, it will trigger action plans to compensate WIP Profile. If WIP Profile balances, we don't need too much WIP. So WIP level could be reduced and cycle time also could be reduced.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.721-723
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• 2005

We applied the Atmospheric Pressure Plasma (AP-plasma) to the MgO film to try to control the Aging-time on the PDP production-line. The MgO film surface and the discharge characteristics of AC-PDPs were investigated, using the plasma-treated MgO film. The Aging-time change can be achieved by treating the MgO film with plasma. This method can be adapted to the mass production-line.