• IE interfaces
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• v.25 no.1
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• pp.79-86
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• 2012

Traditional business process management systems provide verification tools of process models to deploy and automate the models. However, there are not so many studies on how to maintain systematically collaborative process models such as supply chain processes when companies are willing to change and update the collaborative process models. In this paper, we analyze change patterns of collaborative processes and declare 19 change patterns. In addition, we apply the change patterns to the process interoperability patterns in order to identify the change problems in case of independent process changes of collaborative processes. As a result, we devise an independency checking algorithm of process changes in collaborative processes.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.3 s.180
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• pp.156-162
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• 2006

Direct fabrication of nano patterns has been studied employing a nano-stereolithography (NSL) process. The needs of nano patterning techniques have been intensively increased for diverse applications for nano/micro-devices; micro-fluidic channels, micro-molds. and other novel micro-objects. For fabrication of high-aspect-ratio (HAR) patterns, a thick spin coating of SU-8 process is generally used in the conventional photolithography, however, additional processes such as pre- and post-baking processes and expansive precise photomasks are inevitably required. In this work, direct fabrication of HAR patterns with a high spatial resolution is tried employing two-photon polymerization in the NSL process. The precision and aspect ratio of patterns can be controlled using process parameters of laser power, exposure time, and numerical aperture of objective lens. It is also feasible to control the aspect ratio of patterns by truncation amounts of patterns, and a layer-by-layer piling up technique is attempted to achieve HAR patterns. Through the fabrication of several patterns using the NSL process, the possibility of effective patterning technique fer various N/MEMS applications has been demonstrated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.105-108
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• 2006

It has been issued to fabricate nano-scale patterns with large-scale in the field of digital display. Also, large-scale fabrication technology of nano pattern is very important not only for the field of digital display but also for the most of applications of the nano-scale patterns in the view of the productivity. Among the fabrication technologies, UV nano imprinting process is suitable for replicating polymeric nano-scale patterns. However, in case of conventional UV nano imprinting process using flat mold, it is not easy to replicate large areal nano patterns. Because there are several problems such as releasing, uniformity of the replica, mold fabrication and so on. In this study, to overcome the limitation of the conventional UV nano imprinting process, we proposed a continuous UV nano imprinting process using a pattern roll stamper. A pattern roll stamper that has nano-scale patterns was fabricated by attaching thin metal stamper to a roll base. A continuous UV nano imprinting system was designed and constructed. As practical examples of the process, various nano patterns with pattern size of 500, 150 and 50nm were fabricated. Finally, geometrical properties of imprinted nano patterns were measured and analyzed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.12
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• pp.1139-1143
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• 2007

A simple method for the fabrication of 3D micro-nano hybrid patterns was presented. In conventional fabrication methods of the micro-nano hybrid patterns, micro-patterns were firstly fabricated and then nano-patterns were formatted on the micro-patterns. Moreover, these micro-nano hybrid patterns could be fabricated on the flat substrate. In this paper, we suggested the fabrication method of 3D micro-nano hybrid patterns using micro-indentation on the anodized aluminum substrate. Since diameter of the hemispherical nano-pattern can be controlled by electrolyte and applied voltage in the anodizing process, we can easily fabricated nano-patterns of diameter of loom to 300nm. Nano-patterns were firstly formatted on the aluminum substrate, and then micro-patterns were fabricated by deforming the nano-patterned aluminum substrate. Hemispherical nano-patterns of diameter of 150nm were fabricated by anodizing process, and then micro-pyramid patterns of the side-length of $50{\mu}m$ were formatted on the nano-patterns using micro-indentation. Finally we successfully replicated 3D micro-nano hybrid patterns by hot-embossing process. 3D micro-nano hybrid patterns can be applied to nano-photonic device and nano-biochip application.

• Journal of Internet Computing and Services
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• v.20 no.3
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• pp.85-92
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• 2019

In this paper, we extract the quantitative relation data of activities from the workflow event log file recorded in the XES standard format and connect them to rediscover the workflow process model. Extract the workflow process patterns and proportions with the rediscovered model. There are four types of control-flow elements that should be used to extract workflow process patterns and portions with log files: linear (sequential) routing, disjunctive (selective) routing, conjunctive (parallel) routing, and iterative routing patterns. In this paper, we focus on four of the factors, disjunctive routing, and conjunctive path. A framework implemented by the authors' research group extracts and arranges the activity data from the log and converts the iteration of duplicate relationships into a quantitative value. Also, for accurate analysis, a parallel process is recorded in the log file based on execution time, and algorithms for finding and eliminating information distortion are designed and implemented. With these refined data, we rediscover the workflow process model following the relationship between the activities. This series of experiments are conducted using the Large Bank Transaction Process Model provided by 4TU and visualizes the experiment process and results.

• Culinary science and hospitality research
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• v.14 no.4
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• pp.257-268
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• 2008

The purpose of this study was to conduct factor analysis on Foodservice consumers' lifestyle patterns in dietary life, classify lifestyle patterns, and identify how lifestyle patterns influence the 5 stages of decision making process for purchase. Among 300 copies of the distributed questionnaire, 259 copies were collected for this study. It used a total of 283 copies as the effective samples for empirical analysis except 12 copies with false entries among them. For data analysis, it conducted frequency analysis, validity and reliability analysis, factor analysis, and multiple regression analysis using SPSS 12.0. As a result, Hypothesis 1 was significant while Hypothesis 2, 3, and 5 were partially significant. On the contrary, Hypothesis 4 was not significant. Therefore, lifestyle patterns had partially significant effects on decision making process for dining-out purchase. This study subdivided dining-out consumers' lifestyles which were limited to dietary life, and also subdivided decision making process for dining-out consumers' dining-out purchase into five stages. It is significant and very suggestive that this study identified what lifestyle patterns concretely had significant effects on the specific decision making stage. In the future, the researches on adolescent class and silver class should be executed continuously.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.124-131
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• 1999

Copper film, which is expected to be used as interconnection material for 1 giga DRAM integrated circuits was deposited on hole and trench patterns by Metal Organic Chemical Vapor Deposition(MOCVD) method. After a reflow process, contact and L/S patterns were filled by copper and the characteristics of the Cu reflow process were investigated. When deposited Cu films were reflowed, grain growth and agglomeration of Cu have occurred in surfaces and inner parts of patterns as well as complete filling in patterns. Also Cu thin oxide layers were formed on the surface of Cu films reflowed in $O_2$ambient. Agglomeration and oxidation of Cu had bad influence on the electrical properties of Cu films especially, therefore, their removal and prevention were studied simultaneously. As a pattern size is decreased, preferential reflow takes place inside the patterns and this makes advantages in filling patterns of deep submicron size completely. With Cu reflow process, we could fill the patterns with the size of deep sub-micron and it is expected that Cu reflow process could meet the conditions of excellent interconnection for 1 giga DRAM device when it is combined with Cu MOCVD and CMP process.

• The Journal of Society for e-Business Studies
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• v.14 no.1
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• pp.35-56
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• 2009

Many process modeling techniques, such as Petri-net, UML Activity Diagram, and EPC, are used to design process models. In this paper, we analyze ubiquitous process design based on workflow patterns. In particular, we focus on process design using active rules that have the form of Event-Condition-Action, and deal with the WS-ECA language, which was devised for ubiquitous web services coordination. We first check whether workflow patterns can be designed with ECA rules, and we then provide WS-ECA representations for ECA rules of the patterns. The contribution of this paper is that ECA rule-based process models were presented based on workflow patterns and they can be a guideline for ubiquitous process modeling.

• Journal of the Korean Society of Clothing and Textiles
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• v.37 no.3
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• pp.270-279
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• 2013

This study presents a T-shirt design process that utilizes modernized traditional patterns; in addition, it also includes various modernization techniques for Korean traditional patterns. T-shirts are a representative casual wear item worn in everyday life, especially among young people. The association of traditional elements and public goods such as T-shirts effects the diffusion of the Korean image into global society. Through the whole design process, target groups and design concepts were determined first: collegiate students as well as clean, natural, refined, simple and sporty image, respectively. Subsequently, Dokkaebi, lotus, Dangcho, dragon and Taegeuk patterns were selected as traditional pattern sources. Along with the technique of the division, transformation, and configuration of original patterns, the combining method of geometrical figures, stripe patterns, and check patterns with traditional patterns was helped create modernized traditional motives. Finally, T-shirt designs with a Korean image were developed with the harmonized deployment of modernized motives and color planning. The survey showed that designs had a clean, natural, refined, simple and sporty image that was preferred by collegiate students. This study is relevant in three aspects. First, the design process of modernization was very creative to combine traditional patterns and basic figures. Second, this study expanded the scope of traditional image design to casual wear to promote the Korean image to young people all over the world. Third, the whole design process, from planning to final product development, presented in this study is applicable to other design processes.

• Korean Journal of Metals and Materials
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• v.48 no.1
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• pp.90-100
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• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.