• Transactions of the Korean hydrogen and new energy society
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• v.31 no.1
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• pp.33-40
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• 2020

As hydrogen utilization becomes more active recently, a large amount of hydrogen should be supplied safely. Among the three supply methods, liquefied hydrogen, which is an optimal method of storage and transportation convenience and high safety, has a low temperature of -253℃, which is complicated by the liquefaction process and consumes a lot of electricity, resulting in high operating costs. In order to reduce the electrical energy required for liquefaction and to raise the efficiency, hydrogen is cooled by using a mixed refrigerant in a precooling step. The electricity required for the precooling process of the mixed refrigerant can be reduced by using the cold energy of LNG. Actually, LNG cold energy is used in refrigeration warehouse and air liquefaction separation process, and a lot of power reduction is achieved. The purpose of this study is to replace the electric power by using LNG cold energy instead of the electric air-cooler to lower the temperature of the hydrogen and refrigerant that are increased due to the compression in the hydrogen liquefaction process. The required energy was obtained by simulating mixed refrigerant (MR) hydrogen liquefaction system with LNG cold heat and electric system. In addition, the power replacement rate of the electric process were obtained with the pressure, the temperature of LNG, the rate of latent heat utilization, and the hydrogen liquefaction capacity, Therefore, optimization of the hydrogen liquefaction system using LNG cold energy was carried out.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.73-81
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• 2011

We manufactured the inkjet printing system for the application into the nano Ag finger line interconnection process in Si solar cells. The home-made inkjet printer consists of motion part for XY motion stage with optical table, head part, power and control part in the rack box with pump, and ink supply part for the connection of pump-tube-sub ink tanknozzle. The ink jet printing system has been used to conduct the interconnection process of finger lines on Si solar cell. The nano ink includes the 50 nm-diameter. Ag nano particles and the viscosity is 14.4 cP at $22^{\circ}C$. After processing of inkjet printing on the finger lines of Si solar cell, the nano particles were measured by scanning electron microscope. After the heat treatment at $850^{\circ}C$, the finger lines showed the smooth surface morphology without micropores.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.70-75
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• 2002

The penetration potential of TIG welding in one single run is limited, though the process itself generates high quality welds with good weld cosmetics. This is one of the main reasons, which has contributed to its development in high duty applications such as those encountered in aeronautical, aerospace, nuclear & power plant applications. For these applications, stainless steels, titanium k nickel based alloys are most often used. As these materials remain very sensible to weld heat input k atmospheric pollution, stringent processing conditions are imposed. For example welding of titanium alloys requires argon shielding of weld zone and for 5 mm thick plates multi-pass runs & filler additions are required. This multi-run operation not only raises the welding cost, but also increases defect risks. In recent years, extensive interest has been raised by the possibility to increase weld penetrations through flux applications & the process is designated ATIG-activated TIG, or FBTIG-flux bounded TIG. The improved welding performance of such flux assisted TIG is related to arc constriction and surface tension effects on weld pool. The research work by authors has lead to the formulation of welding fluxes for stainless steels k titanium alloys with TIG Process. These fluxes are now commercialized & some applications in industry have already been carried out. FBTIG for aluminum has been proposed with silica application for AC mode TIG welding. The paper highlights the fundamentals of flux role in TIG welding and illustrates some industrial applications.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.2
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.674-679
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• 2002

As the object of this study, a transmission system with the style of HST in combination with mechanical semi-automatic transmission for application in hydraulic wheel excavators was chosen. The dynamic characteristics of the object transmission was studied by numerical analysis of the mathematical model. The results of numerical analysis showed comparatively good agreements with experimental results, so the validity of the numerical analysis process was ascertained.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.99-101
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• 2003

This study deals with the resistance spot welding of aluminized steels. According to the test results it was clear that the weldability of aluminized steels was equivalent to or better than that of Zn coated steel. Microstructural inspection revealed that molten aluminum that was repelled from the weld during the process, piled up at the split zone. The test results also demonstrated that the weld metal of aluminized steels could hardly produce the weld crack even higher welding heat Input was applied.

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.149-151
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• 2002

In this study, a formula for thermal processing induced plate deformations, in terms of process parameters such as heat input and plate thickness, is developed analytically using an infinite laminated plate theory to consider cuboidal inclusion with an eigenstrains. When a plate has arbitrary heating lines, complex deformed shape of plate was calculated by the method estimating plate deformation proposed by this study. To make a curved surface of the ship hull, the line heating method is mainly used. Application in automatization of line heating was deliberate by using proposed method.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.1
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• pp.67-74
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• 2000

One of the important application of a contact melting process is a latent thermal energy storage owing to its high heat flux. In some previous works, the split fins have been employed in order to enhance the melting speed. In the present work, the close contact melting was experimentally investigated using an ice as specimen for both split and non-split fins. It was shown that the contact melting by split fins increases the melting rate compared to that of non-split ones.

• Journal of Powder Materials
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• v.8 no.4
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• pp.245-252
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• 2001

Recent remarkable progress in the semiconductor industry has promoted smaller size of semiconductor chips and increased amounts of heat generation. So, the demand for a substrate material to meet both the characteristics of thermal expansion coefficient and heat radiation has been on the increase. Under such conditions, tungsten(W)-copper(Cu) has been proposed as materials to meet both of the above characteristics. In the present study, the W-10wt.%Cu powders were synthesised by the mixing and hydrogen reduction of the starting mixture materials such as W-Cu, $W-CuCl_2$and $WO_3-CuCl_2$ in order to obtain the full densification. The W-10wt.%Cu produced by hydrogen reduction showed the higher interparticle friction than the simple mixed W-10wt%Cu because of the W agglomerates. In the dilatometric analysis the W-10wt.%Cu prepared from the $W-CuCl_2$was largely shrank by heating up $1400^{\circ}C$ at the constant heating rate of $5^{\circ}C$/min. The possibility of application of metal injection molding (MIM) was also investigated for mass production of the complex shaped W-Cu parts in semiconductor devices. The relationship between the temperature of molding die and the pressure of injection molding was analyzed and the heating up stage of 120-$290^{\circ}C$ in the debinding process was controlled for the most suitable MIM condition.