• Journal of the Korean Statistical Society
• /
• v.30 no.1
• /
• pp.115-125
• /
• 2001

We consider the threshold autoregressive moving average(TARMA) process and find a sufficient condition for strict stationarity of the proces. Given region for stationarity of TARMA(p,q) model is the same as that of TAR(p) model given by Chan and Tong(1985), which shows that the moving average part of TARMA(p,q) process does not affect the stationarity of the process. We find also a sufficient condition for the existence of kth moments(k$\geq$1) of the process with respect to the stationary distribution.

• International Journal of Quality Innovation
• /
• v.3 no.2
• /
• pp.74-83
• /
• 2002

Process capability indices as an important kind of indices are intended to provide single-number assessments of the inherent process capability to meet specification limits on quality characteristic(5) of interest. In this paper the condition for the application of process capability indices is analyzed. On the basis of process capability indices, dynamic process capability indices as a new kind of indices to show the current process capability are discussed and the condition for the application of dynamic process capability indices is exhibited. Comparison between process capability index and dynamic process capability index and comparison between $D_p$ and $D_pk$ are made and the conclusions provide the approach for process control. According to the requirement of process capability indices provided by customer, quality control based on process capability indices dynamic process capability indices is discussed.

• Journal of the Korea Safety Management & Science
• /
• v.6 no.3
• /
• pp.237-247
• /
• 2004

The condition of the manufacturing process in a factory should be diagnosed and maintained efficiently because any unexpected disorder in the process will be reason to decrease the efficiency of the overall system. However, if an expert experienced in this system leaves, there will be a problem for the efficient process diagnosis and maintenance, because disorder diagnosis within the process is normally dependent on the expert's experience. This paper suggests a process diagnosis using data mining based on the collected data from the coil-spring manufacturing process. The rules are generated for the relations between the attributes of the process and the output class of the product using a decision tree after selecting the effective attributes. Using the generated rules from decision tree, the condition of the current process is diagnosed and the possible maintenance actions are identified to correct any abnormal condition. Then, the appropriate maintenance action is recommended using the decision network.

• Korea-Australia Rheology Journal
• /
• v.13 no.1
• /
• pp.37-45
• /
• 2001

Numerical simulation of coextrusion process of viscoelastic fluids within a die has been carried out. In the coextrusion process velocity profile at the outflow boundary is not known a priori, which makes it difficult to impose the proper boundary condition at the outflow boundary. This difficulty has been avoided by using the open boundary condition (OBC) method. In this study, elastic viscous stress splitting (EVSS) formulation with streamline upwind (SU) method has been used in the finite element method. In order to test the validity of the OBC method, comparison between the results of fully developed condition at the outlet and those of OBC has been made for a Newtonian fluid. In the case of upper convected Maxwell (UCM) fluid, the effect of outflow boundary condition on the interface position has been investigated by using two meshes having different downstream lengths. In both cases, the results with the OBC method showed reasonable interface shape. In particular, for the UCM fluid the interface shape calculated with OBC was independent of the downstream length, while the results with the zero traction condition showed oscillation of interface position close to the outlet. Viscosity difference was found to be more important than elasticity difference in determining the final interface position. However, the overshoot of interface position near the con-fluent point increased with elasticity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1999.05a
• /
• pp.501-504
• /
• 1999

In the shallow trench isolation(STI) chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control within- wafer-non-uniformity, and the possible defects such as nitride residue and pad oxide damage. These defects after STI CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI filling and STI CMP were discussed. It is represented that the nitride residue can be occurred in the condition of high post CMP thickness and low trench depth. In addition there are remaining oxide on the moat surface after reverse moat etch. It means that reverse moat etching process can be the main source of nitride residue. Pad oxide damage can be caused by over-polishing and high trench depth.

• Journal of the Korea Safety Management & Science
• /
• v.7 no.5
• /
• pp.255-273
• /
• 2005

Overlay parameter control of the semiconductor photolithography process is researched in this paper. Overlay parameters denote the error in superposing the current pattern to the pattern previously created. The reduction of the overlay deviation is one of the key factors in improving the quality of the semiconductor products. The semiconductor process is affected by numerous environment and equipment factors. Through process condition prediction and control, the overlay inaccuracy can be reduced. Generally, three types of process condition change exist; uncontrollable white noise, slowly changing drift, and abrupt condition shift. To effectively control the aforementioned process changes, control scheme using adaptive deadband is proposed. The suggested approach and existing control method are cross evaluated through simulation.

• Current Photovoltaic Research
• /
• v.4 no.2
• /
• pp.59-63
• /
• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• Journal of the Korean Society of Industry Convergence
• /
• v.20 no.2
• /
• pp.141-148
• /
• 2017

A process comprising a hot extrusion process and a warm forging process was designed to form a T-shaped aluminum structural component with a high degree of difficulty by the plastic forming method. A circular cylindrical part was extruded with a hot extrusion process, and then an embossing part was formed with a warm forging process. The formability and the maximum load required for forming were then determined using a forming analysis program. The hot extrusion process was executed at $450^{\circ}C$ under the extrusion speed at 6 mm/s, while the warm forging process was executed at $260^{\circ}C$ under the forging speed at 150 mm/s. For both the processes, a condition by which friction would not be generated between the mold and the material was implemented. The analysis results showed that the load required for hot extrusion was 1,019 tons, while the load required for the warm forging was 534 tons. The T-shaped part was manufactured by using a 1,600 tons capacity press. The graphite lubricant was coated on the mold as well as the material. A forming experiment was performed under the same condition with the analysis condition. The measured values from the load cell were 1,210 tons in the hot extrusion process and 600 tons in the warm forging process.

• Membrane Journal
• /
• v.29 no.5
• /
• pp.276-283
• /
• 2019

In this study, The experiments of the confirmation of the fouling phenomena in CDI process and the establishment of its removal process conditions were carried out. The foulant concentrations of humic acid sodium salt (HA) added to the feed solution were 5, 10, 15 mg/L, respectively. The occurrence of fouling under the certain adsorption/desorption conditions could be confirmed with an increase in adsorption and desorption concentration curve over time. Both the voltage and time in adsorption and desorption processes were changed to eliminate the fouled pollutants. Typically, the fouling removal condition was found at the adsorption condition 1.2 V/5 min and the desorption condition -3 V/2 min, respectively.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2001.05a
• /
• pp.189-192
• /
• 2001

Resin transfer molding process has been widely used in the automobile industry, because the product with large area can be manufactured easily and the cost for the manufacturing is lower than that of compression molding and hand lay up method. Since RTM process is suitable for large bus housing panels, in this work, the composite housing panel was manufactured by RTM process and the mechanical properties, surface quality and the condition of manufacturing process were studied.