• 한국정밀공학회지
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• 제11권2호
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• pp.189-196
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• 1994

Quality assurance in the process of manufacturing high strengh bolt sets used in the frictional joints of structures in one of important concern to users as well as to manufactures. In case of occurrences of either defective or low-quality products, even if they are quite rare, some systematic means of localizing the cause-characteristics and matching to corresponding production process is necessary. Control chart of torque factor is the primary indicatir in finding defectiveness of the products. Use of correlation diagrams ofnhardness of the bolt set presents in part a way of screening the cause. Retest data of the bolt set provide additional ideas of localizing the cause, for which theoretical background is presented in this regard. A process-characteristics matrix relating the causes of low quality to the corresponding process of manufacturing, which is of prime importance for the feedback control of production, is also proposed. Finally general features of control to assure quality of the set is described.

• 정보처리학회논문지D
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• 제13D권1호
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• pp.87-96
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• 2006

본 논문은 프로젝트 환경과 특성을 고려하여, 소프트웨어 개발 경로를 커스터마이징 하는 방법을 설계한 것이다. 개발 경로 선정 기준은 ISO/IEC TR 15721 Information Technology Guide for ISO/IEC 12207(Software Life Cycle Processes), ISO/IEC 15504 Information technology - Process assessment의 프로세스 내용에 기반 한 10개의 영역 특성이다. 10개의 영역 특성은 프로젝트 환경과 특성을 반영한 것이며, 프로젝트 개발 경로 선정 항목들을 정의한다. 프로젝트 환경과 특성 항목인 10개 영역 특성 항목을 이용하여 소프트웨어 개발 프로세스를 선정하는 알고리즘을 제시한다. 본 논문에서 제안한 소프트웨어 개발 경로를 커스터마이징 하는 방법을 평가하기 위하여 소프트웨어 개발 경로를 커스터마이징 하는 방법을 반영한 개발 경로 선정 시스템을 가지고 웹 기반 시스템 개발 프로젝트를 적용한다. 그러나 입증된 수작업 프로젝트 경로 프로세스와 시스템에서 출력된 프로젝트 경로 프로세스가 차이가 난다 차이가 나는 주원인은 산출물이 서로 합쳐졌거나, 명칭이 바뀌었기 때문이다. 효과로는 소프트웨어 개발 프로젝트 환경과 특성에 적합한 경로 프로세스를 용이하게 선정한다.

• 한국정밀공학회지
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• 제27권7호
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• 대한조선학회논문집
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• 제38권2호
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• pp.62-70
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• 2001

선체 외판은 복잡한 3차원 곡면 형상이며 이의 제작을 위한 곡가공은 조선에 있어서 필수적인 공정이다. 곡가공 공정은 주된 1차곡 성형을 위한 프레스 공정과 2차 이상의 나머지 곡 성형을 위한 열간가공 공정으로 이루어진다. 특히 전체 작업량의 50% 이상을 점하는 열간가공 공정은 숙련된 기능공의 작업 경험에 전적으로 의존하고 있다. 이의 자동화를 위한 많은 연구가 있었으나 최근까지의 연구는 주로 선상가열에 한정되어 있으며 삼각가열에 대한 연구는 극히 미미한 실정이다. 본 연구는 향후 삼각가열에 대한 효율적인 변형해석 기법을 개발하기 위한 기초 연구로서 삼각가열에 의한 판의 변형특성을 명확히 하는데 그 주안점을 두었다. 우선, 실제 조선소에서 현장조건 그대로 일련의 선가열 및 삼각가열 실험을 수행하여 각각의 변형특성을 비교 분석하였으며 상변태온도 이상의 고온영역을 확인함으로써 그 변형특성을 합리적으로 해명하였다. 또한, 가열시편에 대한 물리시험을 통해 현재 조선소에서 행해지는 열간가공 방법이 선각재료의 성질 변화에 미치는 영향을 검토하였다.

• 한국진공학회지
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• 제18권5호
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• pp.337-345
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• 2009

패키지 기판의 지름 $100{\mu}m$ 이하 미세 드릴 구멍의 경우 습식 디스미어 공정만으로는 구멍 내부의 스미어를 효과적으로 제거할 수 없다. 본 연구에서는 습식 디스미어 공정의 이전 단계에서 대기압 플라즈마를 처리하여 소수성의 기판 표면을 친수성으로 개질하고자 하였다. 대기압 플라즈마 공정은 리모트 DBD 방식의 전극을 이용하여 패키지 제조 공정에 적합한 인라인 형태의 장비로 구성되었다. 대기압 플라즈마를 처리한 결과 접촉각 기준으로 $71^{\circ}$의 소수성 절연 필름 표면이 $30^{\circ}$ 정도의 친수성 표면으로 개질되었다. 대기압 플라즈마 처리 유무에 따른 습식 디스미어 공정의 특성을 평가하기 위하여 절연 필름의 두께, 드릴 구멍 지름, 표면 조도의 변화를 측정하였는데, 대기압 플라즈마 처리 시 기판 전면에서 공정 특성의 균일도가 향상되는 것을 확인하였다. 또한 대기압 플라즈마 처리 유무에 따른 드릴 구멍의 SEM 사진 분석 결과 대기압 플라즈마 처리 시 구멍 내부의 스미어가 효과적으로 제거됨을 실험적으로 확인하였다.

• Design & Manufacturing
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• 제17권4호
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• pp.72-78
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• 2023

Injection molding is a process widely used in various industries because of its high production speed and ease of mass production during the plastic manufacturing process, and the product is molded by injecting molten plastic into the mold at high speed and pressure. Since process conditions such as resin and mold temperature mutually affect the process and the quality of the molded product, it is difficult to accurately predict quality through mathematical or statistical methods. Recently, studies to predict the quality of injection molded products by applying artificial neural networks, which are known to be very useful for analyzing nonlinear types of problems, are actively underway. In this study, structural optimization of neural networks was conducted by applying multi-task learning techniques according to the characteristics of the input and output parameters of the artificial neural network. A structure reflecting the characteristics of each process step was applied to the input parameters, and a structure reflecting the quality characteristics of the injection molded part was applied to the output parameters using multi-tasking learning. Building an artificial neural network to predict the three qualities (mass, diameter, height) of injection-molded product under six process conditions (melt temperature, mold temperature, injection speed, packing pressure, pacing time, cooling time) and comparing its performance with the existing neural network, we observed enhancements in prediction accuracy for mass, diameter, and height by approximately 69.38%, 24.87%, and 39.87%, respectively.

• 지식경영연구
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• 제5권2호
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• pp.53-65
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• 2004

Organizations continue to invest heavily in the acquisition of knowledge management systems (KMS). The overriding belief is that KMS-task fit will become more productive. A survey of users was conducted to better understand the factors that affect KMS-task fit to better explain KMS performance perspective on knowledge circulation process. This involves stating the research hypotheses among the following constructs: the characteristics of KMS, the fitness of task characteristics, and KMS performance. The findings indicate that the characteristics of KMS positively affect the fitness of task characteristics. The fitness of task characteristics are affecting KMS performance. The results of this study suggest that task-technology fit could be the basis for a strong diagnostic tool to evaluate whether KMS in a given organization are meeting user needs.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권10호
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• pp.451-457
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• 2003

The silicon wafer is stable status at room temperature, but it is weak at high temperatures which is necessary for it to be fabricated into a power semiconductor device. During thermal diffusion processing, a high temperature produces a variety thermal stress to the wafer, resulting in device failure mode which can cause unwanted oxide charge or some defect. This disrupts the silicon crystal structure and permanently degrades the electrical and physical characteristics of the wafer. In this paper, the electrical characteristics of a single oxide layer due to high temperature diffusion process, wafer resistivity and thickness of polyback was researched. The oxide quality was examined through capacitance-voltage characteristics, defect density and BMD(Bulk Micro Defect) density. It will describe the capacitance-voltage characteristics of the single oxide layer by semiconductor process and device simulation.

• 동력기계공학회지
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• 제18권4호
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• pp.72-77
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• 2014

The aim of this study to investigate polarization characteristics of WC-based alloy coatings fabricated by high velocity oxygen fuel(HVOF) process. The coatings were fabricated by HVOF process with WC-CrC-Ni, WC-Co-Cr, WC-Co composite powders. Corrosion tests were carried out using potentiostat/galvanostat at solution with pH 2 and pH 6. Corrosion potential(Ecorr) and corrosion current density(Icorr) could be analyzed from polarization curve. WC-Co-Cr coating showed more incorrodible characteristics than other coatings at solution pH 2. WC-CrC-Ni coating was more favorable anti-corrosion characteristics than other coatings at solution with pH 6.